FR2804796B1 - Procede pour la realisation de connexions electriques notamment pour un dispositif electronique - Google Patents
Procede pour la realisation de connexions electriques notamment pour un dispositif electroniqueInfo
- Publication number
- FR2804796B1 FR2804796B1 FR0001555A FR0001555A FR2804796B1 FR 2804796 B1 FR2804796 B1 FR 2804796B1 FR 0001555 A FR0001555 A FR 0001555A FR 0001555 A FR0001555 A FR 0001555A FR 2804796 B1 FR2804796 B1 FR 2804796B1
- Authority
- FR
- France
- Prior art keywords
- electronic device
- electrical connections
- making electrical
- making
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0001555A FR2804796B1 (fr) | 2000-02-04 | 2000-02-04 | Procede pour la realisation de connexions electriques notamment pour un dispositif electronique |
AU31974/01A AU3197401A (en) | 2000-02-04 | 2001-02-05 | Method for producing electrical connections in particular for an electronic device |
PCT/FR2001/000332 WO2001057923A1 (fr) | 2000-02-04 | 2001-02-05 | Procede pour la realisation de connexions electriques, notamment pour un dispositif electronique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0001555A FR2804796B1 (fr) | 2000-02-04 | 2000-02-04 | Procede pour la realisation de connexions electriques notamment pour un dispositif electronique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2804796A1 FR2804796A1 (fr) | 2001-08-10 |
FR2804796B1 true FR2804796B1 (fr) | 2004-11-19 |
Family
ID=8846769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0001555A Expired - Fee Related FR2804796B1 (fr) | 2000-02-04 | 2000-02-04 | Procede pour la realisation de connexions electriques notamment pour un dispositif electronique |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU3197401A (fr) |
FR (1) | FR2804796B1 (fr) |
WO (1) | WO2001057923A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2848023B1 (fr) * | 2002-11-28 | 2005-02-18 | Gemplus Card Int | Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement |
DE102007062166A1 (de) * | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Verfahren zur elektrischen Kontaktierung sowie elektronischer Schaltungsträger |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60167491A (ja) * | 1984-02-10 | 1985-08-30 | 株式会社東芝 | 導体路形成方法 |
DD301547A7 (de) * | 1987-04-09 | 1993-03-04 | Leipzig Tech Hochschule | Verfahren zur herstellung leitfaehiger strukturen in poly(organylheteroacetylenen) |
JP2676515B2 (ja) * | 1987-11-09 | 1997-11-17 | 科学技術振興事業団 | 光重合による導電性高分子のパターン形成法 |
JP2538043B2 (ja) * | 1989-04-05 | 1996-09-25 | 松下電器産業株式会社 | パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法 |
US5052102A (en) * | 1989-06-19 | 1991-10-01 | Shell Oil Company | Laser induced electrical connection of integrated circuits |
US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
US5378508A (en) * | 1992-04-01 | 1995-01-03 | Akzo Nobel N.V. | Laser direct writing |
JPH07188399A (ja) * | 1993-12-27 | 1995-07-25 | Unitika Ltd | 光照射部が導電性に変化する成形性またはフィルム形成性組成物 |
US5463242A (en) * | 1994-05-03 | 1995-10-31 | General Electric Company | Thin film circuits with high density connector |
-
2000
- 2000-02-04 FR FR0001555A patent/FR2804796B1/fr not_active Expired - Fee Related
-
2001
- 2001-02-05 AU AU31974/01A patent/AU3197401A/en not_active Abandoned
- 2001-02-05 WO PCT/FR2001/000332 patent/WO2001057923A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2804796A1 (fr) | 2001-08-10 |
WO2001057923A1 (fr) | 2001-08-09 |
AU3197401A (en) | 2001-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091030 |