KR20170049411A - 고정 연마입자 와이어소우 및 고정 연마입자 와이어의 드레싱 방법 - Google Patents

고정 연마입자 와이어소우 및 고정 연마입자 와이어의 드레싱 방법 Download PDF

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Publication number
KR20170049411A
KR20170049411A KR1020160138958A KR20160138958A KR20170049411A KR 20170049411 A KR20170049411 A KR 20170049411A KR 1020160138958 A KR1020160138958 A KR 1020160138958A KR 20160138958 A KR20160138958 A KR 20160138958A KR 20170049411 A KR20170049411 A KR 20170049411A
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KR
South Korea
Prior art keywords
wire
fixed
work
abrasive grain
workpiece
Prior art date
Application number
KR1020160138958A
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English (en)
Korean (ko)
Inventor
켄이치 쿠마자와
Original Assignee
리드 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 리드 가부시키가이샤 filed Critical 리드 가부시키가이샤
Publication of KR20170049411A publication Critical patent/KR20170049411A/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0633Grinders for cutting-off using a cutting wire
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12Dressing tools; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020160138958A 2015-10-28 2016-10-25 고정 연마입자 와이어소우 및 고정 연마입자 와이어의 드레싱 방법 KR20170049411A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015212079A JP6270796B2 (ja) 2015-10-28 2015-10-28 固定砥粒ワイヤーソー及び固定砥粒ワイヤーのドレッシング方法
JPJP-P-2015-212079 2015-10-28

Publications (1)

Publication Number Publication Date
KR20170049411A true KR20170049411A (ko) 2017-05-10

Family

ID=58710211

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160138958A KR20170049411A (ko) 2015-10-28 2016-10-25 고정 연마입자 와이어소우 및 고정 연마입자 와이어의 드레싱 방법

Country Status (5)

Country Link
JP (1) JP6270796B2 (ja)
KR (1) KR20170049411A (ja)
CN (1) CN106626111B (ja)
MY (1) MY177757A (ja)
TW (1) TWI729010B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6693460B2 (ja) * 2017-04-04 2020-05-13 信越半導体株式会社 ワークの切断方法
CN107457452A (zh) * 2017-09-28 2017-12-12 张家港天工机械制造有限公司 一种开刃复绕机用开刃装置
JP6819621B2 (ja) * 2018-01-25 2021-01-27 信越半導体株式会社 ワークの切断方法及びワイヤソー
CN110421213A (zh) * 2019-07-03 2019-11-08 苏州锦美川自动化科技有限公司 高速开刃复绕机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128654A (ja) * 1997-07-04 1999-02-02 Tokyo Seimitsu Co Ltd 固定砥粒ワイヤソーのドレッシング方法及び装置
WO2005039824A1 (ja) * 2003-10-27 2005-05-06 Mitsubishi Denki Kabushiki Kaisha マルチワイヤソー
JP4411062B2 (ja) * 2003-12-25 2010-02-10 株式会社アライドマテリアル 超砥粒ワイヤソー巻き付け構造、超砥粒ワイヤソー切断装置および超砥粒ワイヤソーの巻き付け方法
JP2011031386A (ja) * 2009-07-10 2011-02-17 Mitsubishi Chemicals Corp 電着式固定砥粒ワイヤーおよびこれを用いた結晶スライス方法
WO2013172353A1 (ja) * 2012-05-15 2013-11-21 電気化学工業株式会社 積層体の加工装置及び加工方法
KR20140090906A (ko) * 2013-01-10 2014-07-18 주식회사 엘지실트론 와이어 쏘 장치 및 이를 이용한 잉곳 슬라이싱 방법
JP2015009346A (ja) * 2013-07-02 2015-01-19 パナソニック株式会社 電解ドレッシング方法、及び電解ドレッシング装置

Also Published As

Publication number Publication date
JP2017080849A (ja) 2017-05-18
JP6270796B2 (ja) 2018-01-31
TW201726323A (zh) 2017-08-01
MY177757A (en) 2020-09-23
CN106626111A (zh) 2017-05-10
CN106626111B (zh) 2020-01-07
TWI729010B (zh) 2021-06-01

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