JPS63177434A - 電子部品の接続構造とその製造方法 - Google Patents

電子部品の接続構造とその製造方法

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Publication number
JPS63177434A
JPS63177434A JP62008004A JP800487A JPS63177434A JP S63177434 A JPS63177434 A JP S63177434A JP 62008004 A JP62008004 A JP 62008004A JP 800487 A JP800487 A JP 800487A JP S63177434 A JPS63177434 A JP S63177434A
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JP
Japan
Prior art keywords
chip
substrate
insulating sheet
conductive leaf
springs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62008004A
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English (en)
Other versions
JP2533511B2 (ja
Inventor
Kunio Matsumoto
邦夫 松本
Muneo Oshima
大島　宗夫
Masaru Sakaguchi
勝 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
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Hitachi Ltd
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Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62008004A priority Critical patent/JP2533511B2/ja
Priority to KR1019880000137A priority patent/KR920002720B1/ko
Priority to US07/143,200 priority patent/US4893172A/en
Publication of JPS63177434A publication Critical patent/JPS63177434A/ja
Priority to US07/243,796 priority patent/US5086337A/en
Application granted granted Critical
Publication of JP2533511B2 publication Critical patent/JP2533511B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＬＳＩチップ等の電子部品を基板に電気接続す
る接続構造及びその製造方法に関する。
〔従来の技術〕
多数の電気接続点を有するＬＳＩチップ等の電子部品（
以下、チップと称す）を基板に直接はんだ接続する方法
としてフリップチップボンディングがある。しかし、基
板にセラミックやガラスエポキシ系などの材料を用いる
場合、チップと基板材料の膨張係数が異なるため、温度
変化による熱膨張差がはんだ結合部に作用し、結合破壊
寿命を低下させるという問題があった。
この問題に対し、特開昭６１−１１０４４１「マイクロ
エレクトロニック素子を電気的に接続するための変形可
能のマルチ結合の製法Ｊにおいて、水平方向の熱膨張差
を吸収する構造についての報告がある。第４図は上記報
告による従来構造の概念図であるが、高さが最小横方向
寸法の数倍である導電性板ばね１００が２本の導電性ピ
ン１０１．１０２に結合され、各導電性ビン１０１゜１
０２はチップ３及び基板４に接続されている。
導電性板ばね１００がチップ３と基板４の水平熱膨張差
を吸収し、はんだ３１のせん断応力を軽減するよう作用
し、結合破壊寿命を伸す働きをする。
ところで、上記した従来構造はチップ３の背面（上面）
に熱接続される冷却体の圧着圧力に酎えるために垂直方
向に対して十分な剛性が確保され、垂直方向に変位しな
い構造が取られている。このため、チップ３の冷却手段
に対し、次の課題が存在していた。
なお、第４図における３２はチップ電極、４２は基板電
極である。
〔発明が解決しようとする問題点〕
同一基板に接続された複数個のチップを背面（上面）か
ら冷却する場合を考える。上記した従来の接続構造では
、複数個のチップを同一基板に接続したとき基板の反り
や接続高さバラツキにより各チップの背面が同一平面に
ならない。このため冷却体は、独立に各チップ背面に習
うように熱接続する必要があった。すなわち、各チップ
毎に垂直位置調整あるいは圧着圧力調整可能な冷却体を
チップ背面に圧着させる機能が不可欠であった。
低熱抵抗を維持しながら上記の垂直位置調整あるいは圧
着圧力調整機能を合せ持った冷却体は相当複雑な構造で
あり、その加工性２組立性、信頼性に対し多くの課題が
あった。
本発明の目的は、上記課題を解決するため、チップと基
板の水平熱膨張差の吸収機能を低下させることなく、垂
直方向にもある限界内で自由に変位可能なチップの電気
的接続構造並びにその製造方法を提供することにある。
〔問題点を解決するための手段〕
