KR880009544A - 전자부품의 접속 구조와 그의 제조 방법 - Google Patents

전자부품의 접속 구조와 그의 제조 방법 Download PDF

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KR880009544A
KR880009544A KR1019880000137A KR880000137A KR880009544A KR 880009544 A KR880009544 A KR 880009544A KR 1019880000137 A KR1019880000137 A KR 1019880000137A KR 880000137 A KR880000137 A KR 880000137A KR 880009544 A KR880009544 A KR 880009544A
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electronic component
connection
plate spring
connection structure
substrate
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구니오 마쓰모도
무네오 요시마
수구루 사까구찌
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미다가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

내용 없음.

Description

전자부품의 접속 구조와 그의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명에 관한 도전성판 용수철을 나타내는 구성도이며
(a)는 절연 시트상에 일괄적으로 성형된 도전성판 용수철의 평면도,
(b),(c)는 (a)에 있어서의 A-A′부분의 단면도.
여기서((c)는 (b)에 있어서 도존성판 용수철을 수직방향으로 변위시켰을 때를 나타내는 단면도.
제 2 도는 LSI칩과 배선 기판 및 냉각체의 위치 관계를 도시하는 도면이며,
(a)는 LSI칩과 배선기판 및 낸각체를 일체화 하기전의 모양을 도시하는 도면으로 각 칩마다 높이의 불안정이 생기는 것을 나타내고,
(b)는 열접속부를 거쳐서 일체화한 구성을 도시하는 도면.
제 3 도(a)∼(d)는 본 발명에 관한 접속 구조의 제조방법을 도시하기 위한 공정도.

Claims (20)

  1. 접속점을 갖는 전자부품, 상기 전자 부품과 전기 접속하는 기판 및 상기 전자부품과 상기 기판사이에 마련된 높이가 최소 가로 방향 치수 이하인 도전성판 용수철로 되는 것을 특징으로 하는 전자 부품의 접속 구조.
  2. 특허정구의 범위 제1항에 있어서, 상기전자 부품상에 냉각체가 마련되어 있는 것을 특징으로 하는 전자 부품의 접속 구조.
  3. 특허청구의 범위 제1항에 있어서, 상기 도전성만 용수철이 나선 형상인 것을 특징으로 하는 전자 부품의 접속 구조.
  4. 특허청구의 범위 제3항에 있어서, 상기 전자부품과의 접속이 땜납 접속인 것을 특징으로 하는 전자 부품의 접속 구조.
  5. 특허청구의 범위 제3항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자 부품과의 접속이 열압착 접속인 것은 특징으로 하는 전자 부품의 접속 구조.
  6. 특허청구의 범위 제3항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자 부품과의 접속이 납땜 접속인 것을 특징으로하는 전자 부품의 접속 구조.
  7. 특허청구의 범위 제3항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자 부품과의 접속이 용접으로 접속하고 있는 것을 특징으로하는 전자부품의 접속 구조.
  8. 특허청구의 범위 제1항에 있어서, 상기 도전성판 용수철의 치수가 두께 10∼40㎛, 폭 40∼70㎛인 것을 특징으로 하는 전자 부품의 접속 구조.
  9. 특허청구의 범위 제8항에 있어서, 상기 도전성판 용수철의 용수철 정수가 수평방향 300∼600g/mm, 수직 방향에 40∼90g/mm인 것을 특징으로 하는 전자 부품의 접속 구조.
  10. 특허청구의 범위 제1항에 있어서, 상기 도전성판 용수철은 동 또는 동합금, 또는 동과의 복합급속으로 되는 것을 특징으로 하는 전자 부품의 접속 구조.
  11. 특허청구의 범위 제1항에 있어서, 상기 도전성판 용수철은 절연 시트와 일체로 형성된 구조인 것을 특징으로하는 전자부품의 접속 구조.
  12. 특허청구의 범위 제1항에 있어서, 상기 절연체 시트가 폴리아미드, 그라스 에폭시, 글라스 폴리아미드, 폴리에스텔, 석영 섬유가 들어간 폴리아미드, 또는 카본 섬유를 넣은 수지로 되는 것을 특징으로하는 전자 부품의 접속 구조.
  13. 특허청구의 범위 제1항에 있어서, 상기 기판이 세라믹 또는 글라스 에폭시계의 재료로 되는 것을 특징으로하는 전자부품의 접속 구조.
  14. 여러개의 접속점을 갖는 전자 부품, 상기 전자 부품과 전기 접속하는 기판 및 상기 전자 부품과 상기 기판 사이에 마련된 수평 방향 및 수직 방향에도 변위가 가능한 여러개의 도전성판 용수철로 되는 것을 특징으로하는 전자 부품의 접속 구조.
  15. 특허청구의 범위 제14항에 있어서, 상기 도전성판 용수철이 절연 시트상에 일괄적으로 형성하고 있는 것을 특징으로 하는 전자 부품의 접속 구조.
  16. 특허청구 범위 제15항에 있어서, 상기 절연 시트에는 상기 전자 부품의 여러개의 접속점의 위치에 대응해서 구멍이 마련되어 있고, 상기 절연 시트에 한쪽끝이 접착하고 있으며 다른쪽끝은 절연 시트의 구멍부분에 위치하도록 배치된 도전성판 용수철인 것은 특징으로 하는 전자부품의 접속 구조.
  17. 도전성판 용수철재에 접착한 절연 시트에 전자 부품의 접속점의 위치에 대응하도록 구멍을 마련하고, 상기 도전성판 용수철재를 한쪽끝은 상기 절연시트에 접착한채로, 다른쪽 끝은 상기 절연 시트에 접착한채로, 다른 쪽 끝은 상기 절연 시트의 구멍 부분에 위치하도록 가공해서 도전성판 용수철을 형성하여 싱기 도전성판 용수철과 기판 및 전자 부품을 접속하는 것을 특징으로 하는 전자 부룸의 접속 구조의 제조 방법.
  18. 특허청구의 범위 제17항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자 부품과의 접속이 땜납 접속인 것을 특징으로 하는 전자 부품의 접속 구조의 제조 방법.
  19. 특허청구의 범위 제17항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자부품과의 접속이 열압착 접속인 것을 특징으로 하는 전자 부품의 접속 구조의 제조 방법.
  20. 특허청구의 범위 제17항에 있어서, 상기 도전성판 용수철과 상기 기판 및 상기 전자부품과의 접속이 납땜 접속인 것을 특징으로하는 전자 부품의 접속구조의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000137A 1987-01-19 1988-01-11 전자부품의 접속구조와 그의 제조방법 KR920002720B1 (ko)

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JP62008004A JP2533511B2 (ja) 1987-01-19 1987-01-19 電子部品の接続構造とその製造方法
JP62-8004 1987-01-19

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KR920002720B1 KR920002720B1 (ko) 1992-03-31

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