CN108422572A - A kind of efficient silicon chip slicing device - Google Patents
A kind of efficient silicon chip slicing device Download PDFInfo
- Publication number
- CN108422572A CN108422572A CN201810414470.0A CN201810414470A CN108422572A CN 108422572 A CN108422572 A CN 108422572A CN 201810414470 A CN201810414470 A CN 201810414470A CN 108422572 A CN108422572 A CN 108422572A
- Authority
- CN
- China
- Prior art keywords
- gauze
- cutting
- lathe
- silicon chip
- slicing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Abstract
The invention discloses a kind of efficient silicon chip slicing devices, including lathe, the middle-end of the cabinet leg is fixedly connected with disposal box, and the bottom on the right side of disposal box offers discharge port, the surrounding of the cabinet leg has been fixedly connected with support leg, and the bottom of support leg is fixedly connected with sleeve, the top of the barrel bore is connected with motion bar by spring, the bottom of motion bar is movably installed with idler wheel, and the middle-end at the top of lathe is fixedly connected with mounting base, the lower end of the installation base inner surface is symmetrically arranged with folding and unfolding shaft.The present invention has been symmetrical arranged folding and unfolding shaft in the lower end of installation base inner surface, and it is mounted with that the first diamond wire slice, the second diamond wire slice and third diamond wire are sliced by rotor successively activity from top to bottom in the inside of mounting plate, the cutting efficiency and cutting accuracy of silicon chip can be effectively improved, this slicing device is simple in structure simultaneously, installation and inspection easy to disassemble, meet the interests of enterprise itself.
Description
Technical field
The present invention relates to silicon wafer processing equipment technical field, specially a kind of efficient silicon chip slicing device.
Background technology
Silicon wafer thickness is a factor for influencing productivity, it is related to the silicon chip quantity that each silico briquette is produced, and is surpassed
Thin silicon chip proposes additional challenge to scroll saw technology, because its production process wants much more difficult, in addition to the machinery of silicon chip is crisp
Property other than, if wire saw process is controlled without accurate, subtle crackle and bending can all have a negative impact to product yield, surpass
Thin silicon wafer scroll saw system is necessary can, cutting speed linear to technique and pressure and the accurate control of cutting coolant liquid progress.
No matter the thickness of silicon chip, crystal silicon photovoltaic cell manufacture commercial city high requirement, silicon are proposed to the quality of silicon chip
Piece cannot have surface damage（Blind crack, the scroll saw marking）, and pattern defect（Bending, concave-convex, became uneven）It minimizes, together
When the requirement that additional back-end processing such as polishes will be also preferably minimized, silicon chip be unable to do without slicer in process to be made
With, but its cutting efficiency of existing slicer is low, and cutting accuracy cannot ensure, while its is complicated, for tearing open for people
Unloading installation and inspection makes troubles, for this purpose, it is proposed that a kind of efficient silicon chip slicing device.
Invention content
The purpose of the present invention is to provide a kind of efficient silicon chip slicing devices, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the present invention provides the following technical solutions：A kind of efficient silicon chip slicing device, including lathe,
The middle-end of the cabinet leg is fixedly connected with disposal box, and the bottom on the right side of disposal box offers discharge port, the lathe bottom
The surrounding in portion has been fixedly connected with support leg, and the bottom of support leg is fixedly connected with sleeve, and the top of the barrel bore is logical
It crosses spring and is connected with motion bar, the bottom of motion bar is movably installed with idler wheel, and the middle-end at the top of lathe is fixedly connected with
The lower end of mounting base, the installation base inner surface is symmetrically arranged with folding and unfolding shaft, and the front and back two sides of folding and unfolding shaft outer surface is equal
It is socketed with housing, limited block, the inner surface of the mounting base and the inside positioned at folding and unfolding shaft are fixedly connected on the outside of housing
It is symmetrically arranged with mounting plate, and the inside of mounting plate is movably installed with the first diamond wire by rotor from top to bottom and cut successively
Piece, the second diamond wire slice and third diamond wire are sliced, and the upper end on the left of the mounting base offers line outlet, and mounting base is right
The upper end of side offers incoming line, and the lower end on the left of the mounting base is installed with suction ventilator, and the outlet air end of suction ventilator is logical
Piping is connected to the top on the left of disposal box.
