KR900003914A - 낮은 유전 상수 조성물 - Google Patents

낮은 유전 상수 조성물 Download PDF

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KR900003914A
KR900003914A KR1019890012009A KR890012009A KR900003914A KR 900003914 A KR900003914 A KR 900003914A KR 1019890012009 A KR1019890012009 A KR 1019890012009A KR 890012009 A KR890012009 A KR 890012009A KR 900003914 A KR900003914 A KR 900003914A
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composition
mixture
organic
green tape
zinc
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KR1019890012009A
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KR0151847B1 (ko
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버언 이언
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이 아이 듀우판 디 네모아 앤드 캄파니
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Abstract

내용 없음

Description

낮은 유전 상수 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

  1. (a) 70-85중량 %의 실리카 및 (b)15-30중량 %의 아연 보레이트 플럭스로 필수적으로 구성된 미분된 입자의 혼합물인, 5.0이하의 유전상수를 갖는 세라믹 유전체를 형성하기 위한 알카리가 없는 조성물.
  2. 제1항에 있어서, 아연 보레이트 플럭스가 필수적으로 산화 아연과 산화 붕소로 구성되고 산화아연 대산화붕소의 몰비가 3/1 내지 1/1의 범위인 조성물.
  3. 제2항에 있어서, 산화 아연대 산화 붕소의 몰비가 아연 보레이트 플럭스내에서 2/1인 조성율.
  4. 제1항에 있어서, 실리카가 알파-석영인 조성물.
  5. 제1항에 있어서, 1.5 내지 8.5ppm/℃의 열팽창 계수를 갖는 조성물.
  6. 제1항에 있어서, 미분된 입자의 혼합물이 유기 매체내에 분산된 조성물.
  7. 제6항에 있어서, 유기 매체가 유기용매 내에 용해된 중합체 결합체로 구성된 조성물.
  8. 제7항에 있어서, 유기 용매가 휘발성 용매이고 분산액이 성형 가능한 점성도를 갖는 조성물.
  9. 휘발성 용매가 제거된 제7항의 조성물 층으로 구성된 유전 그린 테이프.
  10. 유기 물질의 휘발을 수행하기 위해 낮은 산소함량을 갖는 분위기에서 소화되고, 무기 입자를 소결처리하고 혼합물을 치밀화시킨, 그내에 인쇄된 두꺼운 필름 구리 전극층을 갖는 다수의 제9항의 그린 테이프 층으로 구성된 다층 축전기.
  11. 유기물질의 휘발을 수행하기 위해 낮은 산소 함량을 갖는 분위기에서 소화되고 무기 입자를 소결시키고 혼합물을 치밀화시킨, 그내에 상호접속된 구리 컨덕터 층을 갖는 다수의 제9항의 그린 테이프 층으로 구성된 다층 세라믹 기관.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890012009A 1988-08-23 1989-08-22 낮은 유전율 조성물 KR0151847B1 (ko)

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US236,072 1981-02-25
US07/236,072 US4879261A (en) 1987-01-13 1988-08-23 Low Dielectric constant compositions
US88-236,072 1988-08-23

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Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5393604A (en) * 1988-01-28 1995-02-28 Mcdonnell Douglas Corporation Production of silica "green" tape and co-fired silica substrates therefrom
US5011804A (en) * 1990-02-28 1991-04-30 E. I. Du Pont De Nemours And Company Ceramic dielectric compositions and method for improving sinterability
US5071793A (en) * 1990-08-23 1991-12-10 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package
US5260119A (en) * 1990-08-23 1993-11-09 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package
US5206190A (en) * 1990-09-04 1993-04-27 Aluminum Company Of America Dielectric composition containing cordierite and glass
US5079194A (en) * 1990-10-11 1992-01-07 Aluminum Company Of America Crystal growth inhibitor for glassy low dielectric inorganic composition
US5118643A (en) * 1990-10-25 1992-06-02 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass
US5141899A (en) * 1991-08-26 1992-08-25 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass and crystal inhibitor
US5177034A (en) * 1991-11-04 1993-01-05 Aluminum Company Of America Gallium crystal growth inhibitor for glassy low dielectric inorganic composition
US5316985A (en) * 1991-12-09 1994-05-31 Aluminum Company Of America Suppression of crystal growth in low dielectric inorganic composition using ultrafine alumina
JP3350949B2 (ja) * 1992-02-20 2002-11-25 株式会社村田製作所 導電性ペースト
US5226959A (en) * 1992-03-16 1993-07-13 Aluminum Company Of America Gallium-containing glassy low dielectric ceramic compositions
US5264399A (en) * 1992-04-28 1993-11-23 International Business Machines Corporation Ceramic composite body
US5312784A (en) * 1992-08-07 1994-05-17 Aluminum Company Of America Devitrification inhibitor in low dielectric borosilicate glass
US5270268A (en) * 1992-09-23 1993-12-14 Aluminum Company Of America Aluminum borate devitrification inhibitor in low dielectric borosilicate glass
TW396350B (en) * 1996-12-04 2000-07-01 Nat Science Council Dielectric composition, slurry for use in the tape casting process, porcess for producing a ceramic product and process for preparing multilayer ceramic package
US6572814B2 (en) * 1998-09-08 2003-06-03 Applied Materials Inc. Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
US6174829B1 (en) 1999-01-07 2001-01-16 Advanced Ceramic X Corp. Ceramic dielectric compositions
US6159883A (en) * 1999-01-07 2000-12-12 Advanced Ceramic X Corp. Ceramic dielectric compositions
DE10054812A1 (de) * 2000-11-04 2002-05-08 Philips Corp Intellectual Pty Keramikkondensator mit CZT-Dielektrikum
US6844278B2 (en) * 2001-09-18 2005-01-18 Aem, Inc. Dense lead-free glass ceramic for electronic devices
GB2415948A (en) * 2004-07-03 2006-01-11 Ebac Ltd Bottled liquid dispenser
KR100650319B1 (ko) 2004-11-03 2006-11-27 신유선 적층 세라믹 칩 및 적층 세라믹 캐패시터의 형성방법
US9093295B2 (en) * 2013-11-13 2015-07-28 Qualcomm Incorporated Embedded sheet capacitor
JP5766336B1 (ja) * 2014-06-16 2015-08-19 株式会社マテリアル・コンセプト 銅ペーストの焼成方法
EP3520126A4 (en) * 2016-09-27 2020-05-27 Perkinelmer Health Sciences Canada, Inc RADIO FREQUENCY CAPACITORS AND GENERATORS AND OTHER DEVICES USING THE SAME

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE594815C (de) * 1930-10-14 1934-03-22 Aeg Elektrischer Isolierstoff
US4387131A (en) * 1971-06-30 1983-06-07 International Business Machines Corporation Ceramic dielectrics
SU480659A1 (ru) * 1972-07-10 1975-08-15 Организация П/Я Х-5263 Легкоплавкий стеклоцемент
US3970464A (en) * 1975-02-10 1976-07-20 Owens-Illinois, Inc. Silica-free, alkali metal-free and lead-free sealing glasses
JPS5399768A (en) * 1977-02-10 1978-08-31 Hitachi Ltd Glass composition for surface stabilization of semiconductor element
JPS60235744A (ja) * 1984-05-04 1985-11-22 Asahi Glass Co Ltd セラミック基板用組成物
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
US4655864A (en) * 1985-03-25 1987-04-07 E. I. Du Pont De Nemours And Company Dielectric compositions and method of forming a multilayer interconnection using same
US4654095A (en) * 1985-03-25 1987-03-31 E. I. Du Pont De Nemours And Company Dielectric composition
US4752531A (en) * 1985-03-25 1988-06-21 E. I. Du Pont De Nemours And Company Dielectric composition
JPS6246937A (ja) * 1985-08-24 1987-02-28 Kyocera Corp 多層配線基板の低誘電率セラミツクス製造用組成物及び低誘電率セラミツクスを製造する方法
US4766027A (en) * 1987-01-13 1988-08-23 E. I. Du Pont De Nemours And Company Method for making a ceramic multilayer structure having internal copper conductors

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JP2950861B2 (ja) 1999-09-20
US4879261A (en) 1989-11-07
JPH02160659A (ja) 1990-06-20
EP0355756A1 (en) 1990-02-28
KR0151847B1 (ko) 1998-10-15

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