CN202685118U - Diamond wire slicer - Google Patents
Diamond wire slicer Download PDFInfo
- Publication number
- CN202685118U CN202685118U CN 201220322917 CN201220322917U CN202685118U CN 202685118 U CN202685118 U CN 202685118U CN 201220322917 CN201220322917 CN 201220322917 CN 201220322917 U CN201220322917 U CN 201220322917U CN 202685118 U CN202685118 U CN 202685118U
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- nozzle
- cooling fluid
- cutting line
- gauze
- diamond cutting
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Abstract
The utility model discloses a diamond wire slicer and the diamond wire slicer is used for cutting silicon blocks into silicon slices during the productive process of solar cells. A nozzle is arranged above a line network of the diamond wire slicer, the nozzle is in the shape of a long barrel and one end of the nozzle is sealed, and a cooling liquid discharging opening is arranged on the side of the nozzle. Two sides of the liquid cooling discharging opening are provided with a liquid guiding plate, wherein the liquid guiding plate is used for diverting the cooling liquid to a contact part of the line network and the silicon blocks, and the angle between the liquid guiding plate and a plane which the line network is in is an acute angle. The liquid guiding plate enables the cooling liquid to be diverted to a place much closer to a cutting part, and therefore enables the cooling liquid to enter the cutting part of the line network and the silicon blocks much easier, and the cooling liquid plays the role of cooling and lubrication. Due to the angle between the liquid guiding plate and the line network is the acute angle, a cooling liquid curtain is enabled to flow to the cutting part of the line network and the silicon blocks in an inclined mode, splash of the cooling liquid can be effectively reduced, sufficient cooling liquid can be guaranteed to flow into the contacting part of the silicon blocks and the line network, and therefore stability of the diamond wire slicer and qualities of the cut silicon slices can be improved.
Description
Technical field
The utility model relates to the manufacture of solar cells field of mechanical technique, particularly a kind of solar battery sheet used diamond cutting line slicing machine in process of production.
Background technology
So-called diamond cutting line slicing machine mainly is the diamond that utilizes molecule on steel wire is inlayed, thereby make diamond wire, because diamond wire has had the miniature sawtooth of diamond, thereby diamond wire itself has possessed cutting power, diamond wire is made into the Buddha's warrior attendant gauze at guide wheel, then the high-speed motion by the Buddha's warrior attendant gauze, the machine that the silicon material is cut.
Because the Buddha's warrior attendant gauze is producing violent friction between meeting and the silico briquette in the middle of the process of cutting silicon material, thereby in the middle of the process of diamond cutting line slicing machine running, can produce a large amount of heats, this just need to cool off the Buddha's warrior attendant gauze, makes its cooling guarantee normal cutting temperature.General Buddha's warrior attendant gauze refrigerating mode is the coolant nozzle that cooling fluid is transported to the online side of diamond wire by pump at present, it is online that coolant nozzle is sprayed on the diamond wire that runs up with cooling fluid, coolant nozzle is generally hollow structure, and install perpendicular to the steel wire in the Buddha's warrior attendant gauze, cover every steel wire in the Buddha's warrior attendant gauze, the cooling fluid ejiction opening be opened in coolant nozzle corresponding with the Buddha's warrior attendant gauze under the straight line opening, thereby cooling fluid is to be the curtain shape vertically to spray in the diamond wire that runs up online.
Because the distance between nozzle and the Buddha's warrior attendant gauze is very little, the Buddha's warrior attendant gauze is running up simultaneously, can cause that a large amount of cooling fluids is irregular splashes the moment that cooling fluid vertically is injected in the Buddha's warrior attendant gauze, so that cooling fluid can not be according to expecting that in advance the contact site that enters diamond wire and silicon material plays cooling and lubricated effect, thereby cause the rapid rising of silicon temperature, the undesirable condition such as dry grinding between diamond wire and the silicon material, have a strong impact on the cut quality of silicon chip, the even more serious fracture that may cause whole Buddha's warrior attendant gauze even scrap brings massive losses to production.
