KR20230051434A - 경화성 수지, 경화성 수지 조성물 및 경화물 - Google Patents

경화성 수지, 경화성 수지 조성물 및 경화물 Download PDF

Info

Publication number
KR20230051434A
KR20230051434A KR1020227046247A KR20227046247A KR20230051434A KR 20230051434 A KR20230051434 A KR 20230051434A KR 1020227046247 A KR1020227046247 A KR 1020227046247A KR 20227046247 A KR20227046247 A KR 20227046247A KR 20230051434 A KR20230051434 A KR 20230051434A
Authority
KR
South Korea
Prior art keywords
group
curable resin
resin composition
general formula
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227046247A
Other languages
English (en)
Korean (ko)
Inventor
류이치 마츠오카
리첸 양
히로요시 간나리
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20230051434A publication Critical patent/KR20230051434A/ko
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91Polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/19Hydroxy compounds containing aromatic rings
    • C08G63/193Hydroxy compounds containing aromatic rings containing two or more aromatic rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/04Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/199Acids or hydroxy compounds containing cycloaliphatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/46Polyesters chemically modified by esterification
    • C08G63/47Polyesters chemically modified by esterification by unsaturated monocarboxylic acids or unsaturated monohydric alcohols or reactive derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/66Polyesters containing oxygen in the form of ether groups
    • C08G63/668Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/672Dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/78Preparation processes
    • C08G63/81Preparation processes using solvents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91Polymers modified by chemical after-treatment
    • C08G63/914Polymers modified by chemical after-treatment derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/916Dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/04Aromatic polycarbonates
    • C08G64/06Aromatic polycarbonates not containing aliphatic unsaturation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/04Aromatic polycarbonates
    • C08G64/06Aromatic polycarbonates not containing aliphatic unsaturation
    • C08G64/14Aromatic polycarbonates not containing aliphatic unsaturation containing a chain-terminating or -crosslinking agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/20General preparatory processes
    • C08G64/30General preparatory processes using carbonates
    • C08G64/307General preparatory processes using carbonates and phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/42Chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313Phosphinic compounds, e.g. R2=P(:O)OR'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/53Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333Esters of phosphonic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D167/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C09D167/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl - and the hydroxy groups directly linked to aromatic rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D169/00Coating compositions based on polycarbonates; Coating compositions based on derivatives of polycarbonates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2150/00Compositions for coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08J2367/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
KR1020227046247A 2020-08-19 2021-06-24 경화성 수지, 경화성 수지 조성물 및 경화물 Pending KR20230051434A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2020-138860 2020-08-19
JP2020138860 2020-08-19
JPJP-P-2020-214063 2020-12-23
JP2020214063 2020-12-23
PCT/JP2021/023889 WO2022038893A1 (ja) 2020-08-19 2021-06-24 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

Publications (1)

Publication Number Publication Date
KR20230051434A true KR20230051434A (ko) 2023-04-18

Family

ID=80323625

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227046247A Pending KR20230051434A (ko) 2020-08-19 2021-06-24 경화성 수지, 경화성 수지 조성물 및 경화물

Country Status (6)