上記目的は、従来接続構造で用いた高さが最小横方向寸
法の数倍である導電性板ばねの代りに、その縦横比を逆
にした導電性板ばねを絶縁シート上に一括成形し、これ
をフリップチップボンディングの一部に採用することで
達成される。
〔作用〕
すなわち、高さが最小横方向寸法以下である導電性板ば
ねをチップ接続構造に採用することで、電気的接続を保
持しながらある限界内で各チップを独立に上方へ移動さ
せることができ、冷却体を個々に移動させることなくチ
ップを冷却体に熱接続できる。このため、冷却体の構造
は極端に簡素化できる。
また、絶縁シート上に上記導電性板ばねを一括成形する
ことで、チップ、導電性板ばね及び基板の相互接続を容
易にする。
〔実施例〕
以下１本発明の実施例を第１図、第２図及び第３図によ
り説明する。
第１図（ａ）は本発明に係る絶縁シート上に一括成形さ
れた導電性板ばねの平面図、（ｂ）は接続状態を示すＡ
−Ａ’断面図、（Ｃ）は接続後チップを上方へ移動させ
た時の接続状態を示す断面図（導電性板ばね部分は正面
図）である。第２図は本発明に係る接続構造を用いたと
きのチップと基板及び冷却体との位置関係図であり、冷
却体に対し熱接続前のチップを（ａ）、熱接続後のチッ
プを（イ）に示した。第３＠は本発明に係る接続構造の
製法を示したものである。第１図〜第３図において、１
は導電性板ばね、２は絶縁シート。
３はチップ、４は基板、５は冷却体、３１及び４１はは
んだ、３２はチップ電極、４２は基板電極。
５１は熱接続部、１′は導電性板ばね材、２′は絶縁シ
ート材である。
第１図（ａ）は導電性板ばね１にらせん形状を採用した
例である。各導電性板ばね１はチップ電極３２の位置に
対応して明られている絶縁シート２の穴にらせんの中心
を合せ、他端を絶縁シート２、に固定させる。これら一
括固定された導電性板ばね１は、第１図（ｂ）に示すよ
うにらせんの中心をチップ電極３２．他端を基板電極４
２にはんだ３１．４１にて接続する。
チップ３と基板４の電気的接続構造を上記した構成にす
ることにより、第１図（ｃ）に示すように電気的接続を
保持しながらある限界内でチップ３を独立に上方へ移動
させることが可能となる。
この機能は第２図（ａ）、（ｂ）に示すように、複数の
チップ３を同一基板４に接続する場合、基板４の反りや
チップ３の接続高さバラツキを吸収し、チップ３を冷却
体５に熱接続部５１を介して熱接続させることを可能と
する。また、上記した接続構造は、チップ３と基板４の
水平方向の熱膨張差に対してもこれを吸収でき、はんだ
３１，４１等接続系の結合破壊寿命を延長させることが
出来る。
なお、接続にあたって、導電性板ばね１付き絶縁シート
２を反転させ、導電性板ばね１のらせんの中心を基板電
極４２に、他端をチップ電極３２に接続させても（図示
せず）、上記したと同様な効果を得ることができる。
次に、上記した接続構造の製法について第３図により説
明する。（ａ）において、まず薄板状の導電性板ばね材
１′　（銅、銅合金または銅との複合金属）と絶縁シー
ト材２′　（ポリイミド、ガラスエポキシ、ガラスポリ
イミド、ポリエステル。
エポキシケブラー、石英繊維入りポリイミド、ポリイミ
ドケブラーまたはカーボン繊維ケブラー）を接着する。
次に（ｂ）で、絶縁シート材２′に対し、チップ電極３
２位置に対応する場所に導電性板ばね１のらせん部分よ
り大きな穴をホトエツチングにより明は絶縁シート２と
する。更に（ｃ）で、導電性板ばね材１′に対し、所定
の場所に第１図（ａ）に示したらせん形状をホトエツチ
ングにより形成し、導電性板ばね１とする。このとき、
導電性板ばね１の一端は絶縁シート２に固定されたまま
であり、複数の導電性板ばね１は相互に位置精度よく一
括成形でき、かつ全体として取扱いが容易となる。最後
に（ｄ）で、導電性板ばね１はチップ電極３２及び基板
電極４２にはんだ３１゜４１で接続する。
なお、以上述べた製法において、導電性板ばね材１″と
絶縁シート材２′の接着の前に、絶縁シート材２′に所
定の穴を明けその後、これに導電性板ばね材１′を接着
し第３図（ｂ）の状態にすることも可能である。また、
第３図（ｄ）に至る製法において、導電性板ばね１とチ
ップ３．あるいは基板４とのはんだ３１．４１接続の代
りに、熱圧着、ろう付けあるいは溶接によって接続して
もよい。
〔発明の効果〕　　゛ 以上詳述した通り、本発明によるチップの電気的接続構
造によれば、チップと基板との水平熱膨張差の吸収機能
を損うことなく、複数のチップを独立に冷却体へ熱接続
可能となり、冷却系の構造全体を極めて簡単にすること
ができる。すなわち、加工及び組立性の限界による複数
チップの背面レベルのバラツキを個々のチップに対し独
立に冷却体の位置調整あるいは圧着圧力調整手段で吸収
していた従来の複雑な冷却系に対し、本発明ではこれら
の調整機能の必要性がなくなり冷却系の構造を極めて簡
単にできる。このことは、高発熱チップの高密度配列実
装に対し、優れた組立性及び信頼性を有する効果がある
。
【図面の簡単な説明】
第１図（ａ）は絶縁シート上に一括成形された導電性板
ばねの平面図、（ｂ）（ｃ）はその接続状態を示す断面
図、第２図（’ａ）（＃）はチップ。 基板及び冷却体の位置関係図、第３図（ａ）（ｂ）（ｃ
）（ｄ）は本発明に係る接続構造の製造方法工程図、第
４図（ａ）（ｂ）（ｃ）は従来の接続構造図である。 １・・・導電性板ばね、１′・・・導電性板ばね材、２
・・・絶縁シート、２′・・・絶縁シート材、３・・・
チップ。 ３２・・・チップ電極、４・・・基板、４２・・・基板
電極。 ５・・・冷却体、５１・・・熱接続部、１００・・・導
電性板ばね、１０１，１０２−・・導電性ピン、３１．
４１・・・はんだ。 躬　１１！］ 第　３匿 ２′