Therefore, how can avoid cooling fluid to be injected in the phenomenon that cooling fluid that diamond wire occurs when online is splashed everywhere, so that cooling fluid can enter according to expection the contact site of silicon chip and diamond wire, be the technical problem that present those skilled in the art need solution badly.
The utility model content
The purpose of this utility model provides a kind of diamond cutting line slicing machine, with solve present diamond wire cutting machine in the middle of cutting process owing to cooling fluid can not according to expection enter into the problem of the contact site of silicon chip and diamond wire in the splash cooling fluid that causes of diamond wire on the net everywhere.
For solving the problems of the technologies described above, the gauze top that the utility model provides is provided with for the nozzle that sprays cooling fluid, described nozzle is the long tubular of end sealing, and described nozzle is provided with the cooling fluid ejiction opening on the side, the both sides of described cooling fluid ejiction opening are provided with for the deflector that cooling fluid is guided to the contact site of gauze and silico briquette, and the angle on the plane at described deflector and described gauze place is acute angle.
Preferably, described deflector is perpendicular to the side at described cooling fluid ejiction opening place.
Preferably, the angle on the plane at described deflector and described gauze place is 30 °-60 °.
Preferably, the angle on the plane at described deflector and described gauze place is 40 °-50 °.
Preferably, the minimum range on described deflector and plane, Buddha's warrior attendant tape place is 3-6mm.
Preferably, described nozzle and/or deflector are stainless steel, and the internal diameter of described nozzle is 28mm-30mm, and wall thickness is 2mm-4mm.
Preferably, comprise that also the mesh diameter on the cold liquid conveyance conduit that is arranged at described diamond cutting line slicing machine is the filter of 0.1mm-1mm.
Preferably, described filter is arranged on the heat exchanger of diamond cutting line slicing machine and the cooling fluid conveyance conduit between the nozzle.
Preferably, described filter is y-type filter.
Preferably, described filter is bag filter.
By above technical scheme as can be known, diamond cutting line slicing machine provided by the utility model is provided with deflector in the both sides of the cooling fluid ejiction opening of nozzle, this deflector is used for the curtain shape cooling fluid of nozzle ejection is guided to the contact site of gauze and silico briquette, and the angle on the plane at deflector and Buddha's warrior attendant gauze place is acute angle.Than prior art, the cooling fluid that is arranged so that of deflector can be guided to the place more approaching with cutting part, thereby make cooling fluid enter into the cutting position of gauze and silico briquette, play the effect of Cooling and Lubricator, simultaneously because the plane at deflector and gauze place is acute angle, therefore the cooling fluid that ejects from deflector also is acute angle with the angle of gauze, thereby make the cooling fluid curtain flow to the cutting part of gauze and silico briquette in the mode that tilts, effectively reduced splashing of cooling fluid, thereby further guarantee to make more cooling fluid to flow to the contact position of silicon chip and gauze, play effect lubricated and cooling, and then improve the stability of diamond wire cutting machine and the quality of cutting silicon wafer.
Description of drawings
Fig. 1 provides the structural representation of the nozzle in the diamond cutting line slicing machine for the utility model embodiment;
Fig. 2 is the scheme of installation of the nozzle shown in Fig. 1 in diamond cutting line slicing machine;
Fig. 3 provides the structural representation of the coolant delivery system in the diamond cutting line slicing machine for the utility model embodiment.
The specific embodiment
The utility model core purpose provides a kind of diamond cutting line slicing machine, the cooling fluid ejiction opening both sides of the coolant nozzle in this diamond cutting line slicing machine are provided with for the deflector that cooling fluid is guided to the cutting part of gauze and silico briquette, thereby cooling fluid can be guided to the position more approaching with cutting part, so that more cooling fluid can arrive cutting part, play effect lubricated and cooling.
In order to make those skilled in the art person understand better the utility model scheme, the utility model is described in further detail below in conjunction with drawings and embodiments.
Please also refer to Fig. 1 and Fig. 2, wherein Fig. 1 provides the structural representation of the nozzle in the diamond cutting line slicing machine for the utility model embodiment, and Fig. 2 is the scheme of installation of the nozzle shown in Fig. 1 in diamond cutting line slicing machine.
Diamond cutting line slicing machine provided by the utility model, the production process that is used for solar battery sheet cuts into silicon chip with silico briquette, diamond cutting line slicing machine passes through diamond wire on the guide wheel 5 with wire casing, form one deck gauze 3, the top of gauze 3 is provided with the silico briquette clamping device, in slicing processes, the silico briquette clamping device drives silico briquette 4 with suitable speed and moves downward, the gauze 3 that contact runs up, gauze 3 is cut into silicon chip with silico briquette, friction can produce amount of heat between gauze 3 and the silico briquette 4 in slicing processes, thereby the top of gauze 3 is provided with for the nozzle 1 that sprays cooling fluid, nozzle 1 is the long tubular of end sealing, its profile of the nozzle of this long tubular can also can be cylindrical for polygon, for the convenience of processing and producing, preferred employing profile is columniform nozzle in the present embodiment, nozzle 1 a untight end is the cooling fluid entrance, offer the cooling fluid ejiction opening on the side of nozzle 1, the whole piece opening of this cooling fluid ejiction opening for axially offering along nozzle 1, and be provided with for cooling fluid being guided to the deflector 2 of gauze 3 with the contact site of silico briquette 4 in the both sides of cooling fluid ejiction opening, because the cooling fluid ejiction opening is along nozzle shaft to the whole piece opening of offering, and nozzle 1 is installed perpendicular to every diamond wire in the gauze 3, be the curtain shape when therefore cooling fluid sprays, and cover every diamond wire on the gauze 3, deflector 2 is acute angle with the angle on the plane at gauze 3 places, so that cooling fluid is ejected on the diamond wire in the mode that tilts, prevent that the moment of cooling fluid contact gauze 3 from producing splash phenomena.
By finding out among the above embodiment, the cooling fluid that is arranged so that of deflector 2 can be guided to the position more approaching with cutting part, thereby make more cooling fluid can enter into the cutting position of gauze 3 and silico briquette 4, play the effect of Cooling and Lubricator, simultaneously, deflector 2 in above-described embodiment is acute angle with the plane at gauze 3 places, therefore the cooling fluid that ejects from deflector 2 also is acute angle with the angle of gauze 3, thereby so that the cooling fluid of curtain shape can flow in the mode that tilts the cutting part of gauze 3 and silico briquette 4, the a large amount of splash phenomena of cooling fluid that caused when effectively having avoided cooling fluid to be injected on the diamond wire, make more cooling fluid along with diamond wire has entered into cutting position, play the effect of lubricated and cooling, and then improved the stability of diamond wire cutting machine integral body and the quality of cutting silicon wafer.
For the convenience of producing, deflector 2 at right angle settings in the present embodiment are in the side at cooling fluid ejiction opening place.
By deflector 2 being set and making deflector 2 and the plane at gauze 3 places be acute angle, can realize entering into heeling condition from the cooling fluid of deflector 2 ejections the cutting part of gauze 3 and silico briquette 4, to reduce cooling fluid splashing on gauze 3, prevent the effect that cooling fluid is splashed in order further to improve, deflector 2 preferably is set to 30 °-60 ° with the plane at gauze 3 places in the present embodiment, further, can be set to 40 °-50 °.
Just the cooling fluid from deflector 2 ejections still has larger momentum, if the bottom off-line net 3 of deflector 2 is too near, then may splash owing to the excessive cooling fluid to a certain degree that causes of cooling fluid momentum, therefore the minimum range on the plane at deflector 2 and gauze 3 places is 3-6mm in the present embodiment, in this distance, splashing in a large number of cooling fluid can be do not caused, thereby the cooling fluid of diamond wire abundance can be guaranteed to supply with.
In order to prevent that nozzle 1 from use getting rusty, affect the use of nozzle 1, nozzle 1 in the present embodiment and/or deflector 2 adopt stainless steel to make, and the internal diameter of nozzle 1 preferably is set to 28mm-30mm, wall thickness preferably is set to 2mm-4mm, and certainly, nozzle 1 or deflector 2 can also be made of other materials that satisfies intensity and antiseptic property requirement, for example adopt engineering plastics, in the present embodiment this is not done concrete restriction.
In the middle of the process of diamond cutting line slicing machine work; can produce a large amount of silica flour particulates; and the particle diameter of silica flour particulate is very little; basic is micron level; these particulates can be entrained in the cooling fluid through cutting part; at present the screen pack of diamond wire cutting machine gauze 3 bottoms is because its pore size filter is larger, and still some small silicon powder particle has been along with cooling has entered coolant duct, and finally follows cooling fluid and enter in next time the cooling procedure.These silicon powder particles not only can affect the cutting power of diamond wire, and in cutting, easily reunite, thereby the cooling fluid ejiction opening of plug nozzle 1, make the desultory ejection of cooling fluid, disconnected curtain phenomenon namely occurs, this can directly cause dry grinding between diamond wire and the silico briquette 4, has a strong impact on Si wafer quality, even cause gauze 3 to be scrapped, bring massive losses to production.
The coolant system of diamond wire cutting machine please refer to Fig. 3, the direction of arrow represents the flow direction of cooling fluid, cooling fluid is pumped into from the fluid reservoir 7 of bottom by circulating pump 8 carries out heat exchange in the heat exchanger 9, to reduce the temperature of cooling fluid, then be ejected on the gauze 3 that runs up by nozzle 1, last cooling fluid is collected in the fluid reservoir through the cooling fluid catch tray 6 of gauze 3 bottoms, circulates next time.In order to address the above problem, the present embodiment also is provided with the filter 10 that mesh diameter is 0.1mm-1mm at the cooling fluid conveyance conduit of above-mentioned diamond wire cutting machine, in order to filter the small silicon powder particle in the cooling fluid.
Preferably, in the present embodiment filter 10 is arranged on the cooling fluid conveyance conduit between heat exchanger 9 and the nozzle 1, can guarantees that like this nozzle 1 is not stopped up by the silica flour particulate, thereby guarantee that cooling fluid continues to be fed on the gauze 3.
Y-type filter has the structure advanced person, resistance is little, with blowdown advantage easily, therefore the filter in the present embodiment preferably adopts y-type filter, and is more preferred, adopts bag filter that cooling fluid is filtered, the bag filter filter has that treating capacity is large, volume is little, the advantage that dirt content is large, and its replacing filter bag is convenient and swift, saving of work and time.
Above diamond cutting line slicing machine provided by the utility model is described in detail.Used specific case herein principle of the present utility model and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall into the protection domain of the utility model claim.
Claims (10)
1. diamond cutting line slicing machine, be used for the solar battery sheet production process silico briquette is cut into silicon chip, the gauze of described diamond cutting line slicing machine (3) top is provided with for the nozzle (1) that sprays cooling fluid, described nozzle (1) is the long tubular nozzle of end sealing, and described nozzle (1) is provided with the cooling fluid ejiction opening on the side, it is characterized in that, the both sides of described cooling fluid ejiction opening are provided with the deflector (2) for the contact site that cooling fluid is guided to gauze (3) and silico briquette (4), and the angle on the plane at described deflector (2) and described gauze (3) place is acute angle.
2. diamond cutting line slicing machine according to claim 1 is characterized in that, described deflector (2) is perpendicular to the side at described cooling fluid ejiction opening place.
3. diamond cutting line slicing machine according to claim 1 is characterized in that, described deflector (2) is 30 °-60 ° with the angle on the plane at described gauze (3) place.
4. diamond cutting line slicing machine according to claim 3 is characterized in that, described deflector (2) is 40 °-50 ° with the angle on the plane at described gauze (3) place.
5. diamond cutting line slicing machine according to claim 1 is characterized in that, described deflector (2) is 3-6mm with the minimum range on described gauze (3) plane, place.
6. diamond cutting line slicing machine according to claim 1 is characterized in that, described nozzle (1) and/or deflector (2) are stainless steel, and the internal diameter of described nozzle (1) is 28mm-30mm, and wall thickness is 2mm-4mm.
7. diamond cutting line slicing machine according to claim 1 is characterized in that, comprises that also the mesh diameter on the cold liquid conveyance conduit that is arranged at described diamond cutting line slicing machine is the filter (10) of 0.1mm-1mm.
8. diamond cutting line slicing machine according to claim 7 is characterized in that, described filter (10) is arranged on the heat exchanger (9) and the cooling fluid conveyance conduit between the nozzle (1) of diamond cutting line slicing machine.
9. according to claim 7 or 8 described diamond cutting line slicing machines, it is characterized in that, described filter (10) is y-type filter.
10. according to claim 7 or 8 described diamond cutting line slicing machines, it is characterized in that, described filter (10) is bag filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220322917 CN202685118U (en) | 2012-07-03 | 2012-07-03 | Diamond wire slicer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220322917 CN202685118U (en) | 2012-07-03 | 2012-07-03 | Diamond wire slicer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202685118U true CN202685118U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220322917 Expired - Fee Related CN202685118U (en) | 2012-07-03 | 2012-07-03 | Diamond wire slicer |
Country Status (1)
| Country | Link |
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| CN (1) | CN202685118U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103600426A (en) * | 2013-10-22 | 2014-02-26 | 无锡上机数控股份有限公司 | Numerically controlled diamond wire saw slicing machine |
| JP2016209947A (en) * | 2015-05-01 | 2016-12-15 | 信越半導体株式会社 | Wire saw device |
| CN106313352A (en) * | 2016-11-21 | 2017-01-11 | 宁晋松宫电子材料有限公司 | Method for improving silicon slice cutting thickness uniformity |
| CN108422572A (en) * | 2018-05-03 | 2018-08-21 | 浙江海顺新能源有限公司 | A kind of efficient silicon chip slicing device |
| CN108789889A (en) * | 2018-07-26 | 2018-11-13 | 苏州润桐专利运营有限公司 | A kind of monocrystalline silicon Buddha's warrior attendant wire-electrode cutting device |
| CN116277560A (en) * | 2023-05-17 | 2023-06-23 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
-
2012
- 2012-07-03 CN CN 201220322917 patent/CN202685118U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103600426A (en) * | 2013-10-22 | 2014-02-26 | 无锡上机数控股份有限公司 | Numerically controlled diamond wire saw slicing machine |
| JP2016209947A (en) * | 2015-05-01 | 2016-12-15 | 信越半導体株式会社 | Wire saw device |
| CN106313352A (en) * | 2016-11-21 | 2017-01-11 | 宁晋松宫电子材料有限公司 | Method for improving silicon slice cutting thickness uniformity |
| CN108422572A (en) * | 2018-05-03 | 2018-08-21 | 浙江海顺新能源有限公司 | A kind of efficient silicon chip slicing device |
| CN108789889A (en) * | 2018-07-26 | 2018-11-13 | 苏州润桐专利运营有限公司 | A kind of monocrystalline silicon Buddha's warrior attendant wire-electrode cutting device |
| CN108789889B (en) * | 2018-07-26 | 2020-10-27 | 浙江红绿蓝纺织印染有限公司 | Monocrystalline silicon buddha's warrior attendant wire cutting device |
| CN116277560A (en) * | 2023-05-17 | 2023-06-23 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
| CN116277560B (en) * | 2023-05-17 | 2023-08-11 | 浙江求是半导体设备有限公司 | Crystal bar cutting system and diamond wire service life detection method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20210703 |