KR900017163A - 패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 - Google Patents
패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 Download PDFInfo
- Publication number
- KR900017163A KR900017163A KR1019900004673A KR900004673A KR900017163A KR 900017163 A KR900017163 A KR 900017163A KR 1019900004673 A KR1019900004673 A KR 1019900004673A KR 900004673 A KR900004673 A KR 900004673A KR 900017163 A KR900017163 A KR 900017163A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- pattern forming
- reducing agent
- organic acid
- metal salt
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000000463 material Substances 0.000 title claims 4
- BOTGCZBEERTTDQ-UHFFFAOYSA-N 4-Methoxy-1-naphthol Chemical group C1=CC=C2C(OC)=CC=C(O)C2=C1 BOTGCZBEERTTDQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 150000007524 organic acids Chemical class 0.000 claims 5
- 150000003839 salts Chemical class 0.000 claims 5
- 230000001678 irradiating effect Effects 0.000 claims 3
- 230000001603 reducing effect Effects 0.000 claims 3
- NQDSPXCXIOLFGI-UHFFFAOYSA-L copper;heptanoate Chemical compound [Cu+2].CCCCCCC([O-])=O.CCCCCCC([O-])=O NQDSPXCXIOLFGI-UHFFFAOYSA-L 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Conductive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Chemically Coating (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 a, b, c 본발명의 제 1 실시예에 있어서의 패턴형성 기판 제작방법의 공정을 표시한 단면도
제 2 도는 에너지조사의 다른 방법을 표시한 단면도
* 도면의 주요부분에 대한 부호의 설명
(3) : 기판 (8) : 감광약제막
(9) : 마스크 (10) : 광원
(11) : 노광부 (12) : 구리도체전자회로
(14) : 회로도체미형성막 (15) : 지지체
(16) : 감광환원막 (17) : 4-메톡시-1-나프톨분해부
(18) : 투명지지체
Claims (6)
- 환원되므로서 금속을 석출하는 유기산금속염과, 열을 가함으로서 환원작용을 표시하고 또한 자외선, 가시광선, 자외선의 어느 것인가가 조사되므로서 화학적으로 변화하여 환원력이 소실되는 환원제를 가진 패턴형성용 재료.
- 제 1 항에 있어서, 유기산 금속염이 n-헵탄산구리 패턴형성용 재료.
- 제 1 항에 있어서, 환원제가 4-메톡시-1-나프톨인 패턴형성용 재료.
- 청구항 1 항 기재의 유기산금속염과 청구 제 1 항 기재의 환원제를 혼합한 것을 기판위에 도포한뒤, 도포면위의 소정부에, 자외선, 가시광선, 적외선의 적어도 하나를 조사하고, 그뒤 열을 가하므로서 상기 기판위에 소정의 패턴을 형성하는 패턴형성의 제작방법.
- 지지체위에 도포된 청구 제 1 항 기재의 환원제의 소정부에 자외선, 가시광선, 적외선의 적어도 하나를 조사한뒤, 상기 환원제를 기판위에 도포된 청구 제 1 항 기재의 유기산금속염막에 접촉시키고, 그대로의 상태에서 열을 가하고, 그후 상기 지지체를 제거해서 상기 기판위에 소정의 패턴을 형성하는 패턴형성기판의 제작방법.
- 기판위에 도포된 청구 제 1 항 기재의 유기산금속염과 투명지지체위에 도포된 청구 제 1 항 기재의 환원제를 접촉시킨 상태에서 상기 지지체의 소정부에 자외선, 가시광선, 적외선의 적어도 하나를 조사한뒤, 열을 가하고, 그후 상기 투명지지체를 제거함으로서 상기 기판위에 소정의 패턴을 형성하는 패턴형성기판의 제작방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP89-86222 | 1989-04-05 | ||
JP1-86222 | 1989-04-05 | ||
JP8622289A JP2538043B2 (ja) | 1989-04-05 | 1989-04-05 | パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900017163A true KR900017163A (ko) | 1990-11-15 |
KR930002698B1 KR930002698B1 (ko) | 1993-04-07 |
Family
ID=13880757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900004673A KR930002698B1 (ko) | 1989-04-05 | 1990-04-04 | 패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5173330A (ko) |
EP (1) | EP0391314B1 (ko) |
JP (1) | JP2538043B2 (ko) |
KR (1) | KR930002698B1 (ko) |
DE (1) | DE69015857T2 (ko) |
Families Citing this family (30)
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JP3208526B2 (ja) * | 1994-08-01 | 2001-09-17 | キヤノン株式会社 | 導電性膜形成用材料、該材料を用いる導電性膜の形成方法、及び、該形成方法を用いる液晶配向膜の形成方法 |
EP0696813B1 (en) * | 1994-08-11 | 2002-10-02 | Canon Kabushiki Kaisha | Use of a solution for fabrication of electron-emitting devices and manufacture method of electron-emitting devices |
US5882722A (en) * | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
US6316100B1 (en) | 1997-02-24 | 2001-11-13 | Superior Micropowders Llc | Nickel powders, methods for producing powders and devices fabricated from same |
US6338809B1 (en) | 1997-02-24 | 2002-01-15 | Superior Micropowders Llc | Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
FR2804796B1 (fr) * | 2000-02-04 | 2004-11-19 | Gemplus Card Int | Procede pour la realisation de connexions electriques notamment pour un dispositif electronique |
US20020053397A1 (en) * | 2000-11-06 | 2002-05-09 | Dainippon Ink And Chemicals, Inc. | Method for bonding members, and disc manufacturing method and device |
JP3932805B2 (ja) * | 2000-12-25 | 2007-06-20 | 株式会社日立製作所 | フォトマスク及びそれを用いた電子デバイスの製造方法 |
KR100731945B1 (ko) * | 2000-12-28 | 2007-06-25 | 닛산 가가쿠 고교 가부시키 가이샤 | 도전성 산화 주석 막의 패터닝 방법 |
US7524528B2 (en) | 2001-10-05 | 2009-04-28 | Cabot Corporation | Precursor compositions and methods for the deposition of passive electrical components on a substrate |
US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
US7629017B2 (en) | 2001-10-05 | 2009-12-08 | Cabot Corporation | Methods for the deposition of conductive electronic features |
US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
WO2003035279A1 (en) | 2001-10-19 | 2003-05-01 | Superior Micropowders Llc | Tape compositions for the deposition of electronic features |
US7553512B2 (en) | 2001-11-02 | 2009-06-30 | Cabot Corporation | Method for fabricating an inorganic resistor |
GB0213925D0 (en) * | 2002-06-18 | 2002-07-31 | Univ Dundee | Metallisation |
US6878184B1 (en) | 2002-08-09 | 2005-04-12 | Kovio, Inc. | Nanoparticle synthesis and the formation of inks therefrom |
US7078276B1 (en) | 2003-01-08 | 2006-07-18 | Kovio, Inc. | Nanoparticles and method for making the same |
KR100934550B1 (ko) | 2003-03-04 | 2009-12-29 | 삼성전자주식회사 | 금속필름 또는 패턴 형성용 유기금속 전구체 및 이를이용한 금속 필름 또는 패턴 형성방법 |
KR100974778B1 (ko) | 2003-06-30 | 2010-08-06 | 삼성전자주식회사 | 유기금속 전구체 조성물 및 이를 이용한 금속 필름 또는패턴 형성방법 |
WO2006076610A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Controlling ink migration during the formation of printable electronic features |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
WO2006076611A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production of metal nanoparticles |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
US7533361B2 (en) | 2005-01-14 | 2009-05-12 | Cabot Corporation | System and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
US20070134902A1 (en) * | 2005-12-12 | 2007-06-14 | The Curators Of The University Of Missouri | Patterning of Substrates with Metal-Containing Particles |
US20080136861A1 (en) * | 2006-12-11 | 2008-06-12 | 3M Innovative Properties Company | Method and apparatus for printing conductive inks |
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NL273128A (ko) * | 1961-01-03 | |||
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US3369933A (en) * | 1964-01-17 | 1968-02-20 | Ashland Oil Inc | Reduction of metallic salts by amine oxide pyrolysis |
DE1590481A1 (de) * | 1965-10-15 | 1970-04-16 | Schering Ag | Verfahren zur Herstellung von gedruckten Schaltungen |
US3767414A (en) * | 1972-05-22 | 1973-10-23 | Minnesota Mining & Mfg | Thermosensitive copy sheets comprising heavy metal azolates and methods for their use |
JPS5613303B2 (ko) * | 1973-12-08 | 1981-03-27 | ||
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CA1053994A (en) * | 1974-07-03 | 1979-05-08 | Amp Incorporated | Sensitization of polyimide polymer for electroless metal deposition |
US4261800A (en) * | 1977-08-15 | 1981-04-14 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface of a substrate |
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JPS57189135A (en) * | 1981-05-19 | 1982-11-20 | Ricoh Co Ltd | Light and heat sensitve copying material |
NL8103174A (nl) * | 1981-07-02 | 1983-02-01 | Philips Nv | Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen. |
JPS60251537A (ja) * | 1984-05-25 | 1985-12-12 | Fujitsu Ltd | 光デイスク用原盤の製造方法 |
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DE3625587A1 (de) * | 1986-07-29 | 1988-02-04 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen |
DE3631011A1 (de) * | 1986-09-12 | 1988-03-24 | Bayer Ag | Flexible schaltungen |
DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
US4882200A (en) * | 1987-05-21 | 1989-11-21 | General Electric Company | Method for photopatterning metallization via UV-laser ablation of the activator |
DE3800682A1 (de) * | 1988-01-13 | 1989-07-27 | Bayer Ag | Verfahren zur herstellung von elektrischen leiterplatten |
US4960613A (en) * | 1988-10-04 | 1990-10-02 | General Electric Company | Laser interconnect process |
JPH0379100A (ja) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | 光透過ペーストおよびそれを用いた金属銅析出方法 |
US5145714A (en) * | 1990-10-30 | 1992-09-08 | Mcnc | Metal-organic chemical vapor deposition for repairing broken lines in microelectronic packages |
-
1989
- 1989-04-05 JP JP8622289A patent/JP2538043B2/ja not_active Expired - Fee Related
-
1990
- 1990-04-02 DE DE69015857T patent/DE69015857T2/de not_active Expired - Fee Related
- 1990-04-02 EP EP90106301A patent/EP0391314B1/en not_active Expired - Lifetime
- 1990-04-03 US US07/503,775 patent/US5173330A/en not_active Expired - Fee Related
- 1990-04-04 KR KR1019900004673A patent/KR930002698B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH02264254A (ja) | 1990-10-29 |
JP2538043B2 (ja) | 1996-09-25 |
KR930002698B1 (ko) | 1993-04-07 |
DE69015857D1 (de) | 1995-02-23 |
EP0391314A3 (de) | 1991-08-14 |
EP0391314A2 (en) | 1990-10-10 |
EP0391314B1 (en) | 1995-01-11 |
DE69015857T2 (de) | 1995-05-24 |
US5173330A (en) | 1992-12-22 |
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