Country Link
US (1) US12157793B2 (https=)
JP (2) JP7229422B2 (https=)
KR (1) KR20230051434A (https=)
CN (1) CN116157270B (https=)
TW (1) TWI878590B (https=)
WO (1) WO2022038893A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7306599B2 (ja) * 2021-07-29 2023-07-11 Dic株式会社 硬化性樹脂組成物、および、硬化物
WO2023089976A1 (ja) * 2021-11-18 2023-05-25 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP7767910B2 (ja) * 2021-12-23 2025-11-12 Dic株式会社 硬化性樹脂組成物、硬化物及び物品
JP7771734B2 (ja) * 2021-12-23 2025-11-18 Dic株式会社 硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
WO2024085159A1 (ja) 2022-10-18 2024-04-25 ソフトバンクグループ株式会社 作業ロボット調整方法、センシングシステム、センシング方法、移動式ロボット、動作改変システム、動作改変方法、作業ロボット、作業再現システム、作業再現方法、作業習熟システム、作業習熟方法及び作業再現ロボット
TWI830468B (zh) * 2022-10-28 2024-01-21 南亞塑膠工業股份有限公司 含乙烯基芳香脂環族共聚合物、樹脂組成物及其製品
TWI821053B (zh) * 2022-11-29 2023-11-01 上緯創新育成股份有限公司 含碳酸酯之寡聚物、其製備方法及固化物
TW202502893A (zh) 2023-05-10 2025-01-16 日商味之素股份有限公司 樹脂組成物
JP7823627B2 (ja) 2023-05-19 2026-03-04 味の素株式会社 樹脂組成物
CN118515537B (zh) * 2024-05-10 2025-04-11 山东星顺新材料有限公司 一种改性双乙烯基苯树脂及其制备方法和应用、热固性高分子材料及其制备方法和应用
CN121270603A (zh) * 2025-12-10 2026-01-06 广东顺德同程新材料科技有限公司 一种基于次磷酸衍生物与低聚席夫碱的氮磷膨胀型阻燃剂及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368537A (ja) 1986-09-03 1988-03-28 ザ・ダウ・ケミカル・カンパニー 新規な多数のビニルベンジルエーテル基を含有するモノマーおよびオリゴマー,その製造方法およびそれからつくられたキュア生成物
JPS6465110A (en) 1987-09-04 1989-03-10 Showa Highpolymer Curable resin composition
JP4320171B2 (ja) 2000-07-10 2009-08-26 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ 官能化ポリフェニレンエーテル樹脂を製造するための組成物及び方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125215A (en) * 1981-01-27 1982-08-04 Unitika Ltd Preparation of polyester containing unsaturated terminal group
JPS58157844A (ja) * 1982-03-16 1983-09-20 Unitika Ltd 樹脂組成物
JPS58225113A (ja) * 1982-06-22 1983-12-27 Unitika Ltd ポリエステル・ポリオレフイン系共重合体の製造法
JP3121626B2 (ja) * 1991-03-28 2001-01-09 株式会社ネオス 含フッ素ポリアリレート
US6043334A (en) 1995-12-04 2000-03-28 Idemitsu Kosan Co., Ltd. Polycarbonate resin, crosslinked polycarbonate resin and electrophotographic photoreceptor
JP4017769B2 (ja) * 1997-10-07 2007-12-05 株式会社クラレ プリント配線基板基材およびその製造方法
US6897282B2 (en) 2000-07-10 2005-05-24 General Electric Compositions comprising functionalized polyphenylene ether resins
JP2004276411A (ja) * 2003-03-14 2004-10-07 Kanegafuchi Chem Ind Co Ltd 積層体、プリント配線板、およびプリント配線板の製造方法
JP2006002019A (ja) * 2004-06-17 2006-01-05 Sanyo Chem Ind Ltd 難燃性エポキシ樹脂組成物
JP5140929B2 (ja) 2006-01-31 2013-02-13 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP4909846B2 (ja) 2007-09-13 2012-04-04 株式会社日立製作所 樹脂組成物および電子部品
JP2011021079A (ja) * 2009-07-14 2011-02-03 Chisso Corp インクジェット用インク
KR101694238B1 (ko) * 2010-07-02 2017-01-09 디아이씨 가부시끼가이샤 열경화성 수지 조성물, 그 경화물, 활성 에스테르 수지, 반도체 봉지 재료, 프리프레그, 회로 기판, 및 빌드업 필름
JP5640656B2 (ja) * 2010-10-29 2014-12-17 日本ゼオン株式会社 プリプレグ及び積層体
JP2012141605A (ja) 2010-12-16 2012-07-26 Toagosei Co Ltd 黒色感光性組成物、ソルダーレジスト及び感光性ドライフィルム
JP2012251039A (ja) 2011-06-01 2012-12-20 Asahi Kasei Chemicals Corp リサイクル樹脂組成物およびその製造方法
JP6047859B2 (ja) * 2011-12-14 2016-12-21 三菱レイヨン株式会社 メタクリル酸エステル重合体、その製造方法、活性エネルギー線硬化組成物及び光記録媒体
JPWO2014156778A1 (ja) * 2013-03-28 2017-02-16 新日鉄住金化学株式会社 硬化性樹脂組成物、その成形方法及び成形体
TWI685540B (zh) * 2014-12-15 2020-02-21 日商迪愛生股份有限公司 熱硬化性樹脂組成物、其硬化物、及用於其之活性酯樹脂
JP2019178233A (ja) * 2018-03-30 2019-10-17 日鉄ケミカル&マテリアル株式会社 リン含有ビニル樹脂を含む低誘電難燃性組成物
JP7073184B2 (ja) 2018-05-02 2022-05-23 三菱エンジニアリングプラスチックス株式会社 ミリ波レーダー用カバー及びミリ波レーダー
JP7387973B2 (ja) 2019-03-19 2023-11-29 本州化学工業株式会社 末端(メタ)アクリレートポリカーボネートオリゴマー

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368537A (ja) 1986-09-03 1988-03-28 ザ・ダウ・ケミカル・カンパニー 新規な多数のビニルベンジルエーテル基を含有するモノマーおよびオリゴマー,その製造方法およびそれからつくられたキュア生成物
JPS6465110A (en) 1987-09-04 1989-03-10 Showa Highpolymer Curable resin composition
JP4320171B2 (ja) 2000-07-10 2009-08-26 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ 官能化ポリフェニレンエーテル樹脂を製造するための組成物及び方法

Also Published As

Publication number Publication date
WO2022038893A1 (ja) 2022-02-24
TWI878590B (zh) 2025-04-01
JP2022184856A (ja) 2022-12-13
US20240052093A1 (en) 2024-02-15
CN116157270A (zh) 2023-05-23
JP7229422B2 (ja) 2023-02-27
US12157793B2 (en) 2024-12-03
TW202219107A (zh) 2022-05-16
CN116157270B (zh) 2025-10-03
JPWO2022038893A1 (https=) 2022-02-24

Similar Documents

Publication Publication Date Title
JP7229422B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP7060181B1 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
KR101710854B1 (ko) N-치환 말레이미드기를 갖는 폴리페닐렌에테르 유도체, 및 그것을 사용한 열경화성 수지 조성물, 수지 바니시, 프리프레그, 금속 피복 적층판 및 다층 프린트 배선판
US10519279B2 (en) Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
KR102572049B1 (ko) 경화성 수지 조성물
US20100233486A1 (en) Flame-retardant resin composition, and prepreg, resin sheet and molded article using the same
KR20240008879A (ko) 수지 조성물, 및, 그것을 이용한 프리프레그, 수지 부가 필름, 수지 부가 금속박, 금속 클래드 적층판 및 배선 기판
US20240270885A1 (en) Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
US20240279457A1 (en) Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad layered board, and wiring board
US20140182903A1 (en) Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
KR102675519B1 (ko) 경화성 수지 조성물
WO2023008079A1 (ja) 硬化性樹脂組成物、および、硬化物
JP2006291098A (ja) 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、配線板
JP7765759B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP2013256663A (ja) 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、配線板
JP2004182816A (ja) 難燃性の熱硬化性樹脂組成物及びその用途並びにその製造方法
JP2011074397A (ja) 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、配線板
JP7495018B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
KR102955630B1 (ko) 경화성 수지 조성물, 및, 경화물
CN118103414A (zh) 硬化性树脂、硬化性树脂组合物、及硬化物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000