Preferably, operating method includes the following steps：
A, lathe rinses；
B, housing, rotor are replaced；
C, gauze prepares；
D, reset；
E, heat engine inspection；
F, cutting starts, gauze monitors；
G, process finishing.
Preferably, the lathe flushing includes with lower part：1., filter bag per knife clear up；2., slurry mouth per knife clear up；③、
Strainer is cleared up per knife；4., per knife pure water rinsing cutting chamber, emphasis clears up guide wheel and gauze, cutting chamber a front surface and a side surface.
Preferably, the housing, rotor replacement seriously affect lathe cut quality, and replacing will cause to break not in time
Etc. potential operation risk, therefore inspection confirmation must be carried out to housing, rotor abrasion situation before cutting, and emphasis checks line
The housing abrasion condition of mouth, incoming line is directed to part and uses rotor lathe, replaces rotor according to the side overturned above and below in addition
Formula uses the secondary period.
Preferably, gauze preparation includes gauze cabling and public bus network readjustment, and gauze cabling is knife use and return line to cut
The technique cut, it is desirable that invert old line part to Wire winding shaft from paying out reel, specific anti-line amount instructs to operate according to cutting technique；
Public bus network readjustment is mainly aligned gauze and goes bottom situation, prevents center line gap is inconsistent caused by silico briquette size is inconsistent from causing to cut
Quality influences.
Preferably, the reset is：Since the processing starting position of Buddha's warrior attendant wire cutting is -1.0mm, silico briquette zero
The position of point setting will be bonded gauze completely and be configured, after leading to cutting and different if dead-center position setting is excessively high
The case where.
Preferably, the heat engine is as last work before lathe cutting, it is desirable that operating personnel conscientiously check gauze feelings
Condition cleans out foreign matter in guide wheel, cutting chamber, it is desirable that open side plate, low speed rotates forward gauze, observation gauze everywhere whether
There are abnormal empty slot and wire jumper situation, and is judged by the planarization of gauze.
Preferably, gauze monitoring is to be timed to check to the gauze in cutting process, and timely to abnormal conditions
It is adjusted the loss for avoiding the occurrence of bigger；Gauze is checked to be carried out from lathe observation window using flashlight auxiliary, and line is determined before observing
Net just in inverted running, avoids cutting liquid from influencing observing effect and cutting liquid spillage, and shut down in institute's wired network operational process,
Ensure to shut down when gauze runs a cycle, i.e. inverted running reduction of speed before shutting down, no it will cause shut down stria and aberration piece.
Preferably, lathe automatic alarm after the machine tooling, employee need to judge whether silico briquette cuts through,
Gauze is substantially in alignment from incoming line to line outlet when cutting through, not primary indentation obviously occur, while can be with adjustment pair
It is compared than gauze, gauze is in parallel.
Compared with prior art, beneficial effects of the present invention are as follows：
1. the present invention has been symmetrical arranged folding and unfolding shaft in the lower end of installation base inner surface, and equal from top to bottom in the inside of mounting plate
It is mounted with the first diamond wire slice, the second diamond wire slice and third diamond wire slice by rotor successively activity, can effectively carry
The cutting efficiency and cutting accuracy of high silicon chip, while this slicing device is simple in structure, installation and inspection easy to disassemble meet enterprise
The interests of industry itself.
2. the present invention is provided with spring between sleeve and motion bar, damping can be played the role of, ensured that this slice fills
It sets in the mobile stability with during use, improves its service life.
Description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is present invention process flow diagram.
