KR890012372A - 와이어본딩장치 - Google Patents
와이어본딩장치 Download PDFInfo
- Publication number
- KR890012372A KR890012372A KR1019890000269A KR890000269A KR890012372A KR 890012372 A KR890012372 A KR 890012372A KR 1019890000269 A KR1019890000269 A KR 1019890000269A KR 890000269 A KR890000269 A KR 890000269A KR 890012372 A KR890012372 A KR 890012372A
- Authority
- KR
- South Korea
- Prior art keywords
- bonded
- wire bonding
- optical
- transparent body
- itv camera
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 나타낸 와이어본딩장치의 개략 구성도.
제2도는 본 발명의 다른 실시예를 나타낸 와이어본딩장치의 개략구성도.
Claims (1)
- 피본딩체(1)를 고착시키는 스테이지(3)와, 이 스테이지(3)아래쪽에 설치된 가열용히터(5), 본딩수단(13) 및, 상기 피본딩체(1)의 위쪽에 설치된 ITV카메라(6)가 구비되어, 이 ITV카메라(6)로 상기 피본딩체(1)의 위치정보를 얻어. 이 위치정보를 기초로 하여 상기 본딩수단(13)이 소정의 본딩동작을 하도록 된 와이어본딩장치에 있어서, 상기 ITV카메라(6)의 대물렌즈(9)와 상기 피본딩체(1)간의 광학공간에 열차단성이 있는 광학적투명체(20)를 삽입해서, 이 광학적투명체(20)로 상기 대물렌즈(9)와 상기 광학적투명체(20)간의 거리(B)가 상기 광학적투명체(20)와 상기 피본딩체(1)간의 거리(A)보다도 크게 되도록 상기 광학공간을 분할한 것을 특징으로 하는 와이어본딩장치.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-4261 | 1987-01-12 | ||
JP63004261A JPH01181539A (ja) | 1988-01-12 | 1988-01-12 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890012372A true KR890012372A (ko) | 1989-08-26 |
KR910007507B1 KR910007507B1 (ko) | 1991-09-26 |
Family
ID=11579599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890000269A KR910007507B1 (ko) | 1987-01-12 | 1989-01-12 | 와이어본딩장치 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH01181539A (ko) |
KR (1) | KR910007507B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7045803B2 (en) * | 2003-07-11 | 2006-05-16 | Asm Assembly Automation Ltd. | Missing die detection |
JP6604932B2 (ja) * | 2016-11-29 | 2019-11-13 | 三菱電機株式会社 | 半導体製造装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59136940A (ja) * | 1983-01-27 | 1984-08-06 | Fujitsu Ltd | 撮像光学系を有する認識装置 |
-
1988
- 1988-01-12 JP JP63004261A patent/JPH01181539A/ja active Granted
-
1989
- 1989-01-12 KR KR1019890000269A patent/KR910007507B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH01181539A (ja) | 1989-07-19 |
KR910007507B1 (ko) | 1991-09-26 |
JPH0552061B2 (ko) | 1993-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030901 Year of fee payment: 13 |
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LAPS | Lapse due to unpaid annual fee |