FR2804796B1 - Procede pour la realisation de connexions electriques notamment pour un dispositif electronique - Google Patents

Procede pour la realisation de connexions electriques notamment pour un dispositif electronique

Info

Publication number
FR2804796B1
FR2804796B1 FR0001555A FR0001555A FR2804796B1 FR 2804796 B1 FR2804796 B1 FR 2804796B1 FR 0001555 A FR0001555 A FR 0001555A FR 0001555 A FR0001555 A FR 0001555A FR 2804796 B1 FR2804796 B1 FR 2804796B1
Authority
FR
France
Prior art keywords
electronic device
electrical connections
making electrical
making
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0001555A
Other languages
English (en)
Other versions
FR2804796A1 (fr
Inventor
Didier Elbaz
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0001555A priority Critical patent/FR2804796B1/fr
Priority to PCT/FR2001/000332 priority patent/WO2001057923A1/fr
Priority to AU31974/01A priority patent/AU3197401A/en
Publication of FR2804796A1 publication Critical patent/FR2804796A1/fr
Application granted granted Critical
Publication of FR2804796B1 publication Critical patent/FR2804796B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
FR0001555A 2000-02-04 2000-02-04 Procede pour la realisation de connexions electriques notamment pour un dispositif electronique Expired - Fee Related FR2804796B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0001555A FR2804796B1 (fr) 2000-02-04 2000-02-04 Procede pour la realisation de connexions electriques notamment pour un dispositif electronique
PCT/FR2001/000332 WO2001057923A1 (fr) 2000-02-04 2001-02-05 Procede pour la realisation de connexions electriques, notamment pour un dispositif electronique
AU31974/01A AU3197401A (en) 2000-02-04 2001-02-05 Method for producing electrical connections in particular for an electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0001555A FR2804796B1 (fr) 2000-02-04 2000-02-04 Procede pour la realisation de connexions electriques notamment pour un dispositif electronique

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FR2804796A1 FR2804796A1 (fr) 2001-08-10
FR2804796B1 true FR2804796B1 (fr) 2004-11-19

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FR2848023B1 (fr) * 2002-11-28 2005-02-18 Gemplus Card Int Isolation de puce par depot isolant dans des chemins d'individualisation partielle avant amincissement
DE102007062166A1 (de) * 2007-12-21 2009-06-25 Robert Bosch Gmbh Verfahren zur elektrischen Kontaktierung sowie elektronischer Schaltungsträger

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JPS60167491A (ja) * 1984-02-10 1985-08-30 株式会社東芝 導体路形成方法
DD301547A7 (de) * 1987-04-09 1993-03-04 Leipzig Tech Hochschule Verfahren zur herstellung leitfaehiger strukturen in poly(organylheteroacetylenen)
JP2676515B2 (ja) * 1987-11-09 1997-11-17 科学技術振興事業団 光重合による導電性高分子のパターン形成法
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法
US5052102A (en) * 1989-06-19 1991-10-01 Shell Oil Company Laser induced electrical connection of integrated circuits
US5252694A (en) * 1992-01-22 1993-10-12 Minnesota Mining And Manufacturing Company Energy-polymerization adhesive, coating, film and process for making the same
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
JPH07188399A (ja) * 1993-12-27 1995-07-25 Unitika Ltd 光照射部が導電性に変化する成形性またはフィルム形成性組成物
US5463242A (en) * 1994-05-03 1995-10-31 General Electric Company Thin film circuits with high density connector

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FR2804796A1 (fr) 2001-08-10
AU3197401A (en) 2001-08-14

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