KR20140125740A - 몰드 성형용 이형 시트 - Google Patents

몰드 성형용 이형 시트 Download PDF

Info

Publication number
KR20140125740A
KR20140125740A KR20140046400A KR20140046400A KR20140125740A KR 20140125740 A KR20140125740 A KR 20140125740A KR 20140046400 A KR20140046400 A KR 20140046400A KR 20140046400 A KR20140046400 A KR 20140046400A KR 20140125740 A KR20140125740 A KR 20140125740A
Authority
KR
South Korea
Prior art keywords
resin
release sheet
acrylate
mold
mass
Prior art date
Application number
KR20140046400A
Other languages
English (en)
Korean (ko)
Inventor
다케시 사토우
다카마사 이치카와
유이치 모리야
다카시 모치즈키
도모아키 야마다
신이치 다카하시
Original Assignee
가부시키가이샤 도모에가와 세이시쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 도모에가와 세이시쇼 filed Critical 가부시키가이샤 도모에가와 세이시쇼
Publication of KR20140125740A publication Critical patent/KR20140125740A/ko

Links

Images

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR20140046400A 2013-04-19 2014-04-18 몰드 성형용 이형 시트 KR20140125740A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013088297A JP6204051B2 (ja) 2013-04-19 2013-04-19 モールド成形用離型シート
JPJP-P-2013-088297 2013-04-19

Publications (1)

Publication Number Publication Date
KR20140125740A true KR20140125740A (ko) 2014-10-29

Family

ID=51709435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140046400A KR20140125740A (ko) 2013-04-19 2014-04-18 몰드 성형용 이형 시트

Country Status (4)

Country Link
JP (1) JP6204051B2 (ja)
KR (1) KR20140125740A (ja)
CN (1) CN104112693A (ja)
TW (1) TW201501900A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190008883A (ko) * 2016-05-20 2019-01-25 히타치가세이가부시끼가이샤 이형 필름
KR102226153B1 (ko) * 2019-11-18 2021-03-10 실리콘밸리(주) 거칠기 조절이 가능한 반도체 몰드용 이형필름 및 그 제조방법
KR102297307B1 (ko) * 2020-08-18 2021-09-02 황진상 반도체 패키지 몰드용 엠보싱 이형필름의 제조방법 및 그에 따른 엠보싱 이형필름

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6481396B2 (ja) * 2015-02-09 2019-03-13 住友ベークライト株式会社 離型フィルム
JP6449084B2 (ja) * 2015-03-30 2019-01-09 株式会社巴川製紙所 半導体装置製造用工程シート
JP6512899B2 (ja) * 2015-03-31 2019-05-15 株式会社巴川製紙所 半導体装置製造用工程シート
JP6434437B2 (ja) * 2016-03-24 2018-12-05 藤森工業株式会社 剥離性に優れた離型フィルム
SG11201810215RA (en) * 2016-05-20 2018-12-28 Hitachi Chemical Co Ltd Mold release sheet for semiconductor compression molding and semiconductor package which is molded using same
JP6981054B2 (ja) * 2017-06-09 2021-12-15 住友ベークライト株式会社 モールド成形用離型フィルム及びモールド成形方法
JP6966888B2 (ja) * 2017-07-26 2021-11-17 リンテック株式会社 剥離フィルム
JP7112720B2 (ja) * 2018-06-29 2022-08-04 株式会社コバヤシ 半導体製造用離型フィルム
WO2020075669A1 (ja) * 2018-10-09 2020-04-16 株式会社ネオス 積層体およびその製造方法
JP7347803B2 (ja) * 2019-03-20 2023-09-20 株式会社コバヤシ 金型と離型フィルムとの組合せ、離型フィルム、金型、及び成形体の製造方法
JP6819721B2 (ja) * 2019-04-26 2021-01-27 昭和電工マテリアルズ株式会社 半導体コンプレッション成型用離型シート及びこれを用いて成型される半導体パッケージ
JP7264104B2 (ja) 2020-04-28 2023-04-25 株式会社村田製作所 積層型セラミック電子部品の製造方法および消失性インク
CN111761763B (zh) * 2020-05-25 2022-04-19 余姚市远东化工有限公司 一种可以重复脱模的轮胎脱模剂及其制备方法
KR20230049615A (ko) * 2020-06-18 2023-04-13 생-고뱅 퍼포먼스 플라스틱스 코포레이션 다기능 필름
KR102280585B1 (ko) * 2021-01-15 2021-07-23 씰테크 주식회사 반도체 패키지용 이형 필름 및 그 제조 방법
WO2024057771A1 (ja) * 2022-09-14 2024-03-21 株式会社レゾナック 離型フィルム及び半導体パッケージの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232475A (ja) * 1996-02-22 1997-09-05 Nitto Denko Corp 半導体装置及びその製造方法
JP2002158242A (ja) * 1999-11-30 2002-05-31 Hitachi Chem Co Ltd 半導体モールド用離型シート及び樹脂封止半導体装置の製造法
JP4278441B2 (ja) * 2002-06-28 2009-06-17 コバレントマテリアル株式会社 半導体ウエハ処理用部材
JP2004074713A (ja) * 2002-08-21 2004-03-11 Hitachi Chem Co Ltd 半導体モールド用離型シート
JP2004200467A (ja) * 2002-12-19 2004-07-15 Hitachi Chem Co Ltd 半導体モールド用離型シート
JP2010087230A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 素子搭載用基板、半導体モジュール、携帯機器ならびに素子搭載用基板の製造方法
JP2011224915A (ja) * 2010-04-22 2011-11-10 Oji Paper Co Ltd 転写シート
KR101194544B1 (ko) * 2011-01-20 2012-10-25 도레이첨단소재 주식회사 다이 익스포즈드 플립칩 패키지(ｄｅｆｃｐ)의 몰드 언더필 공정용 점착 마스킹 테이프
JP5761596B2 (ja) * 2011-03-30 2015-08-12 住友ベークライト株式会社 半導体ウエハ加工用粘着テープ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190008883A (ko) * 2016-05-20 2019-01-25 히타치가세이가부시끼가이샤 이형 필름
KR102226153B1 (ko) * 2019-11-18 2021-03-10 실리콘밸리(주) 거칠기 조절이 가능한 반도체 몰드용 이형필름 및 그 제조방법
KR102297307B1 (ko) * 2020-08-18 2021-09-02 황진상 반도체 패키지 몰드용 엠보싱 이형필름의 제조방법 및 그에 따른 엠보싱 이형필름

