ATE284294T1 - Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen - Google Patents

Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen

Info

Publication number
ATE284294T1
ATE284294T1 AT01906341T AT01906341T ATE284294T1 AT E284294 T1 ATE284294 T1 AT E284294T1 AT 01906341 T AT01906341 T AT 01906341T AT 01906341 T AT01906341 T AT 01906341T AT E284294 T1 ATE284294 T1 AT E284294T1
Authority
AT
Austria
Prior art keywords
lead
free solder
copper
electronic components
solder alloy
Prior art date
Application number
AT01906341T
Other languages
English (en)
Inventor
Koichi Izumida
Yuki Takano
Hitoshi Abe
Toshiyuki Moribayashi
Koichi Hagio
Junichi Takenaka
Original Assignee
Sumida Corp
Nippon Genma Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corp, Nippon Genma Kk filed Critical Sumida Corp
Application granted granted Critical
Publication of ATE284294T1 publication Critical patent/ATE284294T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes or wires
    • B23K35/0266—Rods, electrodes or wires flux-cored
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Resistors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT01906341T 2001-02-27 2001-02-27 Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen ATE284294T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/001453 WO2002068146A1 (en) 2001-02-27 2001-02-27 Unleaded solder alloy and electronic components using it

Publications (1)

Publication Number Publication Date
ATE284294T1 true ATE284294T1 (de) 2004-12-15

Family

ID=11737070

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01906341T ATE284294T1 (de) 2001-02-27 2001-02-27 Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen

Country Status (8)

Country Link
US (3) US20030091463A1 (de)
EP (1) EP1275467B1 (de)
JP (1) JP4139686B2 (de)
CN (1) CN1240515C (de)
AT (1) ATE284294T1 (de)
DE (1) DE60107670T2 (de)
TW (1) TW469297B (de)
WO (1) WO2002068146A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7172726B2 (en) * 2002-10-15 2007-02-06 Senju Metal Industry Co., Ltd. Lead-free solder
WO2004105997A1 (en) * 2003-05-28 2004-12-09 Koninklijke Philips Electronics N.V. Method for soldering to a copper comprising object using a lead-free solder alloy
TWI465312B (zh) * 2005-07-19 2014-12-21 日本斯倍利亞股份有限公司 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
WO2007023284A1 (en) * 2005-08-24 2007-03-01 Fry's Metals Inc. Reducing joint embrittlement in lead-free soldering processes
CN100459325C (zh) * 2006-09-27 2009-02-04 许晓华 铝漆包线与铜线的焊接方法
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
CN101902007B (zh) * 2009-06-01 2012-05-23 北京七六一通信雷达有限公司 多股励磁线端头处理方法
MY165485A (en) * 2012-08-08 2018-03-23 Senju Metal Industry Co High-temperature lead-free solder alloy
JP6111764B2 (ja) * 2013-03-18 2017-04-12 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5672324B2 (ja) 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
WO2015053114A1 (ja) * 2013-10-10 2015-04-16 株式会社日本スペリア社 低融点ろう材
JP5842973B1 (ja) * 2014-09-04 2016-01-13 千住金属工業株式会社 端子予備メッキ用鉛フリーはんだ合金及び電子部品
CN109702374B (zh) * 2019-02-13 2021-02-09 南昌大学 一种Sn-Cu-Ni-In无铅钎料合金及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643875A (en) * 1985-07-24 1987-02-17 Gte Products Corporation Tin based ductile brazing alloys
US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
JPH01218794A (ja) * 1988-02-29 1989-08-31 Hitachi Ltd 絶縁被覆銅線の接合用ろう材及びその接合方法
US5102748A (en) * 1991-05-03 1992-04-07 Taracorp, Inc. Non-leaded solders
JPH06269983A (ja) * 1993-03-18 1994-09-27 Tokuriki Honten Co Ltd Ａｇ系はんだ
DE4327492C1 (de) * 1993-08-16 1995-02-16 Daimler Benz Ag Verfahren zur Reifendruckwarnung
JP3333691B2 (ja) * 1996-09-25 2002-10-15 株式会社日本自動車部品総合研究所 タイヤ空気圧検知装置
JPH10144718A (ja) * 1996-11-14 1998-05-29 Fukuda Metal Foil & Powder Co Ltd スズ基鉛フリーハンダワイヤー及びボール
JP3760586B2 (ja) * 1997-09-05 2006-03-29 株式会社村田製作所 半田組成物
JP3829475B2 (ja) * 1998-05-13 2006-10-04 株式会社村田製作所 Ｃｕ系母材接合用のはんだ組成物
CA2340393A1 (en) * 1999-06-11 2000-12-21 Katsuaki Suganuma Lead-free solder
JP3565106B2 (ja) * 1999-08-30 2004-09-15 株式会社デンソー タイヤ空気圧警報装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084242A1 (ja) * 2012-11-30 2014-06-05 株式会社日本スペリア社 低融点ろう材

Also Published As

Publication number Publication date
US20060024194A1 (en) 2006-02-02
DE60107670D1 (de) 2005-01-13
JPWO2002068146A1 (ja) 2004-06-24
EP1275467B1 (de) 2004-12-08
DE60107670T2 (de) 2005-10-06
US20090173770A1 (en) 2009-07-09
EP1275467A1 (de) 2003-01-15
CN1426339A (zh) 2003-06-25
CN1240515C (zh) 2006-02-08
TW469297B (en) 2001-12-21
EP1275467A4 (de) 2003-07-09
HK1056523A1 (en) 2004-02-20
US20030091463A1 (en) 2003-05-15
WO2002068146A1 (en) 2002-09-06
JP4139686B2 (ja) 2008-08-27

Similar Documents

Publication Publication Date Title
KR100309229B1 (ko) 납석출 땜납과 납땜된 물품
ATE284294T1 (de) Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen
KR101738841B1 (ko) Ｂｉ-Ｓｎ계 고온 땜납 합금으로 이루어진 고온 땜납 이음
JP2007203373A (ja) 無鉛はんだ合金
JP2000015476A (ja) 無鉛はんだ
EP2277657A1 (de) Bleifreies weichlot
WO2010122764A1 (ja) はんだ材料および電子部品接合体
JP2000197988A (ja) 無鉛はんだ合金
JP2004298931A (ja) 高温鉛フリーはんだ合金および電子部品
US6264093B1 (en) Lead-free solder process for printed wiring boards
JPH08215880A (ja) 無鉛はんだ
JP4135268B2 (ja) 無鉛はんだ合金
CN101585119A (zh) 抗氧化低银无铅焊料合金
JPH08243782A (ja) はんだ合金およびそれを用いたはんだ付け方法
JP2001071173A (ja) 無鉛はんだ
JPH08132277A (ja) 無鉛はんだ
JPH10193169A (ja) 無鉛はんだ合金
JP3425332B2 (ja) 電子部品電極材料および電子部品電極製造方法
JP2004154864A (ja) 鉛フリーはんだ合金
JP4392020B2 (ja) 鉛フリーはんだボール
EP3189929B1 (de) Bleifreie lötlegierung zur anschlussplattierung und elektronische komponente
JP2000349217A (ja) 電子部品、この電子部品を実装した電子機器およびその製造方法
JP5051633B2 (ja) はんだ合金
SU1680474A1 (ru) Флюс дл низкотемпературной пайки и лужени
KR100443230B1 (ko) 납땜용 무연합금

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties