KR20110051222A - 인광변환 ｌｅｄ - Google Patents

인광변환 ｌｅｄ Download PDF

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Publication number
KR20110051222A
KR20110051222A KR1020117004957A KR20117004957A KR20110051222A KR 20110051222 A KR20110051222 A KR 20110051222A KR 1020117004957 A KR1020117004957 A KR 1020117004957A KR 20117004957 A KR20117004957 A KR 20117004957A KR 20110051222 A KR20110051222 A KR 20110051222A
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South Korea
Prior art keywords
light
die
layer
conversion component
light conversion
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Ceased
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KR1020117004957A
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English (en)
Korean (ko)
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스콧 웨스트
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브리지럭스 인코포레이티드
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Publication of KR20110051222A publication Critical patent/KR20110051222A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Optical Filters (AREA)
KR1020117004957A 2008-09-02 2009-08-19 인광변환 ｌｅｄ Ceased KR20110051222A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/202,793 2008-09-02
US12/202,793 US7973327B2 (en) 2008-09-02 2008-09-02 Phosphor-converted LED

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR20157005739A Division KR20150038604A (ko) 2008-09-02 2009-08-19 인광변환 ｌｅｄ

Publications (1)

Publication Number Publication Date
KR20110051222A true KR20110051222A (ko) 2011-05-17

Family

ID=41723975

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020117004957A Ceased KR20110051222A (ko) 2008-09-02 2009-08-19 인광변환 ｌｅｄ
KR20157005739A Ceased KR20150038604A (ko) 2008-09-02 2009-08-19 인광변환 ｌｅｄ

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR20157005739A Ceased KR20150038604A (ko) 2008-09-02 2009-08-19 인광변환 ｌｅｄ

Country Status (7)

Country Link
US (2) US7973327B2 (https=)
EP (1) EP2332187B1 (https=)
JP (3) JP5753494B2 (https=)
KR (2) KR20110051222A (https=)
CN (1) CN102132428B (https=)
TW (1) TWI419376B (https=)
WO (1) WO2010027672A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140110368A (ko) * 2013-03-07 2014-09-17 포항공과대학교 산학협력단 Uv led칩을 이용하는 백색 발광소자