Also Published As

Publication number Publication date
TW201501900A (zh) 2015-01-16
JP2014212239A (ja) 2014-11-13
JP6204051B2 (ja) 2017-09-27
CN104112693A (zh) 2014-10-22

Similar Documents

Publication Publication Date Title
KR20140125740A (ko) 몰드 성형용 이형 시트
TWI782802B (zh) 半導體加工用板片及半導體裝置的製造方法
TWI405293B (zh) A holding method for semiconductor wafers, a protective structure for semiconductor wafers, and a method of manufacturing a semiconductor wafer using the same, and a method of manufacturing a semiconductor wafer
CN101859692B (zh) 半导体晶片保护用压敏粘合片及其粘贴方法
KR101129523B1 (ko) 반도체 가공용 점착(粘着)시트 및 반도체 칩의 제조 방법
JP3383227B2 (ja) 半導体ウエハの裏面研削方法
TWI592458B (zh) A dicing sheet having a protective film forming layer, and a method of manufacturing the wafer
TWI432547B (zh) Crystallization - Dependent Belt and Semiconductor Wafer Manufacturing Method
TWI586785B (zh) 電子零件切斷用加熱剝離型黏著片材及電子零件加工方法
KR101273871B1 (ko) 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법
CN1254743A (zh) 压敏粘合片及其使用方法
EP2634228A2 (en) Self-rolling adhesive film
CN101831253A (zh) 无基材压敏粘合片、其生产方法及使用其的研磨方法
CN109312199B (zh) 半导体加工用粘合片
KR20140038858A (ko) 몰드 언더필 공정의 마스킹 테이프용 점착제 조성물 및 그를 이용한 마스킹 테이프
CN107236473A (zh) 玻璃切割用粘着片材及其制造方法
KR20190099120A (ko) 마스킹재
KR20160075510A (ko) 수지막 형성용 시트
JP2006232930A (ja) 粘着シートとその製造方法、及び、製品の加工方法
JP2013222846A (ja) 基板のダイシング方法
JPWO2019172219A1 (ja) 粘着シート
WO2021065070A1 (ja) 粘着シート及び粘着シートの製造方法
JP7267990B2 (ja) エキスパンド方法、半導体装置の製造方法、及び粘着シート
KR101670523B1 (ko) 반도체 웨이퍼 가공용 점착테이프 및 그의 제조방법
WO2020158770A1 (ja) エキスパンド方法及び半導体装置の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment