JPS6413790A - Copper electrode paste - Google Patents

Copper electrode paste

Info

Publication number
JPS6413790A
JPS6413790A JP62170265A JP17026587A JPS6413790A JP S6413790 A JPS6413790 A JP S6413790A JP 62170265 A JP62170265 A JP 62170265A JP 17026587 A JP17026587 A JP 17026587A JP S6413790 A JPS6413790 A JP S6413790A
Authority
JP
Japan
Prior art keywords
electrode paste
nickel
glass
paste
mainly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62170265A
Other languages
Japanese (ja)
Inventor
Tadao Suzuki
Tadao Hanagata
Masaru Shimodaira
Souya Miyajima
Masanobu Ito
Eiji Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Priority to JP62170265A priority Critical patent/JPS6413790A/en
Publication of JPS6413790A publication Critical patent/JPS6413790A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To improve adhesive properties, solderability, solder encroachment and sheet resistance by mainly comprising copper, adding fixed quantities of nickel, cuprous oxide, glass and manganese dioxide, printing paste onto a ferrite substrate and baking the substrate at a fixed temperature or less in an N2 atmosphere. CONSTITUTION:In electrode paste mainly comprising Cu, at least 5wt.% to Ci, 2 or 15wt.% Cu2O, 5 or 30wt.% glass and MnO2 in 2wt.% to the utmost are added and paste is manufactured. A nickel alloy or a nickel compound is preferable as Ni.
JP62170265A 1987-07-08 1987-07-08 Copper electrode paste Pending JPS6413790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170265A JPS6413790A (en) 1987-07-08 1987-07-08 Copper electrode paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170265A JPS6413790A (en) 1987-07-08 1987-07-08 Copper electrode paste

Publications (1)

Publication Number Publication Date
JPS6413790A true JPS6413790A (en) 1989-01-18

Family

ID=15901731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170265A Pending JPS6413790A (en) 1987-07-08 1987-07-08 Copper electrode paste

Country Status (1)

Country Link
JP (1) JPS6413790A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100504518B1 (en) * 2001-07-13 2005-08-03 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
WO2015015865A1 (en) * 2013-07-31 2015-02-05 株式会社村田製作所 Conductive paste, ceramic electronic component, and method for producing ceramic electronic component
US9113571B2 (en) 2012-06-22 2015-08-18 Murata Manufacturing Co., Ltd. Electronic component module and method for manufacturing the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4873762A (en) * 1972-01-04 1973-10-04
JPS5848987A (en) * 1981-06-03 1983-03-23 イ−・アイ・デユ・ポン・ドウ・ヌム−ル・アンド・カンパニ− Conductor composition for porcelain iron unit base
JPS6035405A (en) * 1983-06-20 1985-02-23 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− Copper conductor composition
JPS61183807A (en) * 1985-02-08 1986-08-16 松下電器産業株式会社 Metalized composition
JPS61183912A (en) * 1985-02-08 1986-08-16 ティーディーケイ株式会社 Ceramic electronic component and conducting composition
JPS61288484A (en) * 1985-06-17 1986-12-18 松下電器産業株式会社 Kneaded conductor for ceramic wiring board
JPS61289691A (en) * 1985-06-18 1986-12-19 松下電器産業株式会社 Metalized composition

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4873762A (en) * 1972-01-04 1973-10-04
JPS5848987A (en) * 1981-06-03 1983-03-23 イ−・アイ・デユ・ポン・ドウ・ヌム−ル・アンド・カンパニ− Conductor composition for porcelain iron unit base
JPS6035405A (en) * 1983-06-20 1985-02-23 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− Copper conductor composition
JPS61183807A (en) * 1985-02-08 1986-08-16 松下電器産業株式会社 Metalized composition
JPS61183912A (en) * 1985-02-08 1986-08-16 ティーディーケイ株式会社 Ceramic electronic component and conducting composition
JPS61288484A (en) * 1985-06-17 1986-12-18 松下電器産業株式会社 Kneaded conductor for ceramic wiring board
JPS61289691A (en) * 1985-06-18 1986-12-19 松下電器産業株式会社 Metalized composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100504518B1 (en) * 2001-07-13 2005-08-03 닛꼬 긴조꾸 가꼬 가부시키가이샤 Copper alloy foil for laminated sheet
US9113571B2 (en) 2012-06-22 2015-08-18 Murata Manufacturing Co., Ltd. Electronic component module and method for manufacturing the same
WO2015015865A1 (en) * 2013-07-31 2015-02-05 株式会社村田製作所 Conductive paste, ceramic electronic component, and method for producing ceramic electronic component
JP6020728B2 (en) * 2013-07-31 2016-11-02 株式会社村田製作所 Conductive paste, ceramic electronic component, and method of manufacturing ceramic electronic component

Similar Documents

Publication Publication Date Title
AU524998B2 (en) Homogeneous brazing foils of cu. based metallic glasses
GB1496994A (en) Pastes for forming electrically conductive films on non-conductive substrates
JPS643903A (en) Thin copper wire for electronic devices and manufacture thereof
JPS6413790A (en) Copper electrode paste
JPS5521561A (en) Electric contact material
JPS57108235A (en) Copper alloy for lead frame
JPS5481777A (en) Lead frame structure with intermediate layer
JPS5757886A (en) Heat resistant silver coated conductor
ES8501276A1 (en) Solder alloys for brazing contact materials.
JPS57181342A (en) Electrical contact material for sealing
JPS51138522A (en) Solderable copper alloy having high electric conductivity
JPS5516429A (en) Electrode for ga1-x a xas
JPS55108850A (en) Preparation of indole or indole derivative
JPS53103926A (en) Copper alloy for electric conductor of stable contact resistance and its manufacture
JPS5740572A (en) Electrical conductive adhesive
JPS5215289A (en) Method of manufacturing ultraconductive hollow conductor
JPS5658940A (en) Electrical contact material
JPS5592783A (en) Zinc sulfide-based ceramic fluorescent material, and its preparation
JPS5541939A (en) Copper alloy for connecting wire
JPS57145955A (en) Thin copper alloy wire with high strength and flexibility
JPS56116845A (en) Contact material
JPS55125259A (en) Glass sealing alloy
JPS6443911A (en) Superconductive wire material
Lamakin Treatment of Aluminum--Magnesium Alloys Prior to Soldering
JPS5248518A (en) Manufacturing method of silver-metal nitride contact material