JPS57155743A - Inspection device for semiconductor bonding wire - Google Patents

Inspection device for semiconductor bonding wire

Info

Publication number
JPS57155743A
JPS57155743A JP56041345A JP4134581A JPS57155743A JP S57155743 A JPS57155743 A JP S57155743A JP 56041345 A JP56041345 A JP 56041345A JP 4134581 A JP4134581 A JP 4134581A JP S57155743 A JPS57155743 A JP S57155743A
Authority
JP
Japan
Prior art keywords
illuminated
inspection
wiring form
bonding wire
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56041345A
Other languages
Japanese (ja)
Other versions
JPS6341220B2 (en
Inventor
Masato Miyamura
Yushi Inagaki
Masahito Nakajima
Tetsuo Hizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56041345A priority Critical patent/JPS57155743A/en
Publication of JPS57155743A publication Critical patent/JPS57155743A/en
Publication of JPS6341220B2 publication Critical patent/JPS6341220B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To improve the reliability of inspection by a method wherein light is illuminated to a semiconductor container from the whole directions for image and the wiring form of wire bonding is inspected through a binary-coded conversion circuit, memory device, and detction circuit. CONSTITUTION:Light is illuminated to a semiconductor container 3 from the whole directions, 6, 7. The wiring form of illuminated bonding wire is seized through a microscope and a magnifying image device, for example, a CCD camera and the video signal is converted to signals 0, 1 by a binary-coded conversion circuit to consecutively store in a memory device. The wiring form of wire bonding is inspected by detection through a detection circuit 14. In this way, the reliability of inspection is improved comparing with visual inspection and automatic assembly processes are further shortened for automatization.
JP56041345A 1981-03-20 1981-03-20 Inspection device for semiconductor bonding wire Granted JPS57155743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56041345A JPS57155743A (en) 1981-03-20 1981-03-20 Inspection device for semiconductor bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56041345A JPS57155743A (en) 1981-03-20 1981-03-20 Inspection device for semiconductor bonding wire

Publications (2)

Publication Number Publication Date
JPS57155743A true JPS57155743A (en) 1982-09-25
JPS6341220B2 JPS6341220B2 (en) 1988-08-16

Family

ID=12605923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56041345A Granted JPS57155743A (en) 1981-03-20 1981-03-20 Inspection device for semiconductor bonding wire

Country Status (1)

Country Link
JP (1) JPS57155743A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989538U (en) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 pellet pick up device
JPS59119843A (en) * 1982-12-27 1984-07-11 Fujitsu Ltd Automatic wire inspecting device
JPS59171129A (en) * 1983-03-17 1984-09-27 Fujitsu Ltd Automatic wiring inspection device
JPS61265509A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd Apparatus for inspecting linear matter
JPS63144532A (en) * 1986-12-03 1988-06-16 ビユ−・エンジニアリング・インコ−ポレ−テツド Semiconductor device tester
EP0446838A2 (en) * 1990-03-12 1991-09-18 Fujitsu Limited Method of and apparatus for inspection of bonding wire
US5138180A (en) * 1989-08-18 1992-08-11 Kabushiki Kaisha Toshiba Wire bonding inspecting apparatus utilizing a controlling means for shifting from one inspected area to another

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130880A (en) * 1978-04-03 1979-10-11 Hitachi Ltd Detector for chip position on semiconductor wafer
JPS55165647A (en) * 1979-06-11 1980-12-24 Mitsubishi Electric Corp Device for automatically detecting whether wire bonding position is right or wrong

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130880A (en) * 1978-04-03 1979-10-11 Hitachi Ltd Detector for chip position on semiconductor wafer
JPS55165647A (en) * 1979-06-11 1980-12-24 Mitsubishi Electric Corp Device for automatically detecting whether wire bonding position is right or wrong

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989538U (en) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 pellet pick up device
JPS59119843A (en) * 1982-12-27 1984-07-11 Fujitsu Ltd Automatic wire inspecting device
JPH0524667B2 (en) * 1982-12-27 1993-04-08 Fujitsu Ltd
JPS59171129A (en) * 1983-03-17 1984-09-27 Fujitsu Ltd Automatic wiring inspection device
JPH0576185B2 (en) * 1983-03-17 1993-10-22 Fujitsu Ltd
JPS61265509A (en) * 1985-05-20 1986-11-25 Fujitsu Ltd Apparatus for inspecting linear matter
JPS63144532A (en) * 1986-12-03 1988-06-16 ビユ−・エンジニアリング・インコ−ポレ−テツド Semiconductor device tester
US5138180A (en) * 1989-08-18 1992-08-11 Kabushiki Kaisha Toshiba Wire bonding inspecting apparatus utilizing a controlling means for shifting from one inspected area to another
EP0446838A2 (en) * 1990-03-12 1991-09-18 Fujitsu Limited Method of and apparatus for inspection of bonding wire
EP0446838A3 (en) * 1990-03-12 1992-01-15 Fujitsu Limited Method of and apparatus for inspection of bonding wire
US5298989A (en) * 1990-03-12 1994-03-29 Fujitsu Limited Method of and apparatus for multi-image inspection of bonding wire

Also Published As

Publication number Publication date
JPS6341220B2 (en) 1988-08-16

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