JPH0528917B2 - - Google Patents
Info
- Publication number
- JPH0528917B2 JPH0528917B2 JP61022270A JP2227086A JPH0528917B2 JP H0528917 B2 JPH0528917 B2 JP H0528917B2 JP 61022270 A JP61022270 A JP 61022270A JP 2227086 A JP2227086 A JP 2227086A JP H0528917 B2 JPH0528917 B2 JP H0528917B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electric circuit
- wiring pattern
- terminal
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- -1 for example Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2227086A JPS62179794A (ja) | 1986-02-03 | 1986-02-03 | 電気回路配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2227086A JPS62179794A (ja) | 1986-02-03 | 1986-02-03 | 電気回路配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62179794A JPS62179794A (ja) | 1987-08-06 |
| JPH0528917B2 true JPH0528917B2 (ko) | 1993-04-27 |
Family
ID=12078071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2227086A Granted JPS62179794A (ja) | 1986-02-03 | 1986-02-03 | 電気回路配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62179794A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7830331B2 (en) | 2007-11-29 | 2010-11-09 | Kabushiki Kaisha Toshiba | Electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013214612A (ja) * | 2012-04-02 | 2013-10-17 | Denso Corp | 配線装置 |
| JP7233067B1 (ja) * | 2022-04-22 | 2023-03-06 | エレファンテック株式会社 | 実装部品の位置決め固定構造及び製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106871A (en) * | 1978-02-09 | 1979-08-22 | Matsushita Electric Works Ltd | Method of producing embedded terminal for circuit board |
| JPS5544728A (en) * | 1978-09-27 | 1980-03-29 | Yazaki Corp | Circuit board |
| JPS57154886A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
-
1986
- 1986-02-03 JP JP2227086A patent/JPS62179794A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106871A (en) * | 1978-02-09 | 1979-08-22 | Matsushita Electric Works Ltd | Method of producing embedded terminal for circuit board |
| JPS5544728A (en) * | 1978-09-27 | 1980-03-29 | Yazaki Corp | Circuit board |
| JPS57154886A (en) * | 1981-03-19 | 1982-09-24 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7830331B2 (en) | 2007-11-29 | 2010-11-09 | Kabushiki Kaisha Toshiba | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62179794A (ja) | 1987-08-06 |
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