KR20180033600A - 태양전지의 제조 방법 - Google Patents

태양전지의 제조 방법 Download PDF

Info

Publication number
KR20180033600A
KR20180033600A KR1020187008071A KR20187008071A KR20180033600A KR 20180033600 A KR20180033600 A KR 20180033600A KR 1020187008071 A KR1020187008071 A KR 1020187008071A KR 20187008071 A KR20187008071 A KR 20187008071A KR 20180033600 A KR20180033600 A KR 20180033600A
Authority
KR
South Korea
Prior art keywords
fluorine
etching
argon
wafer
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020187008071A
Other languages
English (en)
Korean (ko)
Inventor
마르첼로 리바
Original Assignee
솔베이 플루오르 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 솔베이 플루오르 게엠베하 filed Critical 솔베이 플루오르 게엠베하
Publication of KR20180033600A publication Critical patent/KR20180033600A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H01L31/02366
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • H10F77/707Surface textures, e.g. pyramid structures of the substrates or of layers on substrates, e.g. textured ITO layer on a glass substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • H01L31/04
    • H01L31/18
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/137Batch treatment of the devices
    • H10F71/1375Apparatus for automatic interconnection of photovoltaic cells in a module
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • H10F77/703Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/546Polycrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Photovoltaic Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
KR1020187008071A 2008-01-23 2008-04-28 태양전지의 제조 방법 Abandoned KR20180033600A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2295808P 2008-01-23 2008-01-23
US61/022,958 2008-01-23
PCT/EP2008/055173 WO2009092453A2 (en) 2008-01-23 2008-04-28 Process for the manufacture of solar cells

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157012833A Division KR20150063581A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법

Publications (1)

Publication Number Publication Date
KR20180033600A true KR20180033600A (ko) 2018-04-03

Family

ID=40786668

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020187008071A Abandoned KR20180033600A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법
KR1020157012833A Ceased KR20150063581A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법
KR1020107018533A Ceased KR20100113588A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020157012833A Ceased KR20150063581A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법
KR1020107018533A Ceased KR20100113588A (ko) 2008-01-23 2008-04-28 태양전지의 제조 방법

Country Status (13)

Country Link
US (1) US10453986B2 (enExample)
EP (1) EP2235757B1 (enExample)
JP (4) JP2011510501A (enExample)
KR (3) KR20180033600A (enExample)
CN (2) CN101926010A (enExample)
AU (1) AU2008348838A1 (enExample)
BR (1) BRPI0822196A2 (enExample)
IL (1) IL206859A (enExample)
MX (1) MX2010008075A (enExample)
RU (1) RU2476959C2 (enExample)
TW (1) TWI595675B (enExample)
WO (1) WO2009092453A2 (enExample)
ZA (1) ZA201005208B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2949237B1 (fr) * 2009-08-24 2011-09-30 Ecole Polytech Procede de nettoyage de la surface d'un substrat de silicium
KR20120092112A (ko) 2009-09-18 2012-08-20 솔베이 플루오르 게엠베하 상압에서 태양전지용 웨이퍼를 제조하는 방법
WO2011051251A1 (en) * 2009-10-26 2011-05-05 Solvay Fluor Gmbh Etching process for producing a tft matrix
US8008208B2 (en) * 2009-12-07 2011-08-30 Applied Materials, Inc. Method of cleaning and forming a negatively charged passivation layer over a doped region
JP2013524510A (ja) * 2010-03-30 2013-06-17 アプライド マテリアルズ インコーポレイテッド p型拡散層の上に負荷電パッシベーション層を形成する方法
TWI586842B (zh) 2010-09-15 2017-06-11 首威公司 氟之製造工廠及使用彼之方法
WO2012035000A1 (en) 2010-09-15 2012-03-22 Solvay Sa Method for the removal of f2 and/or of2 from a gas
WO2013024041A1 (en) 2011-08-17 2013-02-21 Solvay Sa Electrolytic process for the manufacture of fluorine and an apparatus therefor
EP2860288A1 (en) 2013-10-11 2015-04-15 Solvay SA Improved electrolytic cell
EP2860287A1 (en) 2013-10-11 2015-04-15 Solvay SA Improved electrolytic cell
EP2944385A1 (en) 2014-05-12 2015-11-18 Solvay SA A process for etching and chamber cleaning and a gas therefor
EP3038169A1 (en) 2014-12-22 2016-06-29 Solvay SA Process for the manufacture of solar cells
EP3104418B8 (de) * 2015-06-08 2018-04-04 Meyer Burger (Germany) GmbH Verfahren und vorrichtung zum texturieren einer siliziumoberfläche
KR102575017B1 (ko) 2016-11-17 2023-09-05 삼성디스플레이 주식회사 유리 기판의 결함 검출 방법
CN108550613B (zh) * 2018-05-30 2020-12-18 信利光电股份有限公司 一种显示模组
JP7256685B2 (ja) * 2019-05-16 2023-04-12 株式会社ディスコ 研削装置
DE102021200627A1 (de) * 2021-01-25 2022-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur Herstellung einer Solarzelle
CN115148850B (zh) * 2022-06-27 2023-06-02 晶科能源股份有限公司 一种硅片及其制备方法、钝化处理溶液

