KR930014857A - 본딩와이어 검사장치 및 방법 - Google Patents

본딩와이어 검사장치 및 방법 Download PDF

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Publication number
KR930014857A
KR930014857A KR1019920021628A KR920021628A KR930014857A KR 930014857 A KR930014857 A KR 930014857A KR 1019920021628 A KR1019920021628 A KR 1019920021628A KR 920021628 A KR920021628 A KR 920021628A KR 930014857 A KR930014857 A KR 930014857A
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South Korea
Prior art keywords
bonding wire
ball
wire inspection
inspection
optical means
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KR1019920021628A
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English (en)
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KR960006968B1 (ko
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겐지 스가하라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
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Publication of KR930014857A publication Critical patent/KR930014857A/ko
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Publication of KR960006968B1 publication Critical patent/KR960006968B1/ko

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • G01N21/84—Systems specially adapted for particular applications
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    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
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    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
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Abstract

내용 없음

Description

본딩와이어 검사장치 및 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 1실시예에 의한 본딩와이어 검사장치의 구성을 도시한 단면도.
제 2 도는 제 1 도의 대물렌즈군의 Z방향 구동구조의 사시도.
제 3 도는 제 1 도의 링형상 조명수단의 단면도.
제 4 도는 제 3 도의 링형상 조명수단의 배치 설명도.
제 5 도는 조명 전환회로의 블록도.
제 6 도는 본딩와이어 검사장치의 제어회로 블록도.
제 7 도는 본 발명의 1실시예에 의한 본딩와이어 검사방법을 도시한 설명도.
제 8 도는 제 7 도의 방법에 의하여 검출된 볼형상의 설명도.
제 9 도는 크레센트의 검사방법의 설명도.
제10도는 와이어 높이의 검사방법으로 반도체 칩에 촛점을 맞춘 설명도.
제11도는 와이어 높이의 검사방법으로 리드에 촛점을 맞춘 설명도.
제12도는 와이어 본딩된 반도체 장치의 평면도.
제13도는 제12도의 정면도.
제14도는 본딩와이어의 확대 정면 설명도.
제15도는 제14도의 평면도.
제16도는 종래의 본딩와이어 검사장치의 구성도.
제17도는 종래의 본딩와이어 검사방법의 설명도.
제18도는 제17도의 경우에 있어서의 결함을 도시한 설명도.
제19도 a,b,c는 종래의 장치 및 방법에 의하여 얻어지는 영상의 설명도.
* 도면의 주요부분에 대한 부호의 설명
1 : 반도체 칩 2 : 패드
3 : 리드프레임 4 : 리드
5,5A : 와이어 5a :볼부
6 : 시료 24 : 대물렌즈군
42 : 고배율용 결상렌즈군 44 : 고배율용 카메라
51 : 전동조리개 60 : 링상 조명수단
64 : LED 65 : 저조사각도링상 조명기

Claims (4)

  1. 반도체 칩의 패드와 리드프레임의 리드에 본딩된 와이어를 검사하는 본딩와이어 검사장치에 있어서, 다수의 LED가 링상으로 배설되고, 검사 대상물에 경사각도를 가지고 조사하는 링상 조명수단과, 이 링상 조명수단의 조명에 의한 반사광을 수광하여 볼형상의 상을 결상시키는 광학적 수단과, 이 광학적 수단으로 결상된 상을 촬영하는 카메라를 갖춘 것을 특징으로 하는 본딩와이어 검사장치.
  2. 제 1 항에 있어서, 상기 광학적 수단은 개구직경을 변화시킬 수 있는 조리개 수단을 가진 것을 특징으로 하는 와이어 검사장치.
  3. 반도체 칩의 패드와 리드프레임의 리드에 본딩된 와이어를 검사하는 본딩와이어 검사방법에 있어서, 검사 대상물의 볼에 대하여 암시야 조명을 주어서 볼을 밝게 영출하여 검사하는 것을 특징으로 하는 본딩와이어 검사방법.
  4. 반도체 칩의 패드와 리드프레임의 리드에 본딩된 와이어를 검사하는 본딩와이어 검사방법에 있어서, 검사 대상물의 볼에 대하여 암시야 조명을 주어서 볼을 밝게 영출하고, 또한 검사 대상물을 결상시키는 광학적 수단의 촛점심도를 얕게하여 볼의 검사를 행하는 것을 특징으로 하는 본딩와이어 검사방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920021628A 1991-12-02 1992-11-18 본딩와이어 검사장치 및 방법 KR960006968B1 (ko)

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JP3341831A JP2981941B2 (ja) 1991-12-02 1991-12-02 ボンデイングワイヤ検査装置
JP91-341831 1991-12-02

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KR960006968B1 KR960006968B1 (ko) 1996-05-25

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JP2981941B2 (ja) 1999-11-22
US5394246A (en) 1995-02-28
JPH05160230A (ja) 1993-06-25

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