KR940703066A - 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물 - Google Patents

높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물

Info

Publication number
KR940703066A
KR940703066A KR1019940701158A KR19940701158A KR940703066A KR 940703066 A KR940703066 A KR 940703066A KR 1019940701158 A KR1019940701158 A KR 1019940701158A KR 19940701158 A KR19940701158 A KR 19940701158A KR 940703066 A KR940703066 A KR 940703066A
Authority
KR
South Korea
Prior art keywords
oxide
lead
bismuth
electrically conductive
composition
Prior art date
Application number
KR1019940701158A
Other languages
English (en)
Inventor
히로유끼 하라.
마르크 헨리 라브랑체
배리 이. 테일러
Original Assignee
미리암 디. 메코너헤이
이. 아이. 듀폰 디 네모아 앤드 캄파니(E. Du Pont De Nemours And Company)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이. 아이. 듀폰 디 네모아 앤드 캄파니(E. Du Pont De Nemours And Company) filed Critical 미리암 디. 메코너헤이
Publication of KR940703066A publication Critical patent/KR940703066A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5183—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 주로 비스무트, 구리, 납, 아연 및 천이금속의 산화물의 미립자 혼합물로 이루어진 열 사이클 접착 첨가제 조성물 및 이로부터 제조된 전도성 후막 조성물에 관한 것이다.

Description

높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 비스무트, 구리, 납, 아연의 산화물 또는 산화물 전구 물질의 미분 입자와, 철, 코발트, 니켈 및 이들의 혼합물로 이루어진 군 중에서 선택된 천이 금속의 산화물 또는 전구 물질의 미분 입자의 혼합물로 이루어지고 (a) 산화비스무트 및 산화납에 대한 산화구리의 중량비가 0.01-2이고, (b) 산화비스무트 및 산화납에 대한 산화납의 중량비가 0-1이고, (c) 산화비스무트 및 산화납에 대한 산화아연의 중량비가 0.01-2이고, (d) 산화비스무트 및 산화납에 대한 천이금속 산화물의 중량비가 0.01-2인 열 사이클 접착 첨가제 조성물.
  2. (1) 1종 이상의 납땜 가능한 전기 전도성 금속 85-99.9중량%와 (2) 제1항 기재의 첨가제 조성물 15-0.1중량%를 함유하는 미분 입자의 혼합물로 이루어진 납땜 가능한 전기 전도층 제조용 조성물.
  3. 제2항에 있어서, 입자성 혼합물이 유기 매질중에 분산되는 것인 조성물.
  4. (1) 제3항 기재의 조성물 층을 무기 산화물 기재 기판의 표면에 도포하는 단계, (2) 도포된 층을 소성하여 분산 매질을 휘발시키고, 전기 전도성 금속 또는 금속 합금을 소결시키는 단계, (3) 용융된 땜납을 단계(2)의 소성층의 표면에 도포하는 단계, 및 (4) 도포된 땜납을 냉각시켜 고화시키는 단계로 이루어지는, 땜납과 전기 전도성 금속 또는 금속 합금의 접합 방법.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940701158A 1991-10-10 1992-10-08 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물 KR940703066A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US774,788 1991-10-10
US07/774,788 US5250229A (en) 1991-10-10 1991-10-10 Silver-rich conductor compositions for high thermal cycled and aged adhesion
PCT/US1992/008578 WO1993007736A1 (en) 1991-10-10 1992-10-08 Silver-rich conductor compositions for high thermal cycled and aged adhesion

Publications (1)

Publication Number Publication Date
KR940703066A true KR940703066A (ko) 1994-09-17

Family

ID=25102309

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701158A KR970008549B1 (ko) 1991-10-10 1992-10-08 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물
KR1019940701158A KR940703066A (ko) 1991-10-10 1992-10-08 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1019940701158A KR970008549B1 (ko) 1991-10-10 1992-10-08 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물

Country Status (9)