In figure：1 lathe, 2 limited blocks, 3 folding and unfolding shafts, 4 incoming lines, 5 mounting plates, 6 first diamond wires slice, 7 second gold medals
Rigid line slice, 8 third diamond wires slice, 9 line outlets, 10 housings, 11 mounting bases, 12 support legs, 13 rotors, 14 sleeves, 15 rollings
Wheel, 16 motion bars, 17 springs, 18 discharge ports, 19 disposal boxes, 20 pipelines, 21 suction ventilators.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, a kind of efficient silicon chip slicing device, including lathe 1, the middle-end of 1 bottom of lathe are fixedly connected with
Disposal box 19, and the bottom on 19 right side of disposal box offers discharge port 18, the surrounding of 1 bottom of lathe has been fixedly connected with support leg
12, and the bottom of support leg 12 is fixedly connected with sleeve 14, the top of 14 inner cavity of sleeve is connected with activity by spring 17
Bar 16, spring 17 can play the role of damping, ensure that this slicing device in the mobile stability with during use, improves
The bottom of its service life, motion bar 16 is movably installed with idler wheel 15, and the middle-end at 1 top of lathe is fixedly connected with mounting base
11, the lower end of 11 inner surface of mounting base is symmetrically arranged with folding and unfolding shaft 3, and the front and back two sides of 3 outer surface of folding and unfolding shaft is socketed
There are housing 10, the outside of housing 10 to be fixedly connected with limited block 2, the inner surface of mounting base 11 and the inside positioned at folding and unfolding shaft 3
It is symmetrically arranged with mounting plate 5, and the inside of mounting plate 5 is movably installed with the first diamond wire successively by rotor 13 from top to bottom
It is sliced the 6, second diamond wire slice 7 and third diamond wire slice 8, the cutting efficiency and cutting accuracy of silicon chip can be effectively improved,
This slicing device is simple in structure simultaneously, and installation and inspection easy to disassemble meet the interests of enterprise itself, upper on the left of mounting base 11
End offers line outlet 9, and the upper end on 11 right side of mounting base offers incoming line 4, and the lower end in 11 left side of mounting base is fixedly mounted
There is suction ventilator 21, and the outlet air end of suction ventilator 21 is connected to by pipeline 20 with the top in 19 left side of disposal box.
Its operating method includes the following steps：
A, lathe 1 rinses；
B, housing 10, rotor 13 are replaced；
C, gauze prepares；
D, reset；
E, heat engine inspection；
F, cutting starts, gauze monitors；
G, process finishing.
The flushing of lathe 1 includes with lower part：1., filter bag per knife clear up；2., slurry mouth per knife clear up；3., strainer per knife it is clear
Reason；4., per knife pure water rinsing cutting chamber, emphasis clears up guide wheel and gauze, cutting chamber a front surface and a side surface.
Housing 10, the replacement of rotor 13 seriously affect 1 cut quality of lathe, and replacing will cause broken string etc. potential not in time
Operation risk, therefore inspection confirmation must be carried out to housing 10,13 abrasion condition of rotor before cutting, and emphasis check line mouth 9,
10 abrasion condition of housing of incoming line 4 is directed to part and uses rotor lathe in addition, replaces rotor 13 according to reverse above and below
Mode uses the secondary period.
Gauze preparation includes gauze cabling and public bus network readjustment, and gauze cabling is knife using the technique for returning wire cutting,
It asks and inverts old line part to Wire winding shaft from paying out reel, specific anti-line amount instructs to operate according to cutting technique；Public bus network readjustment master
It is aligned gauze and goes bottom situation, prevent center line gap is inconsistent caused by silico briquette size is inconsistent from cut quality being caused to influence.
Reset is：Since the processing starting position of Buddha's warrior attendant wire cutting is -1.0mm, the position of silico briquette reset
Gauze will be bonded completely by, which setting, is configured, if dead-center position be arranged it is excessively high, after cutting will be caused and different situation.
Heat engine as lathe 1 cut before last work, it is desirable that operating personnel conscientiously check gauze situation, by guide wheel,
Foreign matter is cleaned out in cutting chamber, it is desirable that opens side plate, low speed rotates forward gauze, and whether observation gauze has abnormal empty slot everywhere
With wire jumper situation, and judged by the planarization of gauze.
Gauze monitoring is to be timed to check to the gauze in cutting process, and be adjusted abnormal conditions in time and avoid
There is the loss of bigger；Gauze is checked to be carried out from 1 observation window of lathe using flashlight auxiliary, determines that gauze is reversely transported before observing
Row avoids cutting liquid from influencing observing effect and cutting liquid spillage, and is shut down in institute's wired network operational process, ensures line before shutting down
It is shut down when one cycle of network operation, i.e. inverted running reduction of speed, no it will cause shut down stria and aberration piece.
