SG10202009276RA - Cutting blade identifying method and processing apparatus - Google Patents
Cutting blade identifying method and processing apparatusInfo
- Publication number
- SG10202009276RA SG10202009276RA SG10202009276RA SG10202009276RA SG10202009276RA SG 10202009276R A SG10202009276R A SG 10202009276RA SG 10202009276R A SG10202009276R A SG 10202009276RA SG 10202009276R A SG10202009276R A SG 10202009276RA SG 10202009276R A SG10202009276R A SG 10202009276RA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- cutting blade
- identifying method
- blade identifying
- cutting
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Automatic Tool Replacement In Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019185951A JP7316901B2 (en) | 2019-10-09 | 2019-10-09 | Cutting blade identification method and processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202009276RA true SG10202009276RA (en) | 2021-05-28 |
Family
ID=75379484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202009276RA SG10202009276RA (en) | 2019-10-09 | 2020-09-21 | Cutting blade identifying method and processing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7316901B2 (en) |
| KR (1) | KR20210042254A (en) |
| SG (1) | SG10202009276RA (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116021654B (en) * | 2023-04-02 | 2023-07-25 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Tool changing method of automatic tool changing device for wafer cutting |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63123660A (en) * | 1986-11-10 | 1988-05-27 | Toyota Motor Corp | Article discriminating device |
| JP2000061783A (en) | 1998-08-14 | 2000-02-29 | Japan Nuclear Fuel Co Ltd(Jnf) | Surface condition diagnosis method of grinding wheel and diagnosis device thereof |
| JP4791813B2 (en) | 2005-12-08 | 2011-10-12 | 株式会社ディスコ | Cutting equipment |
| JP5457131B2 (en) | 2009-10-07 | 2014-04-02 | 株式会社ディスコ | Blade changer |
-
2019
- 2019-10-09 JP JP2019185951A patent/JP7316901B2/en active Active
-
2020
- 2020-09-21 SG SG10202009276RA patent/SG10202009276RA/en unknown
- 2020-10-07 KR KR1020200129290A patent/KR20210042254A/en active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021058986A (en) | 2021-04-15 |
| KR20210042254A (en) | 2021-04-19 |
| JP7316901B2 (en) | 2023-07-28 |
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