MY177757A - Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw - Google Patents

Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw

Info

Publication number
MY177757A
MY177757A MYPI2016703868A MYPI2016703868A MY177757A MY 177757 A MY177757 A MY 177757A MY PI2016703868 A MYPI2016703868 A MY PI2016703868A MY PI2016703868 A MYPI2016703868 A MY PI2016703868A MY 177757 A MY177757 A MY 177757A
Authority
MY
Malaysia
Prior art keywords
fixed abrasive
abrasive grain
grain wire
workpiece
dressing
Prior art date
Application number
MYPI2016703868A
Inventor
Kumazawa Kenichi
Original Assignee
Read Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Co Ltd filed Critical Read Co Ltd
Publication of MY177757A publication Critical patent/MY177757A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

[Object] To provide a fixed abrasive gram w1re saw such that the positional relationship between a workpiece table holding a workpiece, and a dressing stone for dressing a fixed abrasive grain wire is designed more reasonably in consideration of the operational aspect such as maintainability, and a method for dressing a fixed abrasive grain wire. [Solution] A fixed abrasive grain wire saw includes a fixed abrasive grain wire (2), a workpiece feed table (6) having a workpiece fixing portion (15) to which a workpiece (W) is fixed, and a dressing stone (41). The fixed abrasive grain wire (2) is wound between groove rollers (3-5), and a wire row (30) arranged in a feed direction along the groove rollers is thereby formed. The dressing stone is fixed to a position on the upstream side of the workpiece fixing portion in the feed direction on the workpiece feed table so as to be adjacent to the workpiece fixing portion.
MYPI2016703868A 2015-10-28 2016-10-21 Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw MY177757A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015212079A JP6270796B2 (en) 2015-10-28 2015-10-28 Fixed abrasive wire saw and fixed abrasive wire dressing method

Publications (1)

Publication Number Publication Date
MY177757A true MY177757A (en) 2020-09-23

Family

ID=58710211

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016703868A MY177757A (en) 2015-10-28 2016-10-21 Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw

Country Status (5)

Country Link
JP (1) JP6270796B2 (en)
KR (1) KR20170049411A (en)
CN (1) CN106626111B (en)
MY (1) MY177757A (en)
TW (1) TWI729010B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6693460B2 (en) * 2017-04-04 2020-05-13 信越半導体株式会社 Work cutting method
CN107457452A (en) * 2017-09-28 2017-12-12 张家港天工机械制造有限公司 One kind is put the first edge on a knife or a pair of scissors rewinding machine edging device
JP6819621B2 (en) * 2018-01-25 2021-01-27 信越半導体株式会社 Work cutting method and wire saw
CN110421213A (en) * 2019-07-03 2019-11-08 苏州锦美川自动化科技有限公司 Put the first edge on a knife or a pair of scissors at a high speed rewinding machine

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128654A (en) * 1997-07-04 1999-02-02 Tokyo Seimitsu Co Ltd Dressing method and device of fixed abrasive grain wire saw
US7306508B2 (en) * 2003-10-27 2007-12-11 Mitsubishi Denki Kabushiki Kaisha Multi-wire saw
JP4411062B2 (en) * 2003-12-25 2010-02-10 株式会社アライドマテリアル Super abrasive wire saw winding structure, super abrasive wire saw cutting device, and super abrasive wire saw winding method
JP2011031386A (en) * 2009-07-10 2011-02-17 Mitsubishi Chemicals Corp Electro-deposition fixed abrasive grain wire and crystal slicing method using the same
WO2013172353A1 (en) * 2012-05-15 2013-11-21 電気化学工業株式会社 Processing apparatus and method for processing laminated article
KR20140090906A (en) * 2013-01-10 2014-07-18 주식회사 엘지실트론 Wire saw and method for slicing ingot using the same
JP2015009346A (en) * 2013-07-02 2015-01-19 パナソニック株式会社 Electrolytic dressing method and electrolytic dressing device

Also Published As

Publication number Publication date
TWI729010B (en) 2021-06-01
KR20170049411A (en) 2017-05-10
JP6270796B2 (en) 2018-01-31
CN106626111B (en) 2020-01-07
CN106626111A (en) 2017-05-10
TW201726323A (en) 2017-08-01
JP2017080849A (en) 2017-05-18

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