Country Link
US (1) US5250229A (ko)
EP (1) EP0607255B1 (ko)
JP (1) JP2793912B2 (ko)
KR (2) KR970008549B1 (ko)
CN (1) CN1071535A (ko)
DE (1) DE69216634T2 (ko)
MY (1) MY108362A (ko)
TW (1) TW215908B (ko)
WO (1) WO1993007736A1 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US7625420B1 (en) 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US6338809B1 (en) 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP3397125B2 (ja) * 1998-03-12 2003-04-14 株式会社村田製作所 電子部品
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP3494115B2 (ja) * 2000-03-30 2004-02-03 株式会社村田製作所 導電性ペーストおよびこれを用いた積層セラミック電子部品
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
KR20040077655A (ko) 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
US7078276B1 (en) 2003-01-08 2006-07-18 Kovio, Inc. Nanoparticles and method for making the same
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076613A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
KR100875625B1 (ko) * 2005-11-14 2008-12-24 티디케이가부시기가이샤 복합 배선 기판 및 그 제조 방법
US7560052B2 (en) * 2007-03-30 2009-07-14 Lexmark International, Inc. Silver ink compositions containing a cationic styrene/acrylate copolymer additive for inkjet printing
US8511535B1 (en) * 2010-04-19 2013-08-20 Aegis Technology Inc. Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere
KR101343891B1 (ko) 2010-08-17 2013-12-20 (주)바이오니아 써멀 사이클러용 저 비열성 복합 소재
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
JP7032042B2 (ja) * 2015-12-22 2022-03-08 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 厚膜ペーストを用いて改善された直接接合銅（ｄｉｒｅｃｔ－ｂｏｎｄｅｄ ｃｏｐｐｅｒ）基板
CN108191449B (zh) * 2018-01-03 2021-04-27 上海富乐华半导体科技有限公司 一种铜-氧化铝陶瓷基板及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US553421A (en) * 1896-01-21 Corn-harvester
GB1346851A (en) * 1971-05-21 1974-02-13 Matsushita Electric Ind Co Ltd Varistors
US3896054A (en) * 1972-03-02 1975-07-22 Du Pont High adhesion metallizations
US3838071A (en) * 1972-06-30 1974-09-24 Du Pont High adhesion silver-based metallizations
US4001146A (en) * 1975-02-26 1977-01-04 E. I. Du Pont De Nemours And Company Novel silver compositions
US4094061A (en) * 1975-11-12 1978-06-13 Westinghouse Electric Corp. Method of producing homogeneous sintered ZnO non-linear resistors
US4090009A (en) * 1977-03-11 1978-05-16 E. I. Du Pont De Nemours And Company Novel silver compositions
US4187201A (en) * 1978-03-15 1980-02-05 Electro Materials Corporation Of America Thick film conductors
US4318830A (en) * 1979-01-15 1982-03-09 E. I. Du Pont De Nemours And Company Thick film conductors having improved aged adhesion
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
US4381945A (en) * 1981-08-03 1983-05-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions
EP0147607B1 (de) * 1983-12-22 1988-05-04 BBC Brown Boveri AG Zinkoxid-Varistor
US4714570A (en) * 1984-07-17 1987-12-22 Matsushita Electric Industrial Co., Ltd. Conductor paste and method of manufacturing a multilayered ceramic body using the paste
JPH06104873B2 (ja) * 1986-07-08 1994-12-21 富士電機株式会社 銀―金属酸化物系接点用材料及びその製造方法

Also Published As

Publication number Publication date
CN1071535A (zh) 1993-04-28
WO1993007736A1 (en) 1993-04-15
KR970008549B1 (ko) 1997-05-27
DE69216634D1 (de) 1997-02-20
US5250229A (en) 1993-10-05
JP2793912B2 (ja) 1998-09-03
MY108362A (en) 1996-09-30
EP0607255A1 (en) 1994-07-27
EP0607255B1 (en) 1997-01-08
DE69216634T2 (de) 1997-04-24
JPH07500450A (ja) 1995-01-12
TW215908B (ko) 1993-11-11

Similar Documents

Publication Publication Date Title
KR940703066A (ko) 높은 열 사이클 접착력 및 노화 접착력을 위한 은 풍부 전도체 조성물
KR880000822B1 (ko) 도전재료
CA1050746A (en) Silver compositions
KR880004733A (ko) 필름 캐리어 및 이 필름 캐리어를 이용한 본딩 방법
CA1110053A (en) Silver compositions
JPS6016041B2 (ja) 厚膜導電体形成用ペ−スト
IE811760L (en) Solder powder composition
WO2002010477A1 (fr) Pointe de fer de soudage electrique et fer de soudage electrique
US4388347A (en) Conductive pigment-coated surfaces
US4485153A (en) Conductive pigment-coated surfaces
CA1192062A (en) Conductor compositions
JPH08243782A (ja) はんだ合金およびそれを用いたはんだ付け方法
US4312896A (en) Novel soldering process comprising coating a dielectric substrate with electroconductive metal protected by nickel carbide
JPS58178903A (ja) 導電性ペ−スト
JPS61185806A (ja) 導電性レジンペ−スト
US4547436A (en) Conductive element metallized with a thick film gold composition
JPS59103204A (ja) 厚膜銀組成物
JPS5815576A (ja) 空気中で▲か▼焼し得る電気回路形成用インク
JPH01206508A (ja) 窒化アルミニウム基板用導体ペースト
JPS59103203A (ja) 厚膜金組成物
JPS61288484A (ja) セラミツク配線基板用導体混練物
US20070252105A1 (en) Heat conductor
JPS61247672A (ja) 金属粒子を基板に接着する方法
JPS58201201A (ja) 電圧非直線性抵抗素子
KR900005304B1 (ko) 집적회로용 기판의 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee