DE69014013D1 - Vorrichtung zur Untersuchung des Drahtbindens. - Google Patents
Vorrichtung zur Untersuchung des Drahtbindens.Info
- Publication number
- DE69014013D1 DE69014013D1 DE69014013T DE69014013T DE69014013D1 DE 69014013 D1 DE69014013 D1 DE 69014013D1 DE 69014013 T DE69014013 T DE 69014013T DE 69014013 T DE69014013 T DE 69014013T DE 69014013 D1 DE69014013 D1 DE 69014013D1
- Authority
- DE
- Germany
- Prior art keywords
- wire binding
- examining
- examining wire
- binding
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1212172A JPH07111998B2 (ja) | 1989-08-18 | 1989-08-18 | ワイヤボンディング検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69014013D1 true DE69014013D1 (de) | 1994-12-15 |
DE69014013T2 DE69014013T2 (de) | 1995-04-20 |
Family
ID=16618100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69014013T Expired - Fee Related DE69014013T2 (de) | 1989-08-18 | 1990-08-17 | Vorrichtung zur Untersuchung des Drahtbindens. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5138180A (de) |
EP (1) | EP0413349B1 (de) |
JP (1) | JPH07111998B2 (de) |
KR (1) | KR930005496B1 (de) |
DE (1) | DE69014013T2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2913565B2 (ja) * | 1991-01-31 | 1999-06-28 | 株式会社新川 | ワイヤループ曲がり検査方法及びその装置 |
JPH0563050A (ja) * | 1991-08-29 | 1993-03-12 | Adotetsuku Eng:Kk | Icリードフレームの状態測定方法及び装置 |
JP2969401B2 (ja) * | 1991-10-29 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2969402B2 (ja) * | 1991-12-02 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2969403B2 (ja) * | 1991-12-02 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2981942B2 (ja) * | 1991-12-02 | 1999-11-22 | 株式会社新川 | ボンデイングワイヤ検査方法 |
JP2981941B2 (ja) * | 1991-12-02 | 1999-11-22 | 株式会社新川 | ボンデイングワイヤ検査装置 |
JP2990550B2 (ja) * | 1991-12-10 | 1999-12-13 | 株式会社新川 | ボンデイングワイヤ検査装置 |
US5532739A (en) * | 1993-10-06 | 1996-07-02 | Cognex Corporation | Automated optical inspection apparatus |
US5640199A (en) * | 1993-10-06 | 1997-06-17 | Cognex Corporation | Automated optical inspection apparatus |
US5548326A (en) * | 1993-10-06 | 1996-08-20 | Cognex Corporation | Efficient image registration |
US5550763A (en) * | 1994-05-02 | 1996-08-27 | Michael; David J. | Using cone shaped search models to locate ball bonds on wire bonded devices |
US5581632A (en) * | 1994-05-02 | 1996-12-03 | Cognex Corporation | Method and apparatus for ball bond inspection system |
US6061467A (en) * | 1994-05-02 | 2000-05-09 | Cognex Corporation | Automated optical inspection apparatus using nearest neighbor interpolation |
US5642158A (en) * | 1994-05-02 | 1997-06-24 | Cognex Corporation | Method and apparatus to detect capillary indentations |
JP3298753B2 (ja) * | 1994-10-14 | 2002-07-08 | 株式会社新川 | ワイヤ曲がり検査装置 |
US5566877A (en) * | 1995-05-01 | 1996-10-22 | Motorola Inc. | Method for inspecting a semiconductor device |
US6035066A (en) * | 1995-06-02 | 2000-03-07 | Cognex Corporation | Boundary tracking method and apparatus to find leads |
KR100364559B1 (ko) * | 1998-09-17 | 2002-12-12 | 주식회사 뷰웰 | 반도체 리드 검사장치 |
IL133696A (en) * | 1999-12-23 | 2006-04-10 | Orbotech Ltd | Cam reference inspection of multi-color and contour images |
KR100317599B1 (ko) * | 2000-02-17 | 2001-12-24 | 서경석 | 와이어 본딩 위치 인식방법 |
KR100460047B1 (ko) * | 2001-09-21 | 2004-12-04 | 주식회사 칩팩코리아 | 반도체패키지의 본딩검사방법 |
US7505619B2 (en) * | 2002-09-27 | 2009-03-17 | Kla-Tencor Technologies Corporation | System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface |
US9061817B2 (en) * | 2008-11-12 | 2015-06-23 | Meadwestvaco Calmar, Inc. | Spray devices and methods for using the same |
