SG11201707726YA - Wire saw apparatus - Google Patents
Wire saw apparatusInfo
- Publication number
- SG11201707726YA SG11201707726YA SG11201707726YA SG11201707726YA SG11201707726YA SG 11201707726Y A SG11201707726Y A SG 11201707726YA SG 11201707726Y A SG11201707726Y A SG 11201707726YA SG 11201707726Y A SG11201707726Y A SG 11201707726YA SG 11201707726Y A SG11201707726Y A SG 11201707726YA
- Authority
- SG
- Singapore
- Prior art keywords
- wire saw
- saw apparatus
- wire
- saw
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015094358A JP6304118B2 (en) | 2015-05-01 | 2015-05-01 | Wire saw equipment |
PCT/JP2016/001146 WO2016178297A1 (en) | 2015-05-01 | 2016-03-03 | Wire saw device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201707726YA true SG11201707726YA (en) | 2017-10-30 |
Family
ID=57217580
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201707726YA SG11201707726YA (en) | 2015-05-01 | 2016-03-03 | Wire saw apparatus |
SG10201807320WA SG10201807320WA (en) | 2015-05-01 | 2016-03-03 | Wire saw apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201807320WA SG10201807320WA (en) | 2015-05-01 | 2016-03-03 | Wire saw apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US10589446B2 (en) |
JP (1) | JP6304118B2 (en) |
KR (1) | KR102568196B1 (en) |
CN (1) | CN107427986B (en) |
DE (1) | DE112016001209T5 (en) |
SG (2) | SG11201707726YA (en) |
TW (1) | TWI692394B (en) |
WO (1) | WO2016178297A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110962248A (en) * | 2018-09-28 | 2020-04-07 | 胜高股份有限公司 | Machining liquid supply nozzle for wire saw and method for supplying machining liquid to wire saw |
CN110039673A (en) * | 2019-04-26 | 2019-07-23 | 西安奕斯伟硅片技术有限公司 | A kind of cutter device and method |
JP7372097B2 (en) * | 2019-09-20 | 2023-10-31 | コマツNtc株式会社 | How to load and unload wire saws and wire saw workpieces |
CN111361030B (en) * | 2020-04-24 | 2021-11-23 | 西安奕斯伟材料科技有限公司 | Multi-wire cutting device and multi-wire cutting method |
CN113601741B (en) * | 2021-08-09 | 2023-06-23 | 西安奕斯伟硅片技术有限公司 | Device for supplying mortar to a plurality of cutting lines for cutting silicon rods and silicon rod cutting equipment |
CN115816664A (en) * | 2022-12-28 | 2023-03-21 | 泉州市品河精密科技有限公司 | Stone cutting method |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2899781A (en) * | 1959-08-18 | williams | ||
US3148488A (en) * | 1961-12-11 | 1964-09-15 | Sun Tool And Machine Company | Coolant splash shield and support |
US3325949A (en) * | 1964-11-24 | 1967-06-20 | Cincinnati Milling Machine Co | Workpiece cooling apparatus for grinding machines |
FR1600356A (en) * | 1968-01-09 | 1970-07-20 | ||
US5709593A (en) * | 1995-10-27 | 1998-01-20 | Applied Materials, Inc. | Apparatus and method for distribution of slurry in a chemical mechanical polishing system |
JPH1148119A (en) * | 1997-06-05 | 1999-02-23 | Nippei Toyama Corp | Wire saw |
TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
JP2000153460A (en) * | 1998-11-16 | 2000-06-06 | Tokyo Seiko Co Ltd | Liquid supply device |
JP2000218615A (en) * | 1999-01-29 | 2000-08-08 | Nippei Toyama Corp | Method for fitting and removing wire saw and work |
