SG11202005519QA - Method for slicing workpiece and wire saw - Google Patents

Method for slicing workpiece and wire saw

Info

Publication number
SG11202005519QA
SG11202005519QA SG11202005519QA SG11202005519QA SG11202005519QA SG 11202005519Q A SG11202005519Q A SG 11202005519QA SG 11202005519Q A SG11202005519Q A SG 11202005519QA SG 11202005519Q A SG11202005519Q A SG 11202005519QA SG 11202005519Q A SG11202005519Q A SG 11202005519QA
Authority
SG
Singapore
Prior art keywords
wire saw
slicing
workpiece
slicing workpiece
saw
Prior art date
Application number
SG11202005519QA
Inventor
Koji Kitagawa
Shiro Toyoda
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG11202005519QA publication Critical patent/SG11202005519QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
SG11202005519QA 2018-01-22 2018-11-26 Method for slicing workpiece and wire saw SG11202005519QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018008110A JP6819619B2 (en) 2018-01-22 2018-01-22 Work cutting method and wire saw
PCT/JP2018/043315 WO2019142494A1 (en) 2018-01-22 2018-11-26 Workpiece cutting method and wire saw

Publications (1)

Publication Number Publication Date
SG11202005519QA true SG11202005519QA (en) 2020-07-29

Family

ID=67302153

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005519QA SG11202005519QA (en) 2018-01-22 2018-11-26 Method for slicing workpiece and wire saw

Country Status (8)

Country Link
US (1) US11958160B2 (en)
JP (1) JP6819619B2 (en)
KR (1) KR102650009B1 (en)
CN (1) CN111511504B (en)
DE (1) DE112018006291T5 (en)
SG (1) SG11202005519QA (en)
TW (1) TWI784096B (en)
WO (1) WO2019142494A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7415350B2 (en) 2019-07-08 2024-01-17 コニカミノルタ株式会社 Voice operation system, control device, and control program
CN114227499B (en) * 2021-12-18 2024-03-08 浙江大学湖州研究院 Water treatment membrane element buddha's warrior attendant line cutting equipment
JP2023095080A (en) * 2021-12-24 2023-07-06 株式会社Sumco Method for slicing silicon ingot
CN115351681A (en) * 2022-10-18 2022-11-18 江苏中畅精密科技有限公司 Surface treatment equipment for electroplated diamond cutting line and use method thereof

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JP2003191158A (en) * 2000-11-24 2003-07-08 Sumitomo Special Metals Co Ltd Method for cutting rare earth metal alloy, method for manufacturing rare earth metal magnet and wire saw device
US6837778B2 (en) * 2000-11-24 2005-01-04 Neomax Co., Ltd Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine
US6945242B2 (en) * 2001-10-17 2005-09-20 Neomax Co., Ltd. Cutting method using wire saw, wire saw device, and method of manufacturing rare-earth magnet
EP1757419B1 (en) 2005-08-25 2012-10-17 Freiberger Compound Materials GmbH Method, apparatus and slurry for wire sawing
US8157876B2 (en) * 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
JP5045378B2 (en) * 2007-11-08 2012-10-10 信越半導体株式会社 Wire saw equipment
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JP5679642B2 (en) * 2009-07-15 2015-03-04 ユシロ化学工業株式会社 Water-soluble machining fluid for fixed abrasive wire saws
JP5515593B2 (en) * 2009-10-07 2014-06-11 株式会社Ｓｕｍｃｏ Method for cutting silicon ingot with wire saw and wire saw
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KR20120056196A (en) * 2010-11-24 2012-06-01 주식회사 엘지생활건강 Environment-friendly water-soluble cutting fluid for wafer, and composition containing the same cutting fluid
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JP3197053U (en) * 2015-02-04 2015-04-16 株式会社クラレ Liquid replenishment device and coolant regeneration device provided with the same
JP6402700B2 (en) 2015-10-20 2018-10-10 信越半導体株式会社 Work cutting method and wire saw
CN206871051U (en) * 2017-04-26 2018-01-12 河北宏泰专用汽车有限公司 Brake emergency stop valve interlock
CN206885515U (en) * 2017-05-02 2018-01-16 达尔嘉(广州)标识设备有限公司 A kind of cut-out of box installed continous way list bag material and device for discharging fixed

Also Published As

Publication number Publication date
TWI784096B (en) 2022-11-21
US20210016413A1 (en) 2021-01-21
JP2019126854A (en) 2019-08-01
JP6819619B2 (en) 2021-01-27
US11958160B2 (en) 2024-04-16
DE112018006291T5 (en) 2020-10-08
TW201932240A (en) 2019-08-16
CN111511504B (en) 2022-03-01
WO2019142494A1 (en) 2019-07-25
KR102650009B1 (en) 2024-03-22
CN111511504A (en) 2020-08-07
KR20200106889A (en) 2020-09-15

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