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141811A (en) 1978-04-24 1979-02-27 Atlantic Richfield Company Plasma etching process for the manufacture of solar cells
US4249957A (en) 1979-05-30 1981-02-10 Taher Daud Copper doped polycrystalline silicon solar cell
JPH0646630B2 (ja) * 1985-06-07 1994-06-15 株式会社日立製作所 プラズマ処理方法
US4731158A (en) 1986-09-12 1988-03-15 International Business Machines Corporation High rate laser etching technique
DE3725346A1 (de) 1987-07-30 1989-02-09 Nukem Gmbh Verfahren zur wiederverwendung von silizium-basismaterial einer metall-isolator-halbleiter-(mis)-inversionsschicht-solarzelle
JPH0362968A (ja) 1989-07-31 1991-03-19 Fujitsu Ltd 半導体装置の製造方法
JPH03138082A (ja) * 1989-10-24 1991-06-12 Furukawa Alum Co Ltd 気相ろう付方法
US5317432A (en) * 1991-09-04 1994-05-31 Sony Corporation Liquid crystal display device with a capacitor and a thin film transistor in a trench for each pixel
EP0542148B1 (de) 1991-11-11 1997-01-22 SIEMENS SOLAR GmbH Verfahren zum Erzeugen feiner Elektrodenstruckturen
JP3186264B2 (ja) * 1992-04-23 2001-07-11 ソニー株式会社 ドライエッチング方法
JP3109253B2 (ja) * 1992-06-29 2000-11-13 ソニー株式会社 ドライエッチング方法
RU2065226C1 (ru) 1993-07-27 1996-08-10 Институт микроэлектроники РАН Способ изготовления низкоомного контакта к кремнию
US5688415A (en) 1995-05-30 1997-11-18 Ipec Precision, Inc. Localized plasma assisted chemical etching through a mask
DE19522539C2 (de) * 1995-06-21 1997-06-12 Fraunhofer Ges Forschung Solarzelle mit einem, eine Oberflächentextur aufweisenden Emitter sowie Verfahren zur Herstellung derselben
JPH09102625A (ja) * 1995-07-28 1997-04-15 Kyocera Corp 太陽電池素子の製造方法
JPH10223614A (ja) * 1997-02-12 1998-08-21 Daikin Ind Ltd エッチングガスおよびクリーニングガス
US20010008227A1 (en) 1997-08-08 2001-07-19 Mitsuru Sadamoto Dry etching method of metal oxide/photoresist film laminate
US6635185B2 (en) 1997-12-31 2003-10-21 Alliedsignal Inc. Method of etching and cleaning using fluorinated carbonyl compounds
US6060400A (en) 1998-03-26 2000-05-09 The Research Foundation Of State University Of New York Highly selective chemical dry etching of silicon nitride over silicon and silicon dioxide
US5981398A (en) * 1998-04-10 1999-11-09 Taiwan Semiconductor Manufacturing Company, Ltd. Hard mask method for forming chlorine containing plasma etched layer
JP2000012517A (ja) 1998-06-26 2000-01-14 Ulvac Corp 表面処理方法
US6235214B1 (en) * 1998-12-03 2001-05-22 Applied Materials, Inc. Plasma etching of silicon using fluorinated gas mixtures
US6203671B1 (en) * 1999-03-10 2001-03-20 Alliedsignal Inc. Method of producing fluorinated compounds
JP2001028362A (ja) 1999-07-15 2001-01-30 Toshiba Corp 半導体装置の製造方法及び製造装置
JP4339990B2 (ja) 2000-08-31 2009-10-07 京セラ株式会社 シリコン基板の粗面化法
JP4112198B2 (ja) 2000-09-11 2008-07-02 財団法人地球環境産業技術研究機構 クリーニングガス及びエッチングガス、並びにチャンバークリーニング方法及びエッチング方法
JP2002329710A (ja) 2001-04-26 2002-11-15 Kyocera Corp シリコン基板の粗面化法
JP4721557B2 (ja) 2001-05-29 2011-07-13 京セラ株式会社 太陽電池用基板の粗面化法
JP4340031B2 (ja) 2001-09-26 2009-10-07 京セラ株式会社 太陽電池用基板の粗面化方法
JP4104320B2 (ja) * 2001-11-16 2008-06-18 セントラル硝子株式会社 二フッ化カルボニルの製造方法