US6468134B1 (en) * | 2000-06-30 | 2002-10-22 | Lam Research Corporation | Method and apparatus for slurry distribution |
JP3967969B2 (en) * | 2002-06-27 | 2007-08-29 | 京セラ株式会社 | Wire saw |
JP2004195555A (en) * | 2002-12-16 | 2004-07-15 | Komatsu Electronic Metals Co Ltd | Slurry nozzle for wire saw |
JP4083152B2 (en) | 2004-07-29 | 2008-04-30 | 日本碍子株式会社 | Wire saw equipment |
JP5072204B2 (en) * | 2005-08-31 | 2012-11-14 | 信越半導体株式会社 | Method and wire saw apparatus for improving nanotopography of wafer surface |
JP5080769B2 (en) * | 2006-09-15 | 2012-11-21 | 株式会社東京精密 | Polishing method and polishing apparatus |
JP4816511B2 (en) * | 2007-03-06 | 2011-11-16 | 信越半導体株式会社 | Cutting method and wire saw device |
JP5003294B2 (en) * | 2007-06-08 | 2012-08-15 | 信越半導体株式会社 | Cutting method |
JP5045378B2 (en) * | 2007-11-08 | 2012-10-10 | 信越半導体株式会社 | Wire saw equipment |
JP5234010B2 (en) | 2008-02-19 | 2013-07-10 | 信越半導体株式会社 | Wire saw and workpiece cutting method |
JP5056645B2 (en) | 2008-07-23 | 2012-10-24 | 信越半導体株式会社 | Work cutting method and wire saw |
WO2010120491A2 (en) * | 2009-04-01 | 2010-10-21 | Cabot Microelectronics Corporation | Self-cleaning wiresaw apparatus and method |
JP2011143504A (en) * | 2010-01-14 | 2011-07-28 | Mitsubishi Electric Corp | Wire saw device |
KR101185683B1 (en) * | 2011-02-23 | 2012-09-24 | 주식회사 엘지실트론 | Sawing apparatus of single cystral the same |
JP5775381B2 (en) * | 2011-06-28 | 2015-09-09 | コマツNtc株式会社 | Wire saw machining fluid nozzle |
JP2013129046A (en) * | 2011-12-22 | 2013-07-04 | Shin Etsu Handotai Co Ltd | Workpiece cutting method |
CN202685118U (en) * | 2012-07-03 | 2013-01-23 | 浙江昱辉阳光能源有限公司 | Diamond wire slicer |
DE102014208187B4 (en) * | 2014-04-30 | 2023-07-06 | Siltronic Ag | Process for the simultaneous cutting of a large number of slices with a particularly uniform thickness from a workpiece |
-
2015
- 2015-05-01 JP JP2015094358A patent/JP6304118B2/en active Active
-
2016
- 2016-03-03 CN CN201680016080.7A patent/CN107427986B/en active Active
- 2016-03-03 DE DE112016001209.8T patent/DE112016001209T5/en active Pending
- 2016-03-03 SG SG11201707726YA patent/SG11201707726YA/en unknown
- 2016-03-03 US US15/558,833 patent/US10589446B2/en active Active
- 2016-03-03 SG SG10201807320WA patent/SG10201807320WA/en unknown
- 2016-03-03 WO PCT/JP2016/001146 patent/WO2016178297A1/en active Application Filing
- 2016-03-03 KR KR1020177028728A patent/KR102568196B1/en active IP Right Grant
- 2016-03-07 TW TW105106853A patent/TWI692394B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20180004111A (en) | 2018-01-10 |
TWI692394B (en) | 2020-05-01 |
SG10201807320WA (en) | 2018-09-27 |
WO2016178297A1 (en) | 2016-11-10 |
CN107427986B (en) | 2019-07-09 |
US10589446B2 (en) | 2020-03-17 |
JP2016209947A (en) | 2016-12-15 |
JP6304118B2 (en) | 2018-04-04 |
US20180079108A1 (en) | 2018-03-22 |
CN107427986A (en) | 2017-12-01 |
TW201639680A (en) | 2016-11-16 |
KR102568196B1 (en) | 2023-08-18 |
DE112016001209T5 (en) | 2017-12-07 |
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