1 automatic alarm of lathe after 1 process finishing of lathe, employee need to judge whether silico briquette cuts through, line when cutting through
Net is substantially in alignment from incoming line 4 to line outlet 9, not primary indentation obviously occur, while can compare gauze with adjustment
Comparison, gauze are in parallel.
In use, be symmetrical arranged folding and unfolding shaft 3 in the lower end of 11 inner surface of mounting base, and the inside of mounting plate 5 from
Under to it is upper by rotor 13 successively activity be mounted with the first diamond wire be sliced the 6, second diamond wire slice 7 and third diamond wire cut
Piece 8 can effectively improve the cutting efficiency and cutting accuracy of silicon chip, while this slicing device is simple in structure, installation easy to disassemble
With inspection, meet the interests of enterprise itself, meanwhile, it is provided with spring 17 between sleeve 14 and motion bar 16, damping can be played
Effect, ensured that this slicing device in the mobile stability with during use, improves its service life.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. a kind of efficient silicon chip slicing device, including lathe（1）, it is characterised in that：The lathe（1）The middle-end of bottom, which is fixed, to be connected
It is connected to disposal box（19）, and disposal box（19）The bottom on right side offers discharge port（18）, the lathe（1）The surrounding of bottom is equal
It is fixedly connected with support leg（12）, and support leg（12）Bottom be fixedly connected with sleeve（14）, the sleeve（14）Inner cavity
Top passes through spring（17）It is connected with motion bar（16）, motion bar（16）Bottom be movably installed with idler wheel（15）, and machine
Bed（1）The middle-end at top is fixedly connected with mounting base（11）, the mounting base（11）The lower end of inner surface is symmetrically arranged with folding and unfolding
Shaft（3）, and folding and unfolding shaft（3）The front and back two sides of outer surface is socketed with housing（10）, housing（10）Outside be fixedly connected
There is limited block（2）, the mounting base（11）Inner surface and be located at folding and unfolding shaft（3）Inside be symmetrically arranged with mounting plate（5）,
And mounting plate（5）Inside pass through rotor from top to bottom（13）It is movably installed with the first diamond wire slice successively（6）, the second gold medal
Rigid line slice（7）It is sliced with third diamond wire（8）, the mounting base（11）The upper end in left side offers line outlet（9）, and install
Seat（11）The upper end on right side offers incoming line（4）, the mounting base（11）The lower end in left side is installed with suction ventilator（21）,
And suction ventilator（21）Outlet air end pass through pipeline（20）With disposal box（19）The top in left side is connected to.
2. a kind of efficient silicon chip slicing device according to claim 1, it is characterised in that：Its operating method includes following step
Suddenly：
A, lathe（1）It rinses；
B, housing（10）, rotor（13）It replaces；
C, gauze prepares；
D, reset；
E, heat engine inspection；
F, cutting starts, gauze monitors；
G, process finishing.
3. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The lathe（1）Flushing includes
With lower part：1., filter bag per knife clear up；2., slurry mouth per knife clear up；3., strainer per knife clear up；4., per knife pure water rinsing
Cutting chamber, emphasis clear up guide wheel and gauze, cutting chamber a front surface and a side surface.
4. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The housing（10）, rotor
（13）It replaces to lathe（1）Cut quality seriously affects, and the potential operation risks such as broken string will be led to not in time by replacing, therefore be cut
It must be to housing before cutting（10）, rotor（13）Abrasion condition carries out inspection confirmation, and emphasis checks line mouth（9）, incoming line（4）
Housing（10）Abrasion condition is directed to part and uses rotor lathe, in addition to rotor（13）It replaces in the way of overturning above and below
Use the secondary period.
5. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The gauze preparation includes gauze
Cabling and public bus network readjustment, and gauze cabling is knife using the technique for returning wire cutting, it is desirable that old line part is anti-from paying out reel
It is given to Wire winding shaft, specific anti-line amount instructs to operate according to cutting technique；Public bus network readjustment is mainly aligned gauze and goes bottom situation, prevent because
Center line gap is inconsistent caused by silico briquette size is inconsistent causes cut quality to influence.
6. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The reset is：Due to
The processing starting position of Buddha's warrior attendant wire cutting is -1.0mm, therefore the position of silico briquette reset will be bonded gauze completely and be set
Set, if dead-center position be arranged it is excessively high, after cutting will be caused and different situation.
7. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The heat engine is as lathe（1）
Last work before cutting, it is desirable that operating personnel conscientiously check gauze situation, and foreign matter in guide wheel, cutting chamber is cleaned out,
It is required that opening side plate, low speed rotates forward gauze, and whether observation gauze has abnormal empty slot and wire jumper situation everywhere, and passes through gauze
Planarization judged.
8. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The gauze monitoring is to cutting
Gauze in the process, which is timed, to be checked, and abnormal conditions are adjusted with the loss for avoiding the occurrence of bigger in time；Gauze is checked
From lathe（1）Observation window is carried out using flashlight auxiliary, determines that gauze just in inverted running, avoids cutting liquid from influencing observation before observing
Effect and cutting liquid splash out, and are shut down in institute's wired network operational process, ensure that gauze runs a cycle before shutting down, i.e., reversely
It is shut down when running reduction of speed, no it will cause shut down stria and aberration piece.
9. a kind of efficient silicon chip slicing device according to claim 2, it is characterised in that：The lathe（1）Process finishing
Lathe afterwards（1）Automatic alarm, employee need to judge whether silico briquette cuts through, and gauze is from incoming line when cutting through（4）To outlet
Mouthful（9）Substantially in alignment, it is primary indentation obviously occur, while can be compared with adjustment comparison gauze, gauze is flat with it
Row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810414470.0A CN108422572A (en) | 2018-05-03 | 2018-05-03 | A kind of efficient silicon chip slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810414470.0A CN108422572A (en) | 2018-05-03 | 2018-05-03 | A kind of efficient silicon chip slicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108422572A true CN108422572A (en) | 2018-08-21 |
Family
ID=63162228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810414470.0A Pending CN108422572A (en) | 2018-05-03 | 2018-05-03 | A kind of efficient silicon chip slicing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN108422572A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113843904A (en) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | Method and device for cutting solar silicon wafer and storage medium |
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| JP2005238393A (en) * | 2004-02-26 | 2005-09-08 | Noritake Super Abrasive:Kk | Cutter |
| CN202685118U (en) * | 2012-07-03 | 2013-01-23 | 浙江昱辉阳光能源有限公司 | Diamond wire slicer |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN205631048U (en) * | 2016-05-18 | 2016-10-12 | 浙江海顺新能源有限公司 | Efficient silicon bulk section device |
| CN205631049U (en) * | 2016-05-18 | 2016-10-12 | 浙江海顺新能源有限公司 | Multi -thread cutting of silicon bulk section device |
| CN208247213U (en) * | 2018-05-03 | 2018-12-18 | 浙江海顺新能源有限公司 | A kind of efficient silicon wafer slicing device |
-
2018
- 2018-05-03 CN CN201810414470.0A patent/CN108422572A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005238393A (en) * | 2004-02-26 | 2005-09-08 | Noritake Super Abrasive:Kk | Cutter |
| CN202685118U (en) * | 2012-07-03 | 2013-01-23 | 浙江昱辉阳光能源有限公司 | Diamond wire slicer |
| CN205167279U (en) * | 2015-12-02 | 2016-04-20 | 英利能源（中国）有限公司 | Silicon wafer cutting device |
| CN205631048U (en) * | 2016-05-18 | 2016-10-12 | 浙江海顺新能源有限公司 | Efficient silicon bulk section device |
| CN205631049U (en) * | 2016-05-18 | 2016-10-12 | 浙江海顺新能源有限公司 | Multi -thread cutting of silicon bulk section device |
| CN208247213U (en) * | 2018-05-03 | 2018-12-18 | 浙江海顺新能源有限公司 | A kind of efficient silicon wafer slicing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113843904A (en) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | Method and device for cutting solar silicon wafer and storage medium |
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