KR920008484A - 와이어 본딩 검사 장치 - Google Patents
와이어 본딩 검사 장치 Download PDFInfo
- Publication number
- KR920008484A KR920008484A KR1019910017856A KR910017856A KR920008484A KR 920008484 A KR920008484 A KR 920008484A KR 1019910017856 A KR1019910017856 A KR 1019910017856A KR 910017856 A KR910017856 A KR 910017856A KR 920008484 A KR920008484 A KR 920008484A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- imaging
- position coordinates
- image signal
- image pickup
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/58—Testing of lines, cables or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 의한 와이어 본딩 검사 장치의 구성을 도시한 블럭도,
제2도는 제1도의 장치를 이용해서 본딩 와이어를 분할해서 촬상하는 상태를 도시한 설명도,
제3도는 제1도의 장치를 이용해서 본딩 와이어를 분할 촬상하여, 하나의 절대 좌표계에 위치 좌표를 정리한 상태를 도시한 설명도.
Claims (2)
- 반도체 칩(1)과 리드(4)와의 사이에 본딩된 와이어(2)를 검사하는 와이어 본딩 검사 장치에 있어서, 상기 와이어를 광학적으로 촬상하여 전기적인 화상 신호로 변환하는 촬상수단(14), 상기 촬상 수단을 이동시키는 이동수단(15), 변환된 상기 화상신호에서 상기 와이어의 위치 좌표를 구하고, 구해진 위치 좌표를 이용해서 상기 와이어를 검사하는 검수수단(20)및 상기 촬상수단, 상기 이동수단 및 상기 검사 수단의 각각의 동작을 제어하는 제어수단(16 및 17)를 구비하고, 상기 제어수단은, 상기 촬상 수단이 1회의 촬상으로 포착되는 영역내에 상기 와이어 전체가 들어가지 않는 경우, 상기 이동수단으로 상기 촬상 수단을 이동시키고, 상기 촬상 수단이 이동할때 마다 상기 와이어를 복수회에 걸쳐서 촬상하여 상기 화상 신호로 각각 변환시키며, 상기 검사수단으로 촬상시마다 얻어진 상기 화상 신호에서 상기 위치 좌표를 각각 구해서, 구해진 위치 좌표를 하나의 좌표계로 통일한 것으로 변환시켜 상기 와이어를 검사하는 것을 특징으로 하는 와이어 본딩 검사장치.
- 제1항에 있어서, 상기 제어수단은, 상기 촬상 수단이 1회의 촬상으로 포착되는 영역내에 상기 와이어 전체가 들어가는지의 여부를 판단하는 판단부 및 상기 판단부가 상기 와이어 전체가 들어가지 않는다고 판단한 경우, 상기 이동 수단이 상기 촬상 수단을 이동시켜야 할 위치를 구하는 이동 위치 산출부를 구비하는 것을 특징으로 하는 와이어 본딩 검사장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-273771 | 1990-10-12 | ||
JP2273771A JP2851151B2 (ja) | 1990-10-12 | 1990-10-12 | ワイヤボンディング検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920008484A true KR920008484A (ko) | 1992-05-28 |
KR960001824B1 KR960001824B1 (ko) | 1996-02-05 |
Family
ID=17532355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910017856A KR960001824B1 (ko) | 1990-10-12 | 1991-10-11 | 와이어 본딩 검사 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5170062A (ko) |
EP (1) | EP0480452B1 (ko) |
JP (1) | JP2851151B2 (ko) |
KR (1) | KR960001824B1 (ko) |
DE (1) | DE69112756T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100317599B1 (ko) * | 2000-02-17 | 2001-12-24 | 서경석 | 와이어 본딩 위치 인식방법 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2913565B2 (ja) * | 1991-01-31 | 1999-06-28 | 株式会社新川 | ワイヤループ曲がり検査方法及びその装置 |
JP3105098B2 (ja) * | 1992-12-28 | 2000-10-30 | 株式会社東芝 | ボンディングワイヤのボンディング位置の検査装置 |
US5532739A (en) * | 1993-10-06 | 1996-07-02 | Cognex Corporation | Automated optical inspection apparatus |
US5640199A (en) * | 1993-10-06 | 1997-06-17 | Cognex Corporation | Automated optical inspection apparatus |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
JP2541489B2 (ja) * | 1993-12-06 | 1996-10-09 | 日本電気株式会社 | ワイヤボンディング装置 |
US5519496A (en) * | 1994-01-07 | 1996-05-21 | Applied Intelligent Systems, Inc. | Illumination system and method for generating an image of an object |
US5642158A (en) * | 1994-05-02 | 1997-06-24 | Cognex Corporation | Method and apparatus to detect capillary indentations |
US6061467A (en) * | 1994-05-02 | 2000-05-09 | Cognex Corporation | Automated optical inspection apparatus using nearest neighbor interpolation |
US5581632A (en) * | 1994-05-02 | 1996-12-03 | Cognex Corporation | Method and apparatus for ball bond inspection system |
US5566877A (en) * | 1995-05-01 | 1996-10-22 | Motorola Inc. | Method for inspecting a semiconductor device |
US6035066A (en) * | 1995-06-02 | 2000-03-07 | Cognex Corporation | Boundary tracking method and apparatus to find leads |
