KR20130044132A - 은피복 구리분 - Google Patents

은피복 구리분 Download PDF

Info

Publication number
KR20130044132A
KR20130044132A KR1020120024483A KR20120024483A KR20130044132A KR 20130044132 A KR20130044132 A KR 20130044132A KR 1020120024483 A KR1020120024483 A KR 1020120024483A KR 20120024483 A KR20120024483 A KR 20120024483A KR 20130044132 A KR20130044132 A KR 20130044132A
Authority
KR
South Korea
Prior art keywords
silver
copper powder
coated copper
coated
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020120024483A
Other languages
English (en)
Korean (ko)
Inventor
다쿠 후지모토
마사히로 미와
야스나리 와키모리
도미오 하야시
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20130044132A publication Critical patent/KR20130044132A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1020120024483A 2011-10-21 2012-03-09 은피복 구리분 Ceased KR20130044132A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011232196 2011-10-21
JPJP-P-2011-232196 2011-10-21

Publications (1)

Publication Number Publication Date
KR20130044132A true KR20130044132A (ko) 2013-05-02

Family

ID=48099409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120024483A Ceased KR20130044132A (ko) 2011-10-21 2012-03-09 은피복 구리분

Country Status (4)

Country Link
JP (2) JP5631910B2 (enrdf_load_stackoverflow)
KR (1) KR20130044132A (enrdf_load_stackoverflow)
CN (1) CN103056356B (enrdf_load_stackoverflow)
TW (1) TWI570196B (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
KR101940772B1 (ko) 2018-07-13 2019-01-21 서재원 식판 자동 투입장치
US10654101B2 (en) 2015-05-15 2020-05-19 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014021037A1 (ja) * 2012-08-02 2014-02-06 三井金属鉱業株式会社 導電性フィルム
WO2015060258A1 (ja) * 2013-10-24 2015-04-30 三井金属鉱業株式会社 銀被覆銅粉
JP5876971B2 (ja) * 2014-01-29 2016-03-02 三井金属鉱業株式会社 銅粉
KR101483905B1 (ko) * 2014-04-04 2015-01-16 한동철 수분경화형 실리콘을 이용한 ｅｍｉ 차폐용 디스펜싱 가스켓에 적용 가능한 은코팅구리분말의 제조 방법
JP2015214742A (ja) * 2014-05-13 2015-12-03 有限会社 ナプラ 多結晶金属粒子、及び、導電性ペースト
WO2015194347A1 (ja) * 2014-06-16 2015-12-23 三井金属鉱業株式会社 銅粉、その製造方法、及びそれを含む導電性組成物
JP6432174B2 (ja) * 2014-06-18 2018-12-05 セメダイン株式会社 導電性接着剤
WO2015198671A1 (ja) * 2014-06-25 2015-12-30 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
CN106457387A (zh) * 2014-07-07 2017-02-22 住友金属矿山株式会社 铜粉及使用该铜粉的导电性膏剂、导电性涂料、导电性片材、抗静电涂料
JP5858202B1 (ja) * 2014-08-26 2016-02-10 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
CN106573303A (zh) * 2014-08-26 2017-04-19 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
JP5790900B1 (ja) * 2014-09-12 2015-10-07 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP5920540B1 (ja) * 2015-03-26 2016-05-18 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
KR20170130530A (ko) * 2015-03-26 2017-11-28 스미토모 긴조쿠 고잔 가부시키가이샤 은 코팅 동분 및 그것을 이용한 도전성 페이스트, 도전성 도료, 도전성 시트
TWI553661B (zh) * 2015-03-27 2016-10-11 Sumitomo Metal Mining Co Silver powder and its use of conductive paste, conductive paint, conductive film
JP6056901B2 (ja) * 2015-04-30 2017-01-11 住友金属鉱山株式会社 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート
WO2017038465A1 (ja) 2015-08-31 2017-03-09 三井金属鉱業株式会社 銀被覆銅粉
CN108140450B (zh) * 2016-03-15 2021-08-03 积水化学工业株式会社 含金属的粒子、连接材料、连接结构体及连接结构体的制造方法
WO2018151131A1 (ja) 2017-02-17 2018-08-23 日立化成株式会社 接着剤フィルム
CN109598039B (zh) * 2018-11-21 2022-07-08 中国电建集团成都勘测设计研究院有限公司 对称三岔形梁式岔管及其设计方法
WO2023074580A1 (ja) * 2021-10-25 2023-05-04 トッパン・フォームズ株式会社 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体
CN117620193B (zh) * 2023-10-18 2024-11-05 广东聚砺新材料有限责任公司 一种银粉的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60226570A (ja) * 1984-04-25 1985-11-11 Fukuda Kinzoku Hakufun Kogyo Kk 導電塗料用銅粉およびその製造方法
JPS6381706A (ja) * 1986-09-26 1988-04-12 三井金属鉱業株式会社 銅系厚膜用組成物
JPS63286477A (ja) * 1987-05-19 1988-11-24 Mitsui Mining & Smelting Co Ltd 導電性塗料
JPH01119602A (ja) * 1987-11-02 1989-05-11 Mitsui Mining & Smelting Co Ltd 銀被覆銅粉の製造法
JP2706110B2 (ja) * 1988-11-18 1998-01-28 福田金属箔粉工業株式会社 銅微粉末の製造方法
US4944797A (en) * 1989-01-03 1990-07-31 Gte Products Corporation Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing
JPH10147801A (ja) * 1996-11-20 1998-06-02 Tokuyama Corp 樹枝状銅粉の表面処理法
US6036839A (en) * 1998-02-04 2000-03-14 Electrocopper Products Limited Low density high surface area copper powder and electrodeposition process for making same
JP4163278B2 (ja) * 1998-02-26 2008-10-08 福田金属箔粉工業株式会社 導電塗料用片状銅粉の製造方法
CN1206064C (zh) * 2002-10-10 2005-06-15 武汉大学 一种镀银铜粉的制备方法
JP4149364B2 (ja) * 2003-11-18 2008-09-10 三井金属鉱業株式会社 デンドライト状微粒銀粉及びその製造方法
JP5181434B2 (ja) * 2006-07-10 2013-04-10 住友金属鉱山株式会社 微小銅粉及びその製造方法
JP2008122030A (ja) * 2006-11-15 2008-05-29 Mitsui Mining & Smelting Co Ltd ヒートパイプ構成原料
CN101214547A (zh) * 2008-01-07 2008-07-09 李伟强 一种含有纳米级别表面结构的微米银-铜颗粒及其制备方法和用途
CN101514486B (zh) * 2009-02-27 2011-09-21 华东师范大学 一种Cu树枝状单晶纳米材料及其制备方法
CN102211186B (zh) * 2011-06-08 2013-10-16 北京工业大学 一种树枝状铜粉表面镀银的方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
US10654101B2 (en) 2015-05-15 2020-05-19 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing silver-coated copper powder
US10695830B2 (en) 2015-05-15 2020-06-30 Sumitomo Metal Mining Co., Ltd. Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder
KR101940772B1 (ko) 2018-07-13 2019-01-21 서재원 식판 자동 투입장치

