KR850000734A - 구리도체 조성물 - Google Patents

구리도체 조성물 Download PDF

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Publication number
KR850000734A
KR850000734A KR1019840003434A KR840003434A KR850000734A KR 850000734 A KR850000734 A KR 850000734A KR 1019840003434 A KR1019840003434 A KR 1019840003434A KR 840003434 A KR840003434 A KR 840003434A KR 850000734 A KR850000734 A KR 850000734A
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KR
South Korea
Prior art keywords
composition
copper
copper oxide
particles
weight
Prior art date
Application number
KR1019840003434A
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English (en)
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KR910005524B1 (ko
Inventor
폴 시어타(외 1) 빈센트
Original Assignee
도늘드 에이 호오스
이 아이 듀우판 디 네모아 앤드 캄파니
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24011585&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR850000734(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 도늘드 에이 호오스, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 도늘드 에이 호오스
Publication of KR850000734A publication Critical patent/KR850000734A/ko
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Publication of KR910005524B1 publication Critical patent/KR910005524B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits

Abstract

내용 없음.

Description

구리도체 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (12)

  1. (a) 산화구리피막으로서 산소를 적어도 0.2중량% 함유하는 산화물피막을 가지고 있으며 입자크기가 0.5-10μm이며, 평균 입자크기가 1-5μm이며 중량에 대한 표면적의 비가 1m2/g이하인 금속구리와, (b) 입자자크기가 0.1-10μm이며, 평균 입자크기가 0.5-5μm이며 산화물이 피복된 구리금속 입자에 대한 산화구리입자의 중량비가 0-0.15인 산화구리와, (c) 연화점이 300-700℃이며, 크기가 1-15μm이며 평균 입자크기가 1-5μm이며 구리금속입자상에 있는 산화구리에 대한 결합제내에 있는 산화구리의 중량비가 0-0.5인 무기결합제, 이들 모두가 (d) 전체조성물을 기준으로 0.1중량% 이하의 수지를 함유하는 유기매제중에 분산되어 있으며, 상기 (a),(b) 및 (c)로 부터 나온 산화구리 총량이 구리금속과(a) 중에 있는 산화구리 총량의 15%를 초과하지 않는 그런 미세하게 분할된 입자의 혼합물을 구성된 프린트할 수 있는 후막도체 조성물.
  2. 제1항에 있어서, (a),(b) 및 (c)로 부터 나온 산화구리총량이 4-10중량%인 조성물.
  3. 제1항에 있어서 산화구리가 모두 구리입자의 산화물피막으로 부터 나온 것인 조성물.
  4. 제1항에 있어서 구리 금속입자상에 있는 산화구리에 대한 산화구리로서 첨가된 산소의 중량비가 0.2-0.5인 조성물.
  5. 제1항에 있어서 구리 금속입자상에 있는 산화구리에 대한 무기결합제중에 있는 산화구리의 중량비가 0.2-0.5인 조성물.
  6. 제1항에 있어서, 분산된 고체가 70-90%이며, 유기매제가 전체조성물의 30-10중량%인 조성물.
  7. 제1항에 있어서 무기 결합제가 붕규 산납유리인 조성물.
  8. 제1항에 있어서 유리가 B2O3를 20중량% 이하 함유하는 조성물.
  9. 제1항에 있어서 은금속을 미세하게 분할된 구리입자를 기준으로 1-50중량% 함유하는 조성물.
  10. 제1항에 있어서 구리와 은 입자를 공융하는 비율로 함유하는 조성물.
  11. 유기매제의 휘발, 산화구리의 분해 및 무기결합제와 구리의 소결이 일어나도록 연소시킨 제1항의 조성물로 된 패턴필름을 가진 세라믹기질로 구성된 도체부품.
  12. (1) 세라믹기질에 무기매제중에 분산된 무기결합제와 미세하게 분할된 저항물질입자의 혼합물로 구성된 후막저항기 페이스트층을 적용하고, (2) 저항기 페이스트층을 산화분위기 하에서 연소시켜 유기매제를 휘발시키고 무기결합제를 소결시킨 다음, (3) 연소된 저항기층에 제1항의 도체조성물로된 패턴층을 적용하고, (4) 패턴도체층을 비산화분위기 하에서 연소시켜 유기매제의 휘발, 산화구리의 분해 및 무기결합제와 구리의 소결이 일어나게 하는 것으로 구성된 종단저항기의 제조방법.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019840003434A 1983-06-20 1984-06-19 구리도체 조성물 KR910005524B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US505,730 1983-06-20
US06/505,730 US4521329A (en) 1983-06-20 1983-06-20 Copper conductor compositions
US505703 1983-06-20

Publications (2)

Publication Number Publication Date
KR850000734A true KR850000734A (ko) 1985-03-09
KR910005524B1 KR910005524B1 (ko) 1991-07-31

Family

ID=24011585

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840003434A KR910005524B1 (ko) 1983-06-20 1984-06-19 구리도체 조성물

Country Status (9)

Country Link
US (1) US4521329A (ko)
EP (1) EP0131778B2 (ko)
JP (2) JPS6035405A (ko)
KR (1) KR910005524B1 (ko)
CA (1) CA1211930A (ko)
DE (1) DE3472327D1 (ko)
DK (1) DK159698C (ko)
GR (1) GR82171B (ko)
IE (1) IE55567B1 (ko)

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Also Published As

Publication number Publication date
KR910005524B1 (ko) 1991-07-31
DK298784A (da) 1984-12-21
CA1211930A (en) 1986-09-30
JPS62110202A (ja) 1987-05-21
DK298784D0 (da) 1984-06-19
DK159698C (da) 1991-04-15
JPS6035405A (ja) 1985-02-23
JPH0350365B2 (ko) 1991-08-01
JPH0334162B2 (ko) 1991-05-21
EP0131778A1 (en) 1985-01-23
US4521329A (en) 1985-06-04
EP0131778B1 (en) 1988-06-22
EP0131778B2 (en) 1991-12-11
IE841525L (en) 1984-12-20
GR82171B (ko) 1984-12-13
DK159698B (da) 1990-11-19
IE55567B1 (en) 1990-11-07
DE3472327D1 (en) 1988-07-28

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