KR900003914A - 낮은 유전 상수 조성물 - Google Patents
낮은 유전 상수 조성물 Download PDFInfo
- Publication number
- KR900003914A KR900003914A KR1019890012009A KR890012009A KR900003914A KR 900003914 A KR900003914 A KR 900003914A KR 1019890012009 A KR1019890012009 A KR 1019890012009A KR 890012009 A KR890012009 A KR 890012009A KR 900003914 A KR900003914 A KR 900003914A
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- South Korea
- Prior art keywords
- composition
- mixture
- organic
- green tape
- zinc
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims 14
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 5
- 229910052810 boron oxide Inorganic materials 0.000 claims 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims 3
- 230000004907 flux Effects 0.000 claims 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims 3
- 239000011787 zinc oxide Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010954 inorganic particle Substances 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 229920005596 polymer binder Polymers 0.000 claims 1
- 239000002491 polymer binding agent Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 229910021489 α-quartz Inorganic materials 0.000 claims 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/002—Producing shaped prefabricated articles from the material assembled from preformed elements
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- B32—LAYERED PRODUCTS
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (11)
- (a) 70-85중량 %의 실리카 및 (b)15-30중량 %의 아연 보레이트 플럭스로 필수적으로 구성된 미분된 입자의 혼합물인, 5.0이하의 유전상수를 갖는 세라믹 유전체를 형성하기 위한 알카리가 없는 조성물.
- 제1항에 있어서, 아연 보레이트 플럭스가 필수적으로 산화 아연과 산화 붕소로 구성되고 산화아연 대산화붕소의 몰비가 3/1 내지 1/1의 범위인 조성물.
- 제2항에 있어서, 산화 아연대 산화 붕소의 몰비가 아연 보레이트 플럭스내에서 2/1인 조성율.
- 제1항에 있어서, 실리카가 알파-석영인 조성물.
- 제1항에 있어서, 1.5 내지 8.5ppm/℃의 열팽창 계수를 갖는 조성물.
- 제1항에 있어서, 미분된 입자의 혼합물이 유기 매체내에 분산된 조성물.
- 제6항에 있어서, 유기 매체가 유기용매 내에 용해된 중합체 결합체로 구성된 조성물.
- 제7항에 있어서, 유기 용매가 휘발성 용매이고 분산액이 성형 가능한 점성도를 갖는 조성물.
- 휘발성 용매가 제거된 제7항의 조성물 층으로 구성된 유전 그린 테이프.
- 유기 물질의 휘발을 수행하기 위해 낮은 산소함량을 갖는 분위기에서 소화되고, 무기 입자를 소결처리하고 혼합물을 치밀화시킨, 그내에 인쇄된 두꺼운 필름 구리 전극층을 갖는 다수의 제9항의 그린 테이프 층으로 구성된 다층 축전기.
- 유기물질의 휘발을 수행하기 위해 낮은 산소 함량을 갖는 분위기에서 소화되고 무기 입자를 소결시키고 혼합물을 치밀화시킨, 그내에 상호접속된 구리 컨덕터 층을 갖는 다수의 제9항의 그린 테이프 층으로 구성된 다층 세라믹 기관.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US236,072 | 1981-02-25 | ||
US07/236,072 US4879261A (en) | 1987-01-13 | 1988-08-23 | Low Dielectric constant compositions |
US88-236,072 | 1988-08-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900003914A true KR900003914A (ko) | 1990-03-27 |
KR0151847B1 KR0151847B1 (ko) | 1998-10-15 |
Family
ID=22888025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890012009A KR0151847B1 (ko) | 1988-08-23 | 1989-08-22 | 낮은 유전율 조성물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4879261A (ko) |
EP (1) | EP0355756A1 (ko) |
JP (1) | JP2950861B2 (ko) |
KR (1) | KR0151847B1 (ko) |
RU (1) | RU1809932C (ko) |
Families Citing this family (26)
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US5393604A (en) * | 1988-01-28 | 1995-02-28 | Mcdonnell Douglas Corporation | Production of silica "green" tape and co-fired silica substrates therefrom |
US5011804A (en) * | 1990-02-28 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Ceramic dielectric compositions and method for improving sinterability |
US5071793A (en) * | 1990-08-23 | 1991-12-10 | Aluminum Company Of America | Low dielectric inorganic composition for multilayer ceramic package |
US5260119A (en) * | 1990-08-23 | 1993-11-09 | Aluminum Company Of America | Low dielectric inorganic composition for multilayer ceramic package |
US5206190A (en) * | 1990-09-04 | 1993-04-27 | Aluminum Company Of America | Dielectric composition containing cordierite and glass |
US5079194A (en) * | 1990-10-11 | 1992-01-07 | Aluminum Company Of America | Crystal growth inhibitor for glassy low dielectric inorganic composition |
US5118643A (en) * | 1990-10-25 | 1992-06-02 | Aluminum Company Of America | Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass |
US5141899A (en) * | 1991-08-26 | 1992-08-25 | Aluminum Company Of America | Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass and crystal inhibitor |
US5177034A (en) * | 1991-11-04 | 1993-01-05 | Aluminum Company Of America | Gallium crystal growth inhibitor for glassy low dielectric inorganic composition |
US5316985A (en) * | 1991-12-09 | 1994-05-31 | Aluminum Company Of America | Suppression of crystal growth in low dielectric inorganic composition using ultrafine alumina |
JP3350949B2 (ja) * | 1992-02-20 | 2002-11-25 | 株式会社村田製作所 | 導電性ペースト |
US5226959A (en) * | 1992-03-16 | 1993-07-13 | Aluminum Company Of America | Gallium-containing glassy low dielectric ceramic compositions |
US5264399A (en) * | 1992-04-28 | 1993-11-23 | International Business Machines Corporation | Ceramic composite body |
US5312784A (en) * | 1992-08-07 | 1994-05-17 | Aluminum Company Of America | Devitrification inhibitor in low dielectric borosilicate glass |
US5270268A (en) * | 1992-09-23 | 1993-12-14 | Aluminum Company Of America | Aluminum borate devitrification inhibitor in low dielectric borosilicate glass |
TW396350B (en) * | 1996-12-04 | 2000-07-01 | Nat Science Council | Dielectric composition, slurry for use in the tape casting process, porcess for producing a ceramic product and process for preparing multilayer ceramic package |
US6572814B2 (en) * | 1998-09-08 | 2003-06-03 | Applied Materials Inc. | Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas |
US6174829B1 (en) | 1999-01-07 | 2001-01-16 | Advanced Ceramic X Corp. | Ceramic dielectric compositions |
US6159883A (en) * | 1999-01-07 | 2000-12-12 | Advanced Ceramic X Corp. | Ceramic dielectric compositions |
DE10054812A1 (de) * | 2000-11-04 | 2002-05-08 | Philips Corp Intellectual Pty | Keramikkondensator mit CZT-Dielektrikum |
US6844278B2 (en) * | 2001-09-18 | 2005-01-18 | Aem, Inc. | Dense lead-free glass ceramic for electronic devices |
GB2415948A (en) * | 2004-07-03 | 2006-01-11 | Ebac Ltd | Bottled liquid dispenser |
KR100650319B1 (ko) | 2004-11-03 | 2006-11-27 | 신유선 | 적층 세라믹 칩 및 적층 세라믹 캐패시터의 형성방법 |
US9093295B2 (en) * | 2013-11-13 | 2015-07-28 | Qualcomm Incorporated | Embedded sheet capacitor |
JP5766336B1 (ja) * | 2014-06-16 | 2015-08-19 | 株式会社マテリアル・コンセプト | 銅ペーストの焼成方法 |
EP3520126A4 (en) * | 2016-09-27 | 2020-05-27 | Perkinelmer Health Sciences Canada, Inc | RADIO FREQUENCY CAPACITORS AND GENERATORS AND OTHER DEVICES USING THE SAME |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE594815C (de) * | 1930-10-14 | 1934-03-22 | Aeg | Elektrischer Isolierstoff |
US4387131A (en) * | 1971-06-30 | 1983-06-07 | International Business Machines Corporation | Ceramic dielectrics |
SU480659A1 (ru) * | 1972-07-10 | 1975-08-15 | Организация П/Я Х-5263 | Легкоплавкий стеклоцемент |
US3970464A (en) * | 1975-02-10 | 1976-07-20 | Owens-Illinois, Inc. | Silica-free, alkali metal-free and lead-free sealing glasses |
JPS5399768A (en) * | 1977-02-10 | 1978-08-31 | Hitachi Ltd | Glass composition for surface stabilization of semiconductor element |
JPS60235744A (ja) * | 1984-05-04 | 1985-11-22 | Asahi Glass Co Ltd | セラミック基板用組成物 |
JPS60250686A (ja) * | 1984-05-25 | 1985-12-11 | 日本碍子株式会社 | セラミツク配線基板の製造方法 |
US4655864A (en) * | 1985-03-25 | 1987-04-07 | E. I. Du Pont De Nemours And Company | Dielectric compositions and method of forming a multilayer interconnection using same |
US4654095A (en) * | 1985-03-25 | 1987-03-31 | E. I. Du Pont De Nemours And Company | Dielectric composition |
US4752531A (en) * | 1985-03-25 | 1988-06-21 | E. I. Du Pont De Nemours And Company | Dielectric composition |
JPS6246937A (ja) * | 1985-08-24 | 1987-02-28 | Kyocera Corp | 多層配線基板の低誘電率セラミツクス製造用組成物及び低誘電率セラミツクスを製造する方法 |
US4766027A (en) * | 1987-01-13 | 1988-08-23 | E. I. Du Pont De Nemours And Company | Method for making a ceramic multilayer structure having internal copper conductors |
-
1988
- 1988-08-23 US US07/236,072 patent/US4879261A/en not_active Expired - Lifetime
-
1989
- 1989-08-19 EP EP89115332A patent/EP0355756A1/en not_active Withdrawn
- 1989-08-22 KR KR1019890012009A patent/KR0151847B1/ko not_active IP Right Cessation
- 1989-08-22 RU SU894614949A patent/RU1809932C/ru active
- 1989-08-23 JP JP1215136A patent/JP2950861B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
RU1809932C (ru) | 1993-04-15 |
JP2950861B2 (ja) | 1999-09-20 |
US4879261A (en) | 1989-11-07 |
JPH02160659A (ja) | 1990-06-20 |
EP0355756A1 (en) | 1990-02-28 |
KR0151847B1 (ko) | 1998-10-15 |
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