AU606791B2 - Low toxicity alloy composition for joining and sealing - Google Patents

Low toxicity alloy composition for joining and sealing Download PDF

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Publication number
AU606791B2
AU606791B2 AU31672/89A AU3167289A AU606791B2 AU 606791 B2 AU606791 B2 AU 606791B2 AU 31672/89 A AU31672/89 A AU 31672/89A AU 3167289 A AU3167289 A AU 3167289A AU 606791 B2 AU606791 B2 AU 606791B2
Authority
AU
Australia
Prior art keywords
weight
alloy composition
alloy
metals
shaped body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU31672/89A
Other languages
English (en)
Other versions
AU3167289A (en
Inventor
Ulysses Ma
Kay Louise Tucker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vesuvius Holdings Ltd
Original Assignee
Cookson Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cookson Group PLC filed Critical Cookson Group PLC
Publication of AU3167289A publication Critical patent/AU3167289A/en
Application granted granted Critical
Publication of AU606791B2 publication Critical patent/AU606791B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)
AU31672/89A 1988-03-31 1989-03-23 Low toxicity alloy composition for joining and sealing Ceased AU606791B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8807730 1988-03-31
GB888807730A GB8807730D0 (en) 1988-03-31 1988-03-31 Low toxicity soldering compositions

Publications (2)

Publication Number Publication Date
AU3167289A AU3167289A (en) 1989-10-05
AU606791B2 true AU606791B2 (en) 1991-02-14

Family

ID=10634456

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31672/89A Ceased AU606791B2 (en) 1988-03-31 1989-03-23 Low toxicity alloy composition for joining and sealing

Country Status (8)

Country Link
US (1) US4929423A (ko)
EP (1) EP0336575A1 (ko)
JP (1) JPH0270033A (ko)
KR (1) KR890014205A (ko)
AU (1) AU606791B2 (ko)
CA (1) CA1299470C (ko)
GB (1) GB8807730D0 (ko)
ZA (1) ZA892041B (ko)

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JPH04220196A (ja) * 1990-07-19 1992-08-11 Aisin Seiki Co Ltd 亜鉛メツキ鋼板フレームの接合方法
JP2505921B2 (ja) * 1990-09-25 1996-06-12 株式会社日立製作所 半導体装置及びそれ用はんだ合金
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
ES2036452B1 (es) * 1991-06-12 1995-12-16 Electro Materiales Klk S A Metodo de conexion de cables electricos sobre superficies de acero y placa de molde-crisol para llevar a cabo dicho metodo.
US5287037A (en) * 1991-12-03 1994-02-15 General Electric Company Metal ferrules for hermetically sealing electric lamps
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5330712A (en) * 1993-04-22 1994-07-19 Federalloy, Inc. Copper-bismuth alloys
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
NL9302056A (nl) * 1993-11-26 1995-06-16 Billiton Witmetaal Kogel en het gebruik van een Sn-legering daarvoor.
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5435857A (en) * 1994-01-06 1995-07-25 Qualitek International, Inc. Soldering composition
DE19538992A1 (de) * 1995-04-28 1996-10-31 Hewlett Packard Co Wismut-Zinn-Lötmittel-Verbindungen mit verbesserten mechanischen Eigenschaften
CN1040303C (zh) * 1995-06-30 1998-10-21 三星电机株式会社 通用无铅焊料
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
CN1252842A (zh) 1997-04-22 2000-05-10 伊科索尔德国际股份有限公司 无铅焊料
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP2000153388A (ja) 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
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GB9915954D0 (en) * 1999-07-07 1999-09-08 Multicore Solders Ltd Solder alloy
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
AU2002227489A1 (en) * 2000-07-31 2002-02-13 Honeywell International Inc. Lead-free alloys with improved wetting properties
JP2002124756A (ja) * 2000-10-18 2002-04-26 Nitto Denko Corp 回路基板および回路基板の端子部の接続構造
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
TW592872B (en) 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
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US7282175B2 (en) 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
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CN1301179C (zh) * 2005-05-11 2007-02-21 郴州金箭焊料有限公司 无铅焊料及制造方法
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CN104439751A (zh) * 2014-12-24 2015-03-25 深圳市亿铖达工业有限公司 新型低熔点无铅焊料
JP6011709B1 (ja) 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
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CN107365923A (zh) * 2017-07-18 2017-11-21 西安交通大学 ZChSnSb11‑6的β相晶粒形状尖角的钝化的方法
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US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony

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US4758407A (en) * 1987-06-29 1988-07-19 J.W. Harris Company Pb-free, tin base solder composition
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony

Also Published As

Publication number Publication date
JPH0270033A (ja) 1990-03-08
EP0336575A1 (en) 1989-10-11
AU3167289A (en) 1989-10-05
CA1299470C (en) 1992-04-28
KR890014205A (ko) 1989-10-23
ZA892041B (en) 1990-03-28
US4929423A (en) 1990-05-29
GB8807730D0 (en) 1988-05-05

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