JPS57192070A - Semiconductor memory unit - Google Patents

Semiconductor memory unit

Info

Publication number
JPS57192070A
JPS57192070A JP56076584A JP7658481A JPS57192070A JP S57192070 A JPS57192070 A JP S57192070A JP 56076584 A JP56076584 A JP 56076584A JP 7658481 A JP7658481 A JP 7658481A JP S57192070 A JPS57192070 A JP S57192070A
Authority
JP
Japan
Prior art keywords
substrate
specific resistance
element part
memory cell
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56076584A
Other languages
Japanese (ja)
Inventor
Masatoshi Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56076584A priority Critical patent/JPS57192070A/en
Publication of JPS57192070A publication Critical patent/JPS57192070A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells

Landscapes

  • Semiconductor Memories (AREA)

Abstract

PURPOSE:To enlarge intensity against radiation of alpha rays, etc., and to prevent the erroneous operation of a semiconductor memory unit by a method wherein specific resistance of a semiconductor substrate at the memory element part is reduced selectively than that at the circumferential circuit element part, and the extension of depletion layer at the memory element part is suppressed and junction capacity thereof is enlaged. CONSTITUTION:At a memory cell M-CEL of a dynamic RAM, for example, the low resistance P<+> type semiconductor region 2 having specific resistance 0.1- 1.0OMEGAcm is formed by the ion implantation technique, etc., on the one main face side of a single crystal Si substrate 1 having specific resistance 10OMEGAcm, and an N<+> type source region 3 and drain region 4, a polycrystalline Si gate electrode 5, and a capacitor CP formed by making a polycrystalline Si film 6 as an electrode on one side and moreover making a gate SiO2 film 7 as a dielectric film, are provided repsectively on the region 2 thereof. Specific resistance of substrate of the memory cell M-CEL is reduced by 1-2 figures than specific resistance of the substrate 1 by this way, and at the same time at the circumferential circuit element part, an MISFET QD is provided on the substrate 1 for driving and for input/output of the memory cell part.
JP56076584A 1981-05-22 1981-05-22 Semiconductor memory unit Pending JPS57192070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076584A JPS57192070A (en) 1981-05-22 1981-05-22 Semiconductor memory unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076584A JPS57192070A (en) 1981-05-22 1981-05-22 Semiconductor memory unit

Publications (1)

Publication Number Publication Date
JPS57192070A true JPS57192070A (en) 1982-11-26

Family

ID=13609326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076584A Pending JPS57192070A (en) 1981-05-22 1981-05-22 Semiconductor memory unit

Country Status (1)

Country Link
JP (1) JPS57192070A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222506A1 (en) * 1985-10-11 1987-05-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory
US4903094A (en) * 1986-08-26 1990-02-20 General Electric Company Memory cell structure having radiation hardness
US5079613A (en) * 1987-07-10 1992-01-07 Kabushiki Kaisha Toshiba Semiconductor device having different impurity concentration wells
US5268321A (en) * 1985-12-20 1993-12-07 Mitsubishi Denki Kabushiki Kaisha Method of making DRAM cell having improved radiation protection

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222506A1 (en) * 1985-10-11 1987-05-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory
US5268321A (en) * 1985-12-20 1993-12-07 Mitsubishi Denki Kabushiki Kaisha Method of making DRAM cell having improved radiation protection
US4903094A (en) * 1986-08-26 1990-02-20 General Electric Company Memory cell structure having radiation hardness
US5079613A (en) * 1987-07-10 1992-01-07 Kabushiki Kaisha Toshiba Semiconductor device having different impurity concentration wells
EP0509565A2 (en) * 1987-07-10 1992-10-21 Kabushiki Kaisha Toshiba Semiconductor device having different impurity concentration wells

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