SG10201807320WA - Wire saw apparatus - Google Patents

Wire saw apparatus

Info

Publication number
SG10201807320WA
SG10201807320WA SG10201807320WA SG10201807320WA SG10201807320WA SG 10201807320W A SG10201807320W A SG 10201807320WA SG 10201807320W A SG10201807320W A SG 10201807320WA SG 10201807320W A SG10201807320W A SG 10201807320WA SG 10201807320W A SG10201807320W A SG 10201807320WA
Authority
SG
Singapore
Prior art keywords
wire
saw apparatus
workpiece
nozzle
row
Prior art date
Application number
SG10201807320WA
Inventor
Koji Kitagawa
Yuichi Shimizu
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG10201807320WA publication Critical patent/SG10201807320WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

WIRE SAW APPARATUS The present invention provides a wire saw apparatus including: a wire row formed of a wire which is wound around a plurality of wire guides and reciprocatively travels in an axial direction; a nozzle from which a coolant or slurry is supplied to the wire; and a workpiece feed mechanism which presses a held workpiece against the wire row, the wire saw apparatus being configured to slice the workpiece into a wafer shape by pressing the workpiece held by the workpiece feed mechanism against the wire row and feeding it for slicing while supplying the coolant or the slurry from the nozzle to the wire, the wire saw apparatus being characterized in that the nozzle is arranged above the wire row to be orthogonal to the wire row, and windbreak plates are arranged on both left and right sides of the arranged nozzle seen from an axial direction. Figure 1
SG10201807320WA 2015-05-01 2016-03-03 Wire saw apparatus SG10201807320WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015094358A JP6304118B2 (en) 2015-05-01 2015-05-01 Wire saw equipment

Publications (1)

Publication Number Publication Date
SG10201807320WA true SG10201807320WA (en) 2018-09-27

Family

ID=57217580

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201707726YA SG11201707726YA (en) 2015-05-01 2016-03-03 Wire saw apparatus
SG10201807320WA SG10201807320WA (en) 2015-05-01 2016-03-03 Wire saw apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201707726YA SG11201707726YA (en) 2015-05-01 2016-03-03 Wire saw apparatus

Country Status (8)

Country Link
US (1) US10589446B2 (en)
JP (1) JP6304118B2 (en)
KR (1) KR102568196B1 (en)
CN (1) CN107427986B (en)
DE (1) DE112016001209T5 (en)
SG (2) SG11201707726YA (en)
TW (1) TWI692394B (en)
WO (1) WO2016178297A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110962248A (en) * 2018-09-28 2020-04-07 胜高股份有限公司 Machining liquid supply nozzle for wire saw and method for supplying machining liquid to wire saw
CN110039673A (en) * 2019-04-26 2019-07-23 西安奕斯伟硅片技术有限公司 A kind of cutter device and method
JP7372097B2 (en) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 How to load and unload wire saws and wire saw workpieces
CN111361030B (en) * 2020-04-24 2021-11-23 西安奕斯伟材料科技有限公司 Multi-wire cutting device and multi-wire cutting method
CN113601741B (en) * 2021-08-09 2023-06-23 西安奕斯伟硅片技术有限公司 Device for supplying mortar to a plurality of cutting lines for cutting silicon rods and silicon rod cutting equipment
CN115816664A (en) * 2022-12-28 2023-03-21 泉州市品河精密科技有限公司 Stone cutting method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2899781A (en) * 1959-08-18 williams
US3148488A (en) * 1961-12-11 1964-09-15 Sun Tool And Machine Company Coolant splash shield and support
US3325949A (en) * 1964-11-24 1967-06-20 Cincinnati Milling Machine Co Workpiece cooling apparatus for grinding machines
FR1600356A (en) * 1968-01-09 1970-07-20
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
JPH1148119A (en) * 1997-06-05 1999-02-23 Nippei Toyama Corp Wire saw
TW383249B (en) * 1998-09-01 2000-03-01 Sumitomo Spec Metals Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board
JP2000153460A (en) * 1998-11-16 2000-06-06 Tokyo Seiko Co Ltd Liquid supply device
JP2000218615A (en) * 1999-01-29 2000-08-08 Nippei Toyama Corp Method for fitting and removing wire saw and work
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
JP3967969B2 (en) * 2002-06-27 2007-08-29 京セラ株式会社 Wire saw
JP2004195555A (en) * 2002-12-16 2004-07-15 Komatsu Electronic Metals Co Ltd Slurry nozzle for wire saw
JP4083152B2 (en) 2004-07-29 2008-04-30 日本碍子株式会社 Wire saw equipment
JP5072204B2 (en) * 2005-08-31 2012-11-14 信越半導体株式会社 Method and wire saw apparatus for improving nanotopography of wafer surface
JP5080769B2 (en) * 2006-09-15 2012-11-21 株式会社東京精密 Polishing method and polishing apparatus
JP4816511B2 (en) * 2007-03-06 2011-11-16 信越半導体株式会社 Cutting method and wire saw device
JP5003294B2 (en) * 2007-06-08 2012-08-15 信越半導体株式会社 Cutting method
JP5045378B2 (en) * 2007-11-08 2012-10-10 信越半導体株式会社 Wire saw equipment
JP5234010B2 (en) 2008-02-19 2013-07-10 信越半導体株式会社 Wire saw and workpiece cutting method
JP5056645B2 (en) 2008-07-23 2012-10-24 信越半導体株式会社 Work cutting method and wire saw
WO2010120491A2 (en) * 2009-04-01 2010-10-21 Cabot Microelectronics Corporation Self-cleaning wiresaw apparatus and method
JP2011143504A (en) * 2010-01-14 2011-07-28 Mitsubishi Electric Corp Wire saw device
KR101185683B1 (en) * 2011-02-23 2012-09-24 주식회사 엘지실트론 Sawing apparatus of single cystral the same
JP5775381B2 (en) * 2011-06-28 2015-09-09 コマツＮｔｃ株式会社 Wire saw machining fluid nozzle
JP2013129046A (en) * 2011-12-22 2013-07-04 Shin Etsu Handotai Co Ltd Workpiece cutting method
CN202685118U (en) * 2012-07-03 2013-01-23 浙江昱辉阳光能源有限公司 Diamond wire slicer
DE102014208187B4 (en) * 2014-04-30 2023-07-06 Siltronic Ag Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece

Also Published As

Publication number Publication date
KR20180004111A (en) 2018-01-10
TWI692394B (en) 2020-05-01
WO2016178297A1 (en) 2016-11-10
CN107427986B (en) 2019-07-09
US10589446B2 (en) 2020-03-17
JP2016209947A (en) 2016-12-15
JP6304118B2 (en) 2018-04-04
US20180079108A1 (en) 2018-03-22
SG11201707726YA (en) 2017-10-30
CN107427986A (en) 2017-12-01
TW201639680A (en) 2016-11-16
KR102568196B1 (en) 2023-08-18
DE112016001209T5 (en) 2017-12-07

Similar Documents

Publication Publication Date Title
SG10201807320WA (en) Wire saw apparatus
MY168714A (en) Method for slicing wafers from a workpiece
JP2016209947A5 (en)
MY172527A (en) A kind of gantry deburring mechanism and automatic grinding machining using this mechanism
JP2011082351A5 (en)
ECSP13012701A (en) POWER SUPPLY FOR A PROCESSING DEVICE
MX2017000554A (en) Cutting apparatus and cutting method.
MY163638A (en) Method for cutting workpiece with wire saw
EE201700039A (en) Fish feed, a process for its preparation, and a method for feeding fish
WO2016142297A3 (en) Fiber-laying machine and method for laying a fibrous web onto a workpiece
IL249471A0 (en) Method for feeding a machine with sheet elements, feed station and treatment machine equipped therewith
MX2016006196A (en) Honing tool and method for machining a plurality of coaxial bores.
PL3268162T3 (en) Machine for cutting panel-type workpieces
PL3433049T3 (en) Processing machine for cutting plate-shaped workpieces
MY177757A (en) Fixed abrasive grain wire saw and method for dressing fixed abrasive grain wire saw
SG10201502215TA (en) Method For Slicing Wafers From A Workpiece Using A Sawing Wire
MX2017004408A (en) Cooling apparatus and cooling method for steel material.
MX2018010950A (en) Method and device for manufacturing laminated iron core.
MY164245A (en) Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
MX2017013317A (en) Method and apparatus for processing a fiber cushion body.
EP2898977A3 (en) Wire feeding mechanism and arc processing system employing the same
PH12016501305B1 (en) A method for operating a ball mill and a milling system
MX2019000390A (en) Wire outlet nozzle arrangement.
MX2017008753A (en) Improvements to machining process control.
JP2015047685A5 (en)