Claims (1)

  1. 【特許請求の範囲】 １、複数個の接続点を有する電子部品を基板に電気接続
    するフリップチップボンディングにおいて、接続構造の
    一部として、絶縁シート上に一括形成された高さが最小
    横方向寸法以下である導電性板ばねを挿入したことを特
    徴とする電子部品の接続構造。 ２、複数個の接続点の対応する位置に穴のあけられた絶
    縁シートに接着している金属板をホトエッチングにより
    、一端は絶縁シートに接着したまま、他端は絶縁シート
    の穴部に位置するように、接続点に対応する数だけ独立
    な導電性板ばねを一括形成することを特徴とする電子部
    品の接続構造の製造方法。
JP62008004A 1987-01-19 1987-01-19 電子部品の接続構造とその製造方法 Expired - Fee Related JP2533511B2 (ja)

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JP62008004A JP2533511B2 (ja) 1987-01-19 1987-01-19 電子部品の接続構造とその製造方法
KR1019880000137A KR920002720B1 (ko) 1987-01-19 1988-01-11 전자부품의 접속구조와 그의 제조방법
US07/143,200 US4893172A (en) 1987-01-19 1988-01-13 Connecting structure for electronic part and method of manufacturing the same
US07/243,796 US5086337A (en) 1987-01-19 1988-09-13 Connecting structure of electronic part and electronic device using the structure

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US4893172A (en) 1990-01-09
KR880009544A (ko) 1988-09-15
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KR920002720B1 (ko) 1992-03-31

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