SG2013084975A (en) * | 2013-11-11 | 2015-06-29 | Saedge Vision Solutions Pte Ltd | An apparatus and method for inspecting asemiconductor package |
US10776912B2 (en) | 2016-03-09 | 2020-09-15 | Agency For Science, Technology And Research | Self-determining inspection method for automated optical wire bond inspection |
KR200491204Y1 (ko) | 2018-06-29 | 2020-03-03 | 안진상 | 차광막 |
JP7166234B2 (ja) * | 2019-09-30 | 2022-11-07 | 三菱電機株式会社 | 半導体製造検査装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4200393A (en) * | 1976-06-07 | 1980-04-29 | Tokyo Shibaura Elecric Co., Ltd. | Method of positioning a semiconductor member by examining it and a die bonding apparatus using the same |
DE2643810C2 (de) * | 1976-09-29 | 1983-08-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Einjustieren |
JPS57155743A (en) * | 1981-03-20 | 1982-09-25 | Fujitsu Ltd | Inspection device for semiconductor bonding wire |
JPS59150433A (ja) * | 1983-02-05 | 1984-08-28 | Fujitsu Ltd | ワイヤ検査装置 |
JPS59171129A (ja) * | 1983-03-17 | 1984-09-27 | Fujitsu Ltd | 自動配線検査装置 |
JPH0671039B2 (ja) * | 1984-04-26 | 1994-09-07 | 富士通株式会社 | ダイボンディング状態の検査装置 |
JPS6362242A (ja) * | 1986-09-02 | 1988-03-18 | Toshiba Corp | ワイヤボンディング装置 |
JPH0666370B2 (ja) * | 1987-04-14 | 1994-08-24 | 株式会社東芝 | 半導体デバイス用外観検査装置 |
-
1989
- 1989-08-18 JP JP1212172A patent/JPH07111998B2/ja not_active Expired - Fee Related
-
1990
- 1990-08-16 US US07/568,033 patent/US5138180A/en not_active Expired - Lifetime
- 1990-08-17 EP EP90115800A patent/EP0413349B1/de not_active Expired - Lifetime
- 1990-08-17 DE DE69014013T patent/DE69014013T2/de not_active Expired - Fee Related
- 1990-08-17 KR KR1019900012666A patent/KR930005496B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0413349B1 (de) | 1994-11-09 |
KR930005496B1 (ko) | 1993-06-22 |
JPH07111998B2 (ja) | 1995-11-29 |
EP0413349A2 (de) | 1991-02-20 |
US5138180A (en) | 1992-08-11 |
EP0413349A3 (en) | 1992-02-12 |
DE69014013T2 (de) | 1995-04-20 |
JPH0376137A (ja) | 1991-04-02 |
KR910005444A (ko) | 1991-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69014013D1 (de) | Vorrichtung zur Untersuchung des Drahtbindens. | |
DE59002121D1 (de) | Elektrisch betriebenes geraet zur mundpflege. | |
DE69022762D1 (de) | Vorrichtung zur Lärmverminderung. | |
DE69737948D1 (de) | Vorrichtung zur rekonstruktion von sehnen | |
DE59003694D1 (de) | Vorrichtung zur Infusion. | |
DE3872205D1 (de) | Vorrichtung zur untersuchung des erdbodens und der umgebenden erdformation. | |
DE3878123D1 (de) | Geraet zur augenheilkunde. | |
DE68924784D1 (de) | Vorrichtung für cervikale videoskopie. | |
DE3785379D1 (de) | Vorrichtung zur entnahme von gewebeproben. | |
DE69306071D1 (de) | Endoskopische Vorrichtung zur Herstellung von Knoten | |
ATE276866T1 (de) | Vorrichtung zur spritzenanfertigung | |
DE69027450D1 (de) | Orthodontische vorrichtung | |
DE68913392D1 (de) | Vorrichtung zur Entnahme von Kernproben. | |
DE68907766D1 (de) | Vorrichtung zur bestimmung des alkoholinhaltes. | |
DE69433302D1 (de) | Vorrichtung zur mehrfachen probenentnahme | |
DE69003571D1 (de) | Drahtzufuhrvorrichtung zur herstellung von kabelbaeumen. | |
DE69009318D1 (de) | Vorrichtung zur Extraktion von Antigenen. | |
DE68921188D1 (de) | Orthodontische Vorrichtung. | |
DE68907058D1 (de) | Vorrichtung zur beschichtung. | |
DE69105359D1 (de) | Vorrichtung zum Zuführen von Bindedraht. | |
DE69112756D1 (de) | Verfahren zur Untersuchung von Drahtverbindungen. | |
DE69021004D1 (de) | Vorrichtung zur externen Knochenfixierung. | |
DE69007708D1 (de) | Drahtverbindungsapparat. | |
DE59005960D1 (de) | Vorrichtung zur absoluten zweidimensionalen positionsmessung. | |
DE59005694D1 (de) | Bindegerät. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |