KR890014205A - 접합 및 시일용 저독성 합금 조성물 - Google Patents

접합 및 시일용 저독성 합금 조성물 Download PDF

Info

Publication number
KR890014205A
KR890014205A KR1019890004212A KR890004212A KR890014205A KR 890014205 A KR890014205 A KR 890014205A KR 1019890004212 A KR1019890004212 A KR 1019890004212A KR 890004212 A KR890004212 A KR 890004212A KR 890014205 A KR890014205 A KR 890014205A
Authority
KR
South Korea
Prior art keywords
alloy composition
weight
alloy
composition
paste
Prior art date
Application number
KR1019890004212A
Other languages
English (en)
Inventor
케이 루이스 터커
율리시스 엠에이
Original Assignee
원본미기재
쿡손 그룹 피엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 쿡손 그룹 피엘씨 filed Critical 원본미기재
Publication of KR890014205A publication Critical patent/KR890014205A/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227Rods, wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)

Abstract

내용 없음.

Description

접합 및 시일용 저독성 합금 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

  1. 중량비로 0.08% 내지 20% 비스머스, 0.02% 내지 1.5%의 구리, 0.01% 내지 1.5%의 은, 0 내지 0.1%의 인, 희토류 혼합물(rare earth mixture)의 중량비 0 내지 0.20%, 그외에 주석 및 불순물들(incidental impurities)로 조성된 것을 특징으로 하는 접합 및 시일용 저독성 합금 조성물.
  2. 제1항에 있어서, 0.08 내지 8중량%의 비스머스를 포함하는 것을 특징으로 하는 합금 조성물.
  3. 제2항에 있어서, 비스머스 중량이 3 내지 6중량%의 비스머스를 포함하는 것을 특징으로 하는 합금 조성물.
  4. 제1 내지 3항들 중 어느 한 항에 있어서, 0.1 내지 0.7중량%의 구리를 포함하는 것을 특징으로 하는 합금 조성물.
  5. 제1 내지 3항들 중 어느 한 항에 있어서, 0.05 내지 0.5중량%의 은을 포함하는 것을 특징으로 하는 합금 조성물.
  6. 제5항에 있어서, 0.1 내지 0.4중량%의 은을 포함하는 것을 특징으로 하는 합금 조성물.
  7. 제1항 내지 6항들 중 어느 한 항에 따른 합금의 배관용 땜납으로서의 사용.
  8. 제1항 내지 6항들 중 어느 한 항의 저독성 합금 조성물로 이루어진 것을 특징으로 하는 와이어, 코일, 봉(rod) 또는 다른 형성물.
  9. 제8항에 있어서, 합금 용제(alloy flux)의 중공 코어가 배치되어 구성된 것을 특징으로 하는 와이어, 코일 봉 또는 다른 형성물.
  10. 제1항 내지 6항의 어느 한 항에 있는 합금 조성물의 입자가 점성 담체내에 분산되어 이루어진 것을 특징으로 하는 페이스트(paste).
  11. 제1항 내지 6항의 어느 한 항의 합금 조성물, 제8항 또는 9항의 와이어, 코일, 봉 또는 다른 형성물, 제10항의 페이스트등을 사용하여, 금속들을 서로 근접하게 두고, 조성물, 형성물 또는 페이스트를 접합시켜야할 최소한 하나의 금속에 접촉시키면서, 이 금속을 합금 조성물, 형성물 또는 페이스트의 용융온도 이상으로 가열시키는 것을 특징으로 하는 금속 접합 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004212A 1988-03-31 1989-03-31 접합 및 시일용 저독성 합금 조성물 KR890014205A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB888807730A GB8807730D0 (en) 1988-03-31 1988-03-31 Low toxicity soldering compositions
GB8807730.0 1988-03-31

Publications (1)

Publication Number Publication Date
KR890014205A true KR890014205A (ko) 1989-10-23

Family

ID=10634456

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004212A KR890014205A (ko) 1988-03-31 1989-03-31 접합 및 시일용 저독성 합금 조성물

Country Status (8)

Country Link
US (1) US4929423A (ko)
EP (1) EP0336575A1 (ko)
JP (1) JPH0270033A (ko)
KR (1) KR890014205A (ko)
AU (1) AU606791B2 (ko)
CA (1) CA1299470C (ko)
GB (1) GB8807730D0 (ko)
ZA (1) ZA892041B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100659890B1 (ko) * 2001-06-28 2006-12-20 센주긴조쿠고교 가부시키가이샤 무연 땜납합금

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220196A (ja) * 1990-07-19 1992-08-11 Aisin Seiki Co Ltd 亜鉛メツキ鋼板フレームの接合方法
JP2505921B2 (ja) * 1990-09-25 1996-06-12 株式会社日立製作所 半導体装置及びそれ用はんだ合金
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
ES2036452B1 (es) * 1991-06-12 1995-12-16 Electro Materiales Klk S A Metodo de conexion de cables electricos sobre superficies de acero y placa de molde-crisol para llevar a cabo dicho metodo.
US5287037A (en) * 1991-12-03 1994-02-15 General Electric Company Metal ferrules for hermetically sealing electric lamps
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5330712A (en) * 1993-04-22 1994-07-19 Federalloy, Inc. Copper-bismuth alloys
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
NL9302056A (nl) * 1993-11-26 1995-06-16 Billiton Witmetaal Kogel en het gebruik van een Sn-legering daarvoor.
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5435857A (en) * 1994-01-06 1995-07-25 Qualitek International, Inc. Soldering composition
DE19538992A1 (de) * 1995-04-28 1996-10-31 Hewlett Packard Co Wismut-Zinn-Lötmittel-Verbindungen mit verbesserten mechanischen Eigenschaften
CN1040303C (zh) * 1995-06-30 1998-10-21 三星电机株式会社 通用无铅焊料
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
US6416883B1 (en) 1997-04-22 2002-07-09 Ecosolder International Pty Ltd Lead-free solder
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP2000153388A (ja) 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3074649B1 (ja) 1999-02-23 2000-08-07 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 無鉛半田粉末、無鉛半田ペースト、およびそれらの製造方法
GB9915954D0 (en) * 1999-07-07 1999-09-08 Multicore Solders Ltd Solder alloy
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
EP1309447A4 (en) * 2000-07-31 2005-11-09 Honeywell Int Inc LEAD-FREE ALLOYS WITH IMPROVED NETWORKING BEHAVIOR
JP2002124756A (ja) * 2000-10-18 2002-04-26 Nitto Denko Corp 回路基板および回路基板の端子部の接続構造
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
US7335269B2 (en) * 2005-03-30 2008-02-26 Aoki Laboratories Ltd. Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)
CN1301179C (zh) * 2005-05-11 2007-02-21 郴州金箭焊料有限公司 无铅焊料及制造方法
CN100352596C (zh) * 2005-07-22 2007-12-05 沈阳工业大学 一种含混合稀土的无铅软钎料及其制备方法
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
US7749336B2 (en) 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
CZ2005659A3 (cs) * 2005-10-19 2007-01-10 JenĂ­k@Jan Bezolovnatá pájka
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
CA2666363C (en) 2006-10-17 2018-04-24 Fry's Metals, Inc. Materials for use with interconnects of electrical devices and related methods
JP5502732B2 (ja) 2007-07-23 2014-05-28 ヘンケル リミテッド ハンダ用フラックス
JP5230974B2 (ja) * 2007-07-25 2013-07-10 新日鉄住金マテリアルズ株式会社 ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
US8501088B2 (en) 2007-07-25 2013-08-06 Nippon Steel & Sumikin Materials Co., Ltd. Solder alloy, solder ball and electronic member having solder bump
CN101214588B (zh) * 2008-01-14 2010-06-02 哈尔滨工业大学 低银抗氧化活性无铅钎料
KR101318454B1 (ko) * 2008-04-23 2013-10-16 센주긴조쿠고교 가부시키가이샤 수축공이 억제된 납프리 땜납 합금
US8197612B2 (en) * 2008-04-29 2012-06-12 International Business Machines Corporation Optimization of metallurgical properties of a solder joint
US9050651B2 (en) * 2011-06-14 2015-06-09 Ingot Metal Company Limited Method for producing lead-free copper—bismuth alloys and ingots useful for same
CN102699563A (zh) * 2012-06-23 2012-10-03 浙江亚通焊材有限公司 一种低银无铅软钎料
KR20160003078A (ko) 2013-05-03 2016-01-08 허니웰 인터내셔날 인코포레이티드 무연 솔더 접속을 위한 리드 프레임 구조체
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
CN104439751A (zh) * 2014-12-24 2015-03-25 深圳市亿铖达工业有限公司 新型低熔点无铅焊料
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
WO2017136951A1 (en) * 2016-02-11 2017-08-17 Celestica International Inc. Thermal treatment for preconditioning or restoration of a solder joint
CN107354329A (zh) * 2017-06-06 2017-11-17 西安交通大学 ZChSnSb11‑6改善摩擦学性能和β相细化的方法
CN107365923A (zh) * 2017-07-18 2017-11-21 西安交通大学 ZChSnSb11‑6的β相晶粒形状尖角的钝化的方法
NL2020406B1 (nl) * 2018-02-09 2019-08-19 Inteco B V Werkwijze en inrichting voor het vervaardigen van warmtewisselende elementen, en elemten als zodanig
JP6936926B1 (ja) 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US736712A (en) * 1903-04-09 1903-08-18 Ricardo Fortun Solder for aluminium.
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
US1483327A (en) * 1921-10-27 1924-02-12 William G Bolus Alloy flux for soldering aluminum and process for forming same
JPS61273296A (ja) * 1985-05-29 1986-12-03 Taruchin Kk 耐食性はんだ合金
JPS6272496A (ja) * 1985-09-26 1987-04-03 Matsuo Handa Kk はんだ合金
US4778733A (en) * 1986-07-03 1988-10-18 Engelhard Corporation Low toxicity corrosion resistant solder
US4695428A (en) * 1986-08-21 1987-09-22 J. W. Harris Company Solder composition
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100659890B1 (ko) * 2001-06-28 2006-12-20 센주긴조쿠고교 가부시키가이샤 무연 땜납합금

Also Published As

Publication number Publication date
ZA892041B (en) 1990-03-28
JPH0270033A (ja) 1990-03-08
AU3167289A (en) 1989-10-05
EP0336575A1 (en) 1989-10-11
US4929423A (en) 1990-05-29
CA1299470C (en) 1992-04-28
AU606791B2 (en) 1991-02-14
GB8807730D0 (en) 1988-05-05

Similar Documents

Publication Publication Date Title
KR890014205A (ko) 접합 및 시일용 저독성 합금 조성물
KR880001363A (ko) 저독성 내부식성 땜납
KR940703066A (ko) 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물
KR950702463A (ko) 주석-비스무트 솔더 페이스트 및 고온 특성이 개량된 접속을 형성하는데 페이스트를 사용하는 방법(Tin Bismuth Solder Paste, And Method Using Paste To Form Connection Having Improved High Temperature Properties)
MY117994A (en) Solder alloy, cream solder and soldering method
KR970000427A (ko) 납땜성이 우수한 무연땜납
JPS5570494A (en) Wire rod for copper welding excelling in electric conductivity, thermal conductivity and welding performance
JPH08132277A (ja) 無鉛はんだ
WO2003026828A3 (en) Improved compositions, methods and devices for high temperature lead-free solder
ATE284294T1 (de) Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen
KR880004894A (ko) 지연식 리플로우 합금 혼합물 납땜 페이스트
JPS57108235A (en) Copper alloy for lead frame
JPS54103764A (en) Brazing material
JPS5629643A (en) Corrosion resistant free cutting brass
JPS5521530A (en) High tensile copper alloy with superior heat resistance and conductivity
ES8501276A1 (es) Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos.
JPS56139642A (en) Phosphor copper solder
US4231794A (en) Lead based alloy for the bonding of aluminum parts to parts comprising an alloy of a heavy metal
JPS56144893A (en) Solder alloy for fitting lead on silver electrode
JPS5684432A (en) Gold brazing material
KR100220802B1 (ko) 솔더 조성물
JPS57127595A (en) Silver solder
JP2002001575A (ja) 無鉛半田合金およびこの無鉛半田合金を搭載した回路基板ならびに管球
KR100194147B1 (ko) 무연땜납합금
JPS57202994A (en) Solder clad material containing flux and its manufacture

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid