KR20220076324A - 반송 장치, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법 - Google Patents

반송 장치, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법 Download PDF

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Publication number
KR20220076324A
KR20220076324A KR1020210159405A KR20210159405A KR20220076324A KR 20220076324 A KR20220076324 A KR 20220076324A KR 1020210159405 A KR1020210159405 A KR 1020210159405A KR 20210159405 A KR20210159405 A KR 20210159405A KR 20220076324 A KR20220076324 A KR 20220076324A
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KR
South Korea
Prior art keywords
conveying
substrate
roller
conveying roller
cover
Prior art date
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KR1020210159405A
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English (en)
Korean (ko)
Inventor
타카시 시부야
Original Assignee
캐논 톡키 가부시키가이샤
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Publication of KR20220076324A publication Critical patent/KR20220076324A/ko

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • H01L51/001
    • H01L51/56
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
KR1020210159405A 2020-11-30 2021-11-18 반송 장치, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법 KR20220076324A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020198684A JP7191922B2 (ja) 2020-11-30 2020-11-30 搬送装置、成膜装置、成膜方法および電子デバイスの製造方法
JPJP-P-2020-198684 2020-11-30

Publications (1)

Publication Number Publication Date
KR20220076324A true KR20220076324A (ko) 2022-06-08

Family

ID=81769803

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210159405A KR20220076324A (ko) 2020-11-30 2021-11-18 반송 장치, 성막 장치, 성막 방법 및 전자 디바이스의 제조 방법

Country Status (3)

Country Link
JP (1) JP7191922B2 (ja)
KR (1) KR20220076324A (ja)
CN (1) CN114574813B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147256A (ja) 2008-12-18 2010-07-01 Ulvac Japan Ltd 基板搬送装置及びこれを用いた成膜装置
JP2014173170A (ja) 2013-03-12 2014-09-22 Sumitomo Heavy Ind Ltd 成膜装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63171425A (ja) * 1987-01-08 1988-07-15 Fuji Photo Film Co Ltd 磁気記録媒体の製造装置
JPH11158630A (ja) * 1997-11-26 1999-06-15 Shin Meiwa Ind Co Ltd 真空搬送装置
JP4381160B2 (ja) * 2003-07-16 2009-12-09 積水化学工業株式会社 表面処理装置
EP1698715A1 (de) * 2005-03-03 2006-09-06 Applied Films GmbH & Co. KG Anlage zum Beschichten eines Substrats und Einschubelement
JP5055776B2 (ja) * 2006-02-03 2012-10-24 大日本印刷株式会社 成膜装置
US20090218214A1 (en) * 2008-02-28 2009-09-03 Applied Materials, Inc. Backside coating prevention device, coating chamber comprising a backside coating prevention device, and method of coating
TW201346050A (zh) * 2012-02-06 2013-11-16 Tokyo Electron Ltd 成膜裝置及成膜方法
TWI575330B (zh) * 2012-03-27 2017-03-21 尼康股份有限公司 光罩搬送裝置、光罩保持裝置、基板處理裝置、及元件製造方法
JP2018172212A (ja) * 2017-03-31 2018-11-08 平田機工株式会社 ローラ組立体、ローラユニット及びコンベア装置
JP2020152954A (ja) * 2019-03-19 2020-09-24 東レエンジニアリング株式会社 成膜装置
JP7324028B2 (ja) * 2019-03-28 2023-08-09 日東電工株式会社 ガラス基材の搬送装置、積層ガラスの製造装置、および、積層ガラスの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147256A (ja) 2008-12-18 2010-07-01 Ulvac Japan Ltd 基板搬送装置及びこれを用いた成膜装置
JP2014173170A (ja) 2013-03-12 2014-09-22 Sumitomo Heavy Ind Ltd 成膜装置

Also Published As

Publication number Publication date
CN114574813B (zh) 2023-07-25
JP7191922B2 (ja) 2022-12-19
JP2022086586A (ja) 2022-06-09
CN114574813A (zh) 2022-06-03

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