JP4467218B2 (ja) 2001-12-25 2010-05-26 京セラ株式会社 太陽電池用基板の粗面化法
JP4129617B2 (ja) * 2002-04-19 2008-08-06 ダイキン工業株式会社 Cof2の製造方法
JP2003347660A (ja) 2002-05-30 2003-12-05 Sharp Corp 窒化物半導体装置の製造方法
JP2004134577A (ja) * 2002-10-10 2004-04-30 Seiko Epson Corp 半導体薄膜の製造方法、薄膜トランジスタ、半導体装置、薄膜太陽電池、複合半導体装置の製造方法、電気光学装置及び電子機器
RU2250536C1 (ru) * 2004-01-08 2005-04-20 Открытое акционерное общество "Сатурн" Солнечная батарея
US20060016459A1 (en) * 2004-05-12 2006-01-26 Mcfarlane Graham High rate etching using high pressure F2 plasma with argon dilution
JP2006049817A (ja) 2004-07-07 2006-02-16 Showa Denko Kk プラズマ処理方法およびプラズマエッチング方法
US7581549B2 (en) 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
US20060062914A1 (en) * 2004-09-21 2006-03-23 Diwakar Garg Apparatus and process for surface treatment of substrate using an activated reactive gas
US7317434B2 (en) * 2004-12-03 2008-01-08 Dupont Displays, Inc. Circuits including switches for electronic devices and methods of using the electronic devices
US20060183055A1 (en) * 2005-02-15 2006-08-17 O'neill Mark L Method for defining a feature on a substrate
KR20080017290A (ko) * 2005-05-24 2008-02-26 마쯔시다덴기산교 가부시키가이샤 드라이에칭방법, 미세구조 형성방법, 몰드 및 그 제조방법
JP2006332509A (ja) 2005-05-30 2006-12-07 Kyocera Corp 粗面化法
DE102005040596B4 (de) 2005-06-17 2009-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Entfernung einer dotierten Oberflächenschicht an Rückseiten von kristallinen Silizium-Solarwafern
US20060286774A1 (en) 2005-06-21 2006-12-21 Applied Materials. Inc. Method for forming silicon-containing materials during a photoexcitation deposition process
WO2007049347A1 (ja) * 2005-10-26 2007-05-03 Shinryo Corporation 太陽電池用シリコン基板の低反射率加工方法及び太陽電池用シリコン基板
JP2007142021A (ja) * 2005-11-16 2007-06-07 Seiko Epson Corp 順スタガ構造薄膜トランジスタの製造方法
JP5064767B2 (ja) * 2005-11-29 2012-10-31 京セラ株式会社 太陽電池素子の製造方法
RU2301477C1 (ru) 2005-12-15 2007-06-20 Государственное образовательное учреждение высшего профессионального образования Самарский государственный аэрокосмический университет им. акад. С.П. Королева Способ увеличения чувствительности и быстродействия фотоэлектрического преобразователя перемещений в код
CN101443888B (zh) * 2006-03-13 2011-03-16 内诺格雷姆公司 薄硅或者锗片以及由薄片形成的光电池
JP2007250985A (ja) * 2006-03-17 2007-09-27 Showa Denko Kk プラズマエッチング方法
EP3269843A1 (en) 2006-04-10 2018-01-17 Solvay Fluor GmbH Etching process
JP4153961B2 (ja) * 2006-04-25 2008-09-24 積水化学工業株式会社 シリコンのエッチング方法
WO2008043827A2 (de) 2006-10-12 2008-04-17 Centrotherm Photovoltaics Ag Verfahren zur passivierung von solarzellen
WO2009018509A1 (en) * 2007-08-02 2009-02-05 Applied Materials, Inc. Thin film transistors using thin film semiconductor materials
RU2010130570A (ru) 2007-12-21 2012-01-27 Солвей Флуор Гмбх (De) Способ получения микроэлектромеханических систем
KR20120092112A (ko) 2009-09-18 2012-08-20 솔베이 플루오르 게엠베하 상압에서 태양전지용 웨이퍼를 제조하는 방법
WO2011051251A1 (en) 2009-10-26 2011-05-05 Solvay Fluor Gmbh Etching process for producing a tft matrix
JP2013509700A (ja) 2009-10-30 2013-03-14 ソルヴェイ(ソシエテ アノニム) F2およびcof2を使用するプラズマエッチングおよびチャンバのプラズマ洗浄の方法

Also Published As

Publication number Publication date
CN101926010A (zh) 2010-12-22
KR20150063581A (ko) 2015-06-09
EP2235757B1 (en) 2016-06-08
US20100288330A1 (en) 2010-11-18
KR20100113588A (ko) 2010-10-21
JP2017017331A (ja) 2017-01-19
RU2476959C2 (ru) 2013-02-27
JP2015057858A (ja) 2015-03-26
CN105789378A (zh) 2016-07-20
TWI595675B (zh) 2017-08-11
RU2010134889A (ru) 2012-02-27
WO2009092453A3 (en) 2009-12-10
JP2018152615A (ja) 2018-09-27
JP2011510501A (ja) 2011-03-31
JP6546889B2 (ja) 2019-07-17
TW201003935A (en) 2010-01-16
US10453986B2 (en) 2019-10-22
BRPI0822196A2 (pt) 2015-06-23
ZA201005208B (en) 2012-01-25
EP2235757A2 (en) 2010-10-06
WO2009092453A2 (en) 2009-07-30
IL206859A0 (en) 2010-12-30
AU2008348838A1 (en) 2009-07-30
IL206859A (en) 2016-12-29
MX2010008075A (es) 2010-08-04

Similar Documents

Publication Publication Date Title
US10453986B2 (en) Process for the manufacture of solar cells
EP2615634B1 (en) Method for cleaning silicon substrate, and method for producing solar cell
US7442623B2 (en) Method for manufacturing bonded substrate and bonded substrate manufactured by the method
KR20120098751A (ko) Tft 매트릭스 제조를 위한 식각 공정
CN102498581A (zh) 在环境压力下制造用于太阳能电池的晶片的方法
KR20210136102A (ko) 드라이 에칭 방법 및 반도체 디바이스의 제조 방법
JP4553597B2 (ja) シリコン基板の製造方法および太陽電池セルの製造方法
CN104205354B (zh) 用于太阳能电池制造的气态臭氧(o3)处理
US20070128761A1 (en) Manufacturing Method of Solar Cell Element
JPH01200628A (ja) ドライエッチング方法
EP3238277B1 (en) Process for the manufacture of solar cells
CN115172154B (zh) 一种半导体器件制造方法及装置
US20190214255A1 (en) Techniques for improved removal of sacrificial mask
JPS61240635A (ja) ドライエツチング方法
JP2001077059A (ja) 金属酸化物膜の加工方法
WO2013092759A2 (en) Method for etching of sio2 layers on thin wafers
TW201342466A (zh) 蝕刻薄晶圓上之SiO2層的方法
JP2004335768A (ja) ドライエッチング方法
ATE420459T1 (de) Ätzen von dotiertem sio2 mit hoher selektivität zu undotiertem sio2 mittels eines plasmaätzgerätes mit hoher dichte

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20180321

Application number text: 1020157012833

Filing date: 20150515

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20180419

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180712

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20190326

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20180712

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20190624

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20190326

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20200525

Appeal identifier: 2019101002099

Request date: 20190624

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20190624

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20190624

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20181112

Patent event code: PB09011R02I

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial

Comment text: Report of Result of Re-examination before a Trial

Patent event code: PB06011S01D

Patent event date: 20190730

J301 Trial decision

Free format text: TRIAL NUMBER: 2019101002099; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20190624

Effective date: 20200525

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20200525

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20190624

Decision date: 20200525

Appeal identifier: 2019101002099

PS0901 Examination by remand of revocation
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200608

Patent event code: PE09021S01D

GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20201005

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20200526

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

PC1904 Unpaid initial registration fee