Also Published As

Publication number Publication date
JP2014220244A (ja) 2014-11-20
TWI570196B (zh) 2017-02-11
JP2013100592A (ja) 2013-05-23
CN103056356B (zh) 2016-08-10
CN103056356A (zh) 2013-04-24
TW201317311A (zh) 2013-05-01
JP5631910B2 (ja) 2014-11-26

Similar Documents

Publication Publication Date Title
KR20130044132A (ko) 은피복 구리분
JP5631841B2 (ja) 銀被覆銅粉
KR20130009592A (ko) 덴드라이트상 구리분
JP5920541B1 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
WO2016038914A1 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP6165399B1 (ja) 銀被覆銅粉
JP5858201B1 (ja) 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
WO2016031286A1 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP5701695B2 (ja) 銀被覆銅粉及びその製造方法
WO2016185628A1 (ja) 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
WO2016151858A1 (ja) 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
JP6278969B2 (ja) 銀被覆銅粉
JP2014159646A (ja) 銀被覆銅粉
JP6274076B2 (ja) 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
JP6332125B2 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP5790900B1 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP5711435B2 (ja) 銅粉
JP6332124B2 (ja) 銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP2016008333A (ja) 銅粉及びそれを用いた銅ペースト
JP5858202B1 (ja) 銀コート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート
TWI553661B (zh) Silver powder and its use of conductive paste, conductive paint, conductive film
JP6056901B2 (ja) 樹枝状銀コート銅粉の製造方法、及びその樹枝状銀コート銅粉を用いた銅ペースト、導電性塗料、導電性シート

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20120309

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20160406

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20120309

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170411

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20171010

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170411

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20171010

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20170525

Comment text: Amendment to Specification, etc.

PX0601 Decision of rejection after re-examination

Comment text: Decision to Refuse Application

Patent event code: PX06014S01D

Patent event date: 20180209

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20180105

Comment text: Decision to Refuse Application

Patent event code: PX06011S01I

Patent event date: 20171010

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20170525

Comment text: Notification of reason for refusal

Patent event code: PX06013S01I

Patent event date: 20170411