JPH0982740A (ja) * | 1995-09-14 | 1997-03-28 | Tsukuba Seiko Kk | ボンディングワイヤ高さ測定装置 |
US6590670B1 (en) | 1997-03-13 | 2003-07-08 | Tsukuba Seiko Ltd. | Method and apparatus for measuring heights of test parts of object to be measured |
JP4530984B2 (ja) | 2005-12-28 | 2010-08-25 | 株式会社新川 | ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法 |
JP6445943B2 (ja) * | 2015-08-24 | 2018-12-26 | 東芝メモリ株式会社 | 半導体装置の測定方法 |
WO2017155470A1 (en) * | 2016-03-09 | 2017-09-14 | Agency For Science, Technology And Research | Self-determining inspection method for automated optical wire bond inspection |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4389669A (en) * | 1981-02-27 | 1983-06-21 | Ilc Data Device Corporation | Opto-video inspection system |
JPS59171129A (ja) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | 自動配線検査装置 |
DE3475106D1 (en) * | 1983-04-15 | 1988-12-15 | Hitachi Ltd | Method and apparatus for detecting defects of printed circuit patterns |
JPS62195509A (ja) * | 1986-02-24 | 1987-08-28 | Mitsubishi Electric Corp | 電子部品形状検査装置 |
US4872052A (en) * | 1986-12-03 | 1989-10-03 | View Engineering, Inc. | Semiconductor device inspection system |
JPH06101686B2 (ja) * | 1986-12-26 | 1994-12-12 | 沖電気工業株式会社 | 多数決復号化装置 |
JPH0666370B2 (ja) * | 1987-04-14 | 1994-08-24 | 株式会社東芝 | 半導体デバイス用外観検査装置 |
JP2688361B2 (ja) * | 1988-08-02 | 1997-12-10 | 正己 山川 | 光電センサ |
US5113565A (en) * | 1990-07-06 | 1992-05-19 | International Business Machines Corp. | Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames |
-
1990
- 1990-10-12 JP JP2273771A patent/JP2851151B2/ja not_active Expired - Fee Related
-
1991
- 1991-10-11 EP EP91117371A patent/EP0480452B1/en not_active Expired - Lifetime
- 1991-10-11 KR KR1019910017856A patent/KR960001824B1/ko not_active IP Right Cessation
- 1991-10-11 DE DE69112756T patent/DE69112756T2/de not_active Expired - Fee Related
- 1991-10-11 US US07/774,886 patent/US5170062A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100317599B1 (ko) * | 2000-02-17 | 2001-12-24 | 서경석 | 와이어 본딩 위치 인식방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH04148544A (ja) | 1992-05-21 |
DE69112756T2 (de) | 1996-03-21 |
EP0480452A1 (en) | 1992-04-15 |
US5170062A (en) | 1992-12-08 |
KR960001824B1 (ko) | 1996-02-05 |
DE69112756D1 (de) | 1995-10-12 |
JP2851151B2 (ja) | 1999-01-27 |
EP0480452B1 (en) | 1995-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920008484A (ko) | 와이어 본딩 검사 장치 | |
KR930005496B1 (ko) | 와이어본딩 검사장치 | |
KR950021294A (ko) | 와이어 본딩 장치 | |
KR920009199A (ko) | 초점 정합 및 화상처리 기능을 갖는 비디오 카메라 | |
JPS5598842A (en) | Position detection system | |
KR930014868A (ko) | 본딩와이어 검사방법 | |
KR960012393A (ko) | 본딩 와이어 검사방법 | |
JPH04255077A (ja) | 像分析方法 | |
KR100186239B1 (ko) | 와이어 굽힘 검사방법 및 장치 | |
KR960012392A (ko) | 본딩와이어 높이 검사방법 | |
JPH02247510A (ja) | 外観検査装置 | |
JPH10141925A (ja) | 外観検査装置 | |
JPH04315905A (ja) | 物体検査装置 | |
JPS58125837A (ja) | 自動ダイボンダのペレツト位置決め装置 | |
JP3016273B2 (ja) | ボンディング検査装置 | |
KR920018574A (ko) | 와이어 본딩장치의 본딩좌표데이타 입력방법 및 장치 | |
JPH0576185B2 (ko) | ||
JPH053230A (ja) | ウエーハプローバ | |
JPH0133939B2 (ko) | ||
JPS6227933Y2 (ko) | ||
KR20100013874A (ko) | 이미지 중첩 장치 및 방법 | |
JPH06102024A (ja) | ワイヤ検査装置及び検査方法 | |
JPH0487409U (ko) | ||
JPS575342A (en) | Pattern center position recognition system | |
JPH0555292A (ja) | ワイヤボンデイング装置におけるリード位置の認識装置,およびその認識方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030130 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |