KR830009646A - 반도체 소자 - Google Patents

반도체 소자 Download PDF

Info

Publication number
KR830009646A
KR830009646A KR1019820001382A KR820001382A KR830009646A KR 830009646 A KR830009646 A KR 830009646A KR 1019820001382 A KR1019820001382 A KR 1019820001382A KR 820001382 A KR820001382 A KR 820001382A KR 830009646 A KR830009646 A KR 830009646A
Authority
KR
South Korea
Prior art keywords
semiconductor film
hydrogen
polycrystalline
lithium
content
Prior art date
Application number
KR1019820001382A
Other languages
English (en)
Other versions
KR860001161B1 (ko
Inventor
요시후미 가다야마
도시가즈 시마다
에이이찌 마루야마
Original Assignee
미다 가쓰시게루(三田勝茂)
가부시기 가이샤 히다찌 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미다 가쓰시게루(三田勝茂), 가부시기 가이샤 히다찌 세이사꾸쇼 filed Critical 미다 가쓰시게루(三田勝茂)
Publication of KR830009646A publication Critical patent/KR830009646A/ko
Application granted granted Critical
Publication of KR860001161B1 publication Critical patent/KR860001161B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02425Conductive materials, e.g. metallic silicides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02576N-type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02579P-type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/167Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System further characterised by the doping material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78672Polycrystalline or microcrystalline silicon transistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78684Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0368Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
    • H01L31/03682Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors including only elements of Group IV of the Periodic System
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/958Passivation layer

Abstract

내용 없음

Description

반도체 소자
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도에서 7도는 본 발명의 반도체 소자에서 중요한 부분의 단면도이다.

Claims (16)

  1. 다결정 반도체막이 수소, 불소, 염소, 브롬, 요오드, 리튬, 나트륨, 칼륨, 루비듐, 세슘 등의 원소중 최소한 하나의 원소를 포함하여 원소의 총 함유량이 반도체막 평균의 원자비로 100ppm에서 40%까지 대체로 한정지어지는 결정면의 결정 경계를 갖도록 하여서 몸체의 기판상에 형성된 반도체소자.
  2. 제1항에 있어서 반도체 소자의 다결정 반도체막이 주로 실리콘으로 만들어진 반도체 소자.
  3. 제1항 및 2항에 있어서 다결정 반도체막이 불소, 염소, 브롬, 요오드로 구성되는 할로겐원소중 하나의 원소와 수소, 리튬, 나트륨, 칼륨, 리튬, 세슘으로 구성되는 원소중 최소한 하나의 원소를 포함하는 반도체 소자.
  4. 제3항에 있어서 할로겐 원소의 함유량과 수소나 1가 금속원소의 함유량이 각각100ppm에서 10%까지의 원자비로 하는 반도체 소자.
  5. 최소한 반도체막과 게이트 전극 사이에 있는 처음과 두번째의 불순물 지역에서는, 다결정 반도체막이 수소, 불소, 염소, 브롬, 요오드, 리튬, 나트륨, 칼륨, 루비듐, 세슘등으로 구성되는 원소중에서 선택된 최소한 하나의 원소를 포함하여 그 포함된 원소의 총함유량이 반도체막의 평균적인 원자비가 100pm에서 40%까지 대체로 한정되는 결정면 경계를 갖도록하여서 기판상에 형성된 전계효과 트랜지스터.
  6. 제5항에 있어서 다결정 반도체막이 주로 실리콘으로 만들어진 전계효과 트랜지스터.
  7. 제5항 및 제6항에 있어서 다결정 반도체막이 불소, 염소, 브롬, 요오드로 구성되는 할로겐 원소중 선택된 최소한 하나의 원소와 수소, 리튬, 나트륨, 칼륨, 루비듐, 세슘으로 구성된 원소중에서 선택된 최소한 하나의 원소를 포함하여서 된 전계효과 트랜지스터.
  8. 제7항에 있어서 할로겐 원소의 함유량과 수소와 1가 금속원소의 함유량이 각각 원자비로 100ppm에서 10%로 하는 전계효과 트랜지스터.
  9. 기판과, 주로 실리콘으로 구성된 다결정 실리콘 박막과, 실리콘 박막의 양 반대면에 처음의 투명전극과 두번째의 전극을 갖고 있으며 그리고 빛을 쪼일때 나오는 양과 음의 캐리어를 구별하는데 사용되는 실리콘 박막의 접합부분을 갖고 있되, 그곳에 상기 다결정 실리콘 박막이 수소, 불소, 염소, 브롬, 요오드, 리튬, 나트륨, 칼륨, 루비듐, 세슘으로 구성된 원소중에서 선택된 최소한 하나의 원소를 포함하여 포함된 원소의 총 함유량이 반도체막의 평균적인 원자비로 100ppm에서 40%까지 대체로 한정된 결정면 경계를 갖도록 하여서 된 박막태양전지.
  10. 제9항에 있어서, 다결정 박막이 주로 실리콘으로 만들어진 박막태양전지.
  11. 제9항 및 제10항에 있어서 상기 다결정 박막이 불소, 염소, 브롬, 요오드로 구성된 할로겐 원소중에서 선택된 최소한 하나의 원소와, 수소, 리튬, 나트륨, 칼륨, 루비듐, 세슘등의 원소중에서 선택된 최소한 하나의 원소를 포함하여서 된 박막태양전지.
  12. 제11항에 있어서 상기 할로겐 원소의 함유량과 수소나 1가 속원소의 함유량이 각각 100ppm에서 10%의 원자비로 하는 박막태양전지.
  13. 기판상에 형성된 다결정 반도체막과, pn접합의 반대측에 처음과 두번째 전극이 있어 반도체막에 형성된 상기 pn접합을 갖고 있되 그곳의 다결정 반도체막이 수소,불소, 염소, 브롬, 요오드, 리튬, 나트륨, 칼륨, 루비듐, 세슘으로 구성되는 원소중에서 선택된 최소한 하나의 원소를 포함하여 그 포함된 원소의 총함유량이 반도체막의 평균적인 원자비로 100ppm에서 40%까지 대체로 한정된 결정 경계면을 갖도록 하여서된 다이오드.
  14. 제13항에 있어서, 다결정 반도체막이 주로 실리콘으로 구성되 있는 다이오드.
  15. 제13항 및 14항에 있어서 다결정 반도체막이 불소, 염소, 브롬, 요오드로 구성되는 원소중에서 선택된 최소한 하나의 할로겐원소와, 수소, 리튬, 나트륨, 칼륨, 루비듐, 세슘으로 구성되는 원소중 최소한 하나의 원소를 포함하고 있는 반도체소자.
  16. 제14항에 있어서 할로겐 원소의 함유량과 수소나 1가 금속원소의 함유량은 각각 100ppm에서의 10%의 원자비로 되어있는 반도체소자.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8201382A 1981-03-30 1982-03-30 반도체 장치 KR860001161B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP81-45553 1981-03-30
JP56045553A JPS57160123A (en) 1981-03-30 1981-03-30 Semiconductor device

Publications (2)

Publication Number Publication Date
KR830009646A true KR830009646A (ko) 1983-12-22
KR860001161B1 KR860001161B1 (ko) 1986-08-18

Family

ID=12722546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8201382A KR860001161B1 (ko) 1981-03-30 1982-03-30 반도체 장치

Country Status (6)

Country Link
US (1) US4613382A (ko)
EP (1) EP0061923B1 (ko)
JP (1) JPS57160123A (ko)
KR (1) KR860001161B1 (ko)
CA (1) CA1189940A (ko)
DE (1) DE3278527D1 (ko)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241959A1 (de) * 1981-11-13 1983-05-26 Canon K.K., Tokyo Halbleiterbauelement
DE3347997C2 (ko) * 1982-01-06 1991-01-24 Canon K.K., Tokio/Tokyo, Jp
DE3465831D1 (de) * 1983-06-17 1987-10-08 Texas Instruments Inc Polysilicon fets
US5111260A (en) * 1983-06-17 1992-05-05 Texax Instruments Incorporated Polysilicon FETs
US4670763A (en) * 1984-05-14 1987-06-02 Energy Conversion Devices, Inc. Thin film field effect transistor
US4727044A (en) 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
US4717681A (en) * 1986-05-19 1988-01-05 Texas Instruments Incorporated Method of making a heterojunction bipolar transistor with SIPOS
US4821091A (en) * 1986-07-22 1989-04-11 The United States Of America As Represented By The United States Department Of Energy Polysilicon photoconductor for integrated circuits
US4945065A (en) * 1988-06-02 1990-07-31 Mobil Solar Energy Corporation Method of passivating crystalline substrates
JPH0323639A (ja) * 1989-06-21 1991-01-31 Sony Corp 薄膜トランジスタ
JPH0388321A (ja) * 1989-08-31 1991-04-12 Tonen Corp 多結晶シリコン薄膜
US5051786A (en) * 1989-10-24 1991-09-24 Mcnc Passivated polycrystalline semiconductors quantum well/superlattice structures fabricated thereof
JPH0828379B2 (ja) * 1990-05-28 1996-03-21 株式会社東芝 半導体装置の製造方法
EP0459763B1 (en) * 1990-05-29 1997-05-02 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistors
JPH0611705A (ja) * 1992-01-31 1994-01-21 Sony Corp 能動素子基板
JPH06151801A (ja) * 1992-11-13 1994-05-31 Canon Inc 光電変換装置及び光電変換装置の製造方法
US5897346A (en) * 1994-02-28 1999-04-27 Semiconductor Energy Laboratory Co., Ltd. Method for producing a thin film transistor
US5620906A (en) 1994-02-28 1997-04-15 Semiconductor Energy Laboratory Co., Ltd. Method for producing semiconductor device by introducing hydrogen ions
KR100295718B1 (ko) * 1995-06-06 2001-09-03 아사히 가세이 마이크로시스템 가부시끼가이샤 반도체장치및그의제조방법
JPH09148581A (ja) * 1995-11-17 1997-06-06 Sharp Corp 薄膜半導体装置の製造方法
US5665611A (en) * 1996-01-31 1997-09-09 Micron Technology, Inc. Method of forming a thin film transistor using fluorine passivation
TW322591B (ko) * 1996-02-09 1997-12-11 Handotai Energy Kenkyusho Kk
US6936485B2 (en) * 2000-03-27 2005-08-30 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light emitting device
DE102005013537A1 (de) * 2004-03-24 2005-10-20 Sharp Kk Fotoelektrischer Wandler und Herstellverfahren für einen solchen
WO2009091502A1 (en) * 2008-01-15 2009-07-23 First Solar, Inc. Plasma-treated photovoltaic devices
US9299863B2 (en) * 2008-05-07 2016-03-29 The Hong Kong University Of Science And Technology Ultrathin film multi-crystalline photovoltaic device
US20120006395A1 (en) * 2010-07-08 2012-01-12 E. I. Du Pont De Nemours And Company Coated stainless steel substrate
JP2012019146A (ja) * 2010-07-09 2012-01-26 Sony Corp 撮像装置、表示撮像装置および電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4196438A (en) * 1976-09-29 1980-04-01 Rca Corporation Article and device having an amorphous silicon containing a halogen and method of fabrication
US4342044A (en) * 1978-03-08 1982-07-27 Energy Conversion Devices, Inc. Method for optimizing photoresponsive amorphous alloys and devices
US4217374A (en) * 1978-03-08 1980-08-12 Energy Conversion Devices, Inc. Amorphous semiconductors equivalent to crystalline semiconductors
US4178415A (en) * 1978-03-22 1979-12-11 Energy Conversion Devices, Inc. Modified amorphous semiconductors and method of making the same
US4239554A (en) * 1978-07-17 1980-12-16 Shunpei Yamazaki Semiconductor photoelectric conversion device
JPS55151374A (en) * 1979-05-14 1980-11-25 Shunpei Yamazaki Semiconductor device
JPS55151329A (en) * 1979-05-14 1980-11-25 Shunpei Yamazaki Fabricating method of semiconductor device

Also Published As

Publication number Publication date
US4613382A (en) 1986-09-23
DE3278527D1 (en) 1988-06-23
EP0061923A1 (en) 1982-10-06
JPS57160123A (en) 1982-10-02
KR860001161B1 (ko) 1986-08-18
JPH0363208B2 (ko) 1991-09-30
CA1189940A (en) 1985-07-02
EP0061923B1 (en) 1988-05-18

Similar Documents

Publication Publication Date Title
KR830009646A (ko) 반도체 소자
KR840008541A (ko) 협 밴드갭 광전지장치
KR870004496A (ko) 반도체 기억 장치
KR970030912A (ko) 반도체 장치의 제조방법 및 반도체 장치
JPS5495116A (en) Solid image pickup unit
KR860009489A (ko) 반도체 집적회로장치 및 그 제조방법
JPS5645087A (en) Semiconductor device
JPS5575264A (en) Charge transfer element
JPS5526666A (en) Insulated gate type semiconductor device
JPS5548964A (en) High-voltage-resisting planar semiconductor device
JPS57104253A (en) Semiconductor memory device
JPS5539688A (en) Integrated circuit device of semiconductors
JPS5498581A (en) Manufacture of field effect transistor
KR870010544A (ko) 반도체 기억장치 및 그 제조 방법
JPS5567160A (en) Semiconductor memory storage
JPS57192070A (en) Semiconductor memory unit
JPS56104461A (en) Semiconductor memory device
JPS5621380A (en) Photosemiconductor device
JPS574173A (en) Semiconductor device
JPS5632767A (en) Mos inverter
JPS5753182A (en) Solid-state image pickup device
JPS5698855A (en) Semiconductor memory device
JPS5582460A (en) Negative resistance semiconductor element
JPS5346287A (en) Production of semiconductor integrated circuit
JPS5357778A (en) Semiconductor memory