KR900017163A - 패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 - Google Patents

패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 Download PDF

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Publication number
KR900017163A
KR900017163A KR1019900004673A KR900004673A KR900017163A KR 900017163 A KR900017163 A KR 900017163A KR 1019900004673 A KR1019900004673 A KR 1019900004673A KR 900004673 A KR900004673 A KR 900004673A KR 900017163 A KR900017163 A KR 900017163A
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KR
South Korea
Prior art keywords
substrate
pattern forming
reducing agent
organic acid
metal salt
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KR1019900004673A
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English (en)
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KR930002698B1 (ko
Inventor
다까히로 아사노
싱이찌 미즈구찌
도시오 이사가와
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR900017163A publication Critical patent/KR900017163A/ko
Application granted granted Critical
Publication of KR930002698B1 publication Critical patent/KR930002698B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)

Abstract

내용 없음.

Description

패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 a, b, c 본발명의 제 1 실시예에 있어서의 패턴형성 기판 제작방법의 공정을 표시한 단면도
제 2 도는 에너지조사의 다른 방법을 표시한 단면도
* 도면의 주요부분에 대한 부호의 설명
(3) : 기판 (8) : 감광약제막
(9) : 마스크 (10) : 광원
(11) : 노광부 (12) : 구리도체전자회로
(14) : 회로도체미형성막 (15) : 지지체
(16) : 감광환원막 (17) : 4-메톡시-1-나프톨분해부
(18) : 투명지지체

Claims (6)

  1. 환원되므로서 금속을 석출하는 유기산금속염과, 열을 가함으로서 환원작용을 표시하고 또한 자외선, 가시광선, 자외선의 어느 것인가가 조사되므로서 화학적으로 변화하여 환원력이 소실되는 환원제를 가진 패턴형성용 재료.
  2. 제 1 항에 있어서, 유기산 금속염이 n-헵탄산구리 패턴형성용 재료.
  3. 제 1 항에 있어서, 환원제가 4-메톡시-1-나프톨인 패턴형성용 재료.
  4. 청구항 1 항 기재의 유기산금속염과 청구 제 1 항 기재의 환원제를 혼합한 것을 기판위에 도포한뒤, 도포면위의 소정부에, 자외선, 가시광선, 적외선의 적어도 하나를 조사하고, 그뒤 열을 가하므로서 상기 기판위에 소정의 패턴을 형성하는 패턴형성의 제작방법.
  5. 지지체위에 도포된 청구 제 1 항 기재의 환원제의 소정부에 자외선, 가시광선, 적외선의 적어도 하나를 조사한뒤, 상기 환원제를 기판위에 도포된 청구 제 1 항 기재의 유기산금속염막에 접촉시키고, 그대로의 상태에서 열을 가하고, 그후 상기 지지체를 제거해서 상기 기판위에 소정의 패턴을 형성하는 패턴형성기판의 제작방법.
  6. 기판위에 도포된 청구 제 1 항 기재의 유기산금속염과 투명지지체위에 도포된 청구 제 1 항 기재의 환원제를 접촉시킨 상태에서 상기 지지체의 소정부에 자외선, 가시광선, 적외선의 적어도 하나를 조사한뒤, 열을 가하고, 그후 상기 투명지지체를 제거함으로서 상기 기판위에 소정의 패턴을 형성하는 패턴형성기판의 제작방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900004673A 1989-04-05 1990-04-04 패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법 KR930002698B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8622289A JP2538043B2 (ja) 1989-04-05 1989-04-05 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
JP89-86222 1989-04-05
JP1-86222 1989-04-05

Publications (2)

Publication Number Publication Date
KR900017163A true KR900017163A (ko) 1990-11-15
KR930002698B1 KR930002698B1 (ko) 1993-04-07

Family

ID=13880757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900004673A KR930002698B1 (ko) 1989-04-05 1990-04-04 패턴형성용 재료와 그것을 사용한 패턴형성기판의 제작방법

Country Status (5)

Country Link
US (1) US5173330A (ko)
EP (1) EP0391314B1 (ko)
JP (1) JP2538043B2 (ko)
KR (1) KR930002698B1 (ko)
DE (1) DE69015857T2 (ko)

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Also Published As

Publication number Publication date
EP0391314A3 (de) 1991-08-14
EP0391314A2 (en) 1990-10-10
DE69015857T2 (de) 1995-05-24
KR930002698B1 (ko) 1993-04-07
US5173330A (en) 1992-12-22
EP0391314B1 (en) 1995-01-11
JPH02264254A (ja) 1990-10-29
JP2538043B2 (ja) 1996-09-25
DE69015857D1 (de) 1995-02-23

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