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100327733A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US20100328923A1 (en) * 2009-06-25 2010-12-30 Bridgelux, Inc. Multiple layer phosphor bearing film
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US8232117B2 (en) * 2010-04-30 2012-07-31 Koninklijke Philips Electronics N.V. LED wafer with laminated phosphor layer
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
JP2012009696A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 発光装置およびそれを用いたｌｅｄ照明器具
CN102959708B (zh) 2010-06-29 2016-05-04 柯立芝照明有限公司 具有易弯曲基板的电子装置
JP2012069577A (ja) * 2010-09-21 2012-04-05 Citizen Electronics Co Ltd 半導体発光装置及びその製造方法
US20120097985A1 (en) * 2010-10-21 2012-04-26 Wen-Huang Liu Light Emitting Diode (LED) Package And Method Of Fabrication
KR101909299B1 (ko) * 2010-10-27 2018-10-17 루미리즈 홀딩 비.브이. 발광 디바이스의 제조를 위한 적층 지지막 및 그 제조 방법
US8373183B2 (en) 2011-02-22 2013-02-12 Hong Kong Applied Science and Technology Research Institute Company Limited LED package for uniform color emission
JP5670249B2 (ja) * 2011-04-14 2015-02-18 日東電工株式会社 発光素子転写シートの製造方法、発光装置の製造方法、発光素子転写シートおよび発光装置
JP5745319B2 (ja) * 2011-04-14 2015-07-08 日東電工株式会社 蛍光反射シート、および、発光ダイオード装置の製造方法
JP5680472B2 (ja) * 2011-04-22 2015-03-04 シチズンホールディングス株式会社 半導体発光装置の製造方法
JP2012243822A (ja) * 2011-05-16 2012-12-10 Citizen Electronics Co Ltd Ｌｅｄ発光装置とその製造方法
CN103153611B (zh) * 2011-06-07 2015-01-07 东丽株式会社 树脂片材层合体、其制造方法及使用其的带有含荧光体树脂片材的led芯片的制造方法
JP5730680B2 (ja) * 2011-06-17 2015-06-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
US9035344B2 (en) 2011-09-14 2015-05-19 VerLASE TECHNOLOGIES LLC Phosphors for use with LEDs and other optoelectronic devices
JP2013077679A (ja) * 2011-09-30 2013-04-25 Citizen Electronics Co Ltd 半導体発光装置とその製造方法
US8779694B1 (en) 2011-12-08 2014-07-15 Automated Assembly Corporation LEDs on flexible substrate arrangement
EP2748277B1 (en) 2011-12-16 2018-08-22 Lumileds Holding B.V. PHOSPHOR IN WATER GLASS FOR LEDs
CN103187484A (zh) * 2011-12-27 2013-07-03 展晶科技(深圳)有限公司 发光二极管封装方法
JP5860289B2 (ja) * 2012-01-05 2016-02-16 シチズン電子株式会社 Ｌｅｄ装置の製造方法
WO2013144834A1 (en) * 2012-03-30 2013-10-03 Koninklijke Philips N.V. Light emitting device with wavelength converting side coat
EP2837041B1 (en) * 2012-04-13 2019-07-03 Lumileds Holding B.V. A light conversion assembly, a lamp and a luminaire
JP2013232477A (ja) * 2012-04-27 2013-11-14 Toshiba Corp 発光モジュール
US8629466B2 (en) * 2012-05-22 2014-01-14 Hong Kong Applied Science and Technology Research Institute Company Limited Lighting device
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
WO2014002784A1 (ja) * 2012-06-28 2014-01-03 東レ株式会社 樹脂シート積層体およびそれを用いた半導体発光素子の製造方法
JP6348491B2 (ja) * 2012-07-20 2018-06-27 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． セラミック緑色蛍光体と保護された赤色蛍光体層とを有するｌｅｄ
JP5995579B2 (ja) * 2012-07-24 2016-09-21 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
JP6055259B2 (ja) * 2012-10-03 2016-12-27 日東電工株式会社 封止シート被覆半導体素子、その製造方法、半導体装置およびその製造方法
JP6215525B2 (ja) * 2012-10-23 2017-10-18 スタンレー電気株式会社 半導体発光装置
US9054235B2 (en) 2013-01-22 2015-06-09 Micron Technology, Inc. Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices
DE102013103600A1 (de) * 2013-04-10 2014-10-30 Osram Opto Semiconductors Gmbh Modul mit wenigstens zwei Halbleiterchips
CN103258940B (zh) * 2013-05-15 2017-10-24 中国科学院福建物质结构研究所 一种全固态白光发光二极管的封装方法
CN105378948B (zh) * 2013-07-18 2020-08-28 亮锐控股有限公司 切分发光器件的晶片
CN104733594B (zh) * 2013-12-24 2017-09-19 展晶科技(深圳)有限公司 Led封装体
JP6331389B2 (ja) * 2013-12-27 2018-05-30 日亜化学工業株式会社 発光装置
DE102014100772B4 (de) * 2014-01-23 2022-11-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen und optoelektronisches Halbleiterbauelement
US10439111B2 (en) 2014-05-14 2019-10-08 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
US9997676B2 (en) 2014-05-14 2018-06-12 Genesis Photonics Inc. Light emitting device and manufacturing method thereof
KR102145208B1 (ko) 2014-06-10 2020-08-19 삼성전자주식회사 발광소자 패키지 제조방법
TWI557952B (zh) 2014-06-12 2016-11-11 新世紀光電股份有限公司 發光元件
DE102014112883A1 (de) * 2014-09-08 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
DE102014117892A1 (de) * 2014-12-04 2016-06-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement sowie optoelektronisches Bauteil
CN105720164B (zh) * 2014-12-05 2019-10-11 江西省晶能半导体有限公司 一种白光led的制备方法
US10269776B2 (en) 2014-12-16 2019-04-23 PlayNitride Inc. Light emitting device
US9666564B2 (en) * 2014-12-16 2017-05-30 PlayNitride Inc. Light emitting device
EP3262695B1 (en) * 2015-02-23 2020-04-22 Lumileds Holding B.V. Light source assembly with improved color uniformity
JP2015099940A (ja) * 2015-02-23 2015-05-28 日亜化学工業株式会社 発光装置
JP5996022B2 (ja) * 2015-03-13 2016-09-21 シチズン電子株式会社 発光装置
CN105990498A (zh) * 2015-03-18 2016-10-05 新世纪光电股份有限公司 芯片封装结构及其制造方法
KR102385941B1 (ko) 2015-06-15 2022-04-13 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
JP2015164234A (ja) * 2015-06-17 2015-09-10 シチズン電子株式会社 Ｌｅｄ発光装置とその製造方法
CN108386732B (zh) * 2015-07-06 2019-09-10 扬州艾笛森光电有限公司 发光模块以及具有此发光模块的头灯
JP6327220B2 (ja) * 2015-08-31 2018-05-23 日亜化学工業株式会社 発光装置
CN106549092A (zh) 2015-09-18 2017-03-29 新世纪光电股份有限公司 发光装置及其制造方法
CN105655261A (zh) * 2016-03-11 2016-06-08 导装光电科技（深圳）有限公司 倒装白光芯片的制备工艺
CN106058020A (zh) * 2016-07-08 2016-10-26 深圳市兆驰节能照明股份有限公司 碗状结构芯片级封装发光装置及其制造方法
TWI651870B (zh) 2016-10-19 2019-02-21 Genesis Photonics Inc. 發光裝置及其製造方法
CN106449951B (zh) * 2016-11-16 2019-01-04 厦门市三安光电科技有限公司 一种发光二极管封装结构的制作方法
US10317614B1 (en) 2017-03-14 2019-06-11 Automatad Assembly Corporation SSL lighting apparatus
CN106932951B (zh) * 2017-04-14 2018-11-23 深圳市华星光电技术有限公司 Led灯源及其制造方法、背光模组
US10854780B2 (en) 2017-11-05 2020-12-01 Genesis Photonics Inc. Light emitting apparatus and manufacturing method thereof
TW201919261A (zh) 2017-11-05 2019-05-16 新世紀光電股份有限公司 發光裝置
KR20190052600A (ko) * 2017-11-08 2019-05-16 주식회사 대성엔지니어링 Led 제조시스템 및 led 제조방법
US20200105990A1 (en) * 2018-09-27 2020-04-02 Wuhan China Star Optoelectronics Technology Co., Ltd. Surface light source, method for manufacturing the same, and display device using the surface light source
CN111106228A (zh) * 2018-10-26 2020-05-05 江西省晶能半导体有限公司 Led灯珠制备方法
EP3656254A1 (en) * 2018-11-26 2020-05-27 L&P Swiss Holding GmbH Pocket spring core
JP7323763B2 (ja) * 2018-12-27 2023-08-09 日亜化学工業株式会社 発光装置及び発光装置の製造方法
US10720551B1 (en) * 2019-01-03 2020-07-21 Ford Global Technologies, Llc Vehicle lamps
US10655823B1 (en) 2019-02-04 2020-05-19 Automated Assembly Corporation SSL lighting apparatus
JP7299537B2 (ja) * 2020-03-18 2023-06-28 日亜化学工業株式会社 発光装置
JP7119283B2 (ja) 2020-03-30 2022-08-17 日亜化学工業株式会社 発光装置の製造方法
JP7091598B2 (ja) 2020-05-20 2022-06-28 日亜化学工業株式会社 発光装置の製造方法
JP7580206B2 (ja) * 2020-05-25 2024-11-11 スタンレー電気株式会社 半導体発光装置
US10995931B1 (en) 2020-08-06 2021-05-04 Automated Assembly Corporation SSL lighting apparatus
JP7071680B2 (ja) * 2021-01-12 2022-05-19 日亜化学工業株式会社 発光装置
JP7455396B2 (ja) * 2021-07-20 2024-03-26 フェニックス電機株式会社 広帯域発光装置
JP2024145784A (ja) * 2023-03-31 2024-10-15 日亜化学工業株式会社 面状光源、液晶表示装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06312600A (ja) * 1992-11-20 1994-11-08 Saki World:Kk 発光装飾器具
JP2000031548A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面実装型発光ダイオードおよびその製造方法
JP2000150969A (ja) * 1998-11-16 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP3627592B2 (ja) * 1999-10-08 2005-03-09 日亜化学工業株式会社 発光装置の製造方法
JP3802724B2 (ja) * 2000-01-31 2006-07-26 ローム株式会社 発光表示装置およびその製法
JP2001308392A (ja) * 2000-04-26 2001-11-02 Sony Corp 発光ダイオード及び画像表示装置
JP3685018B2 (ja) * 2000-05-09 2005-08-17 日亜化学工業株式会社 発光素子とその製造方法
JP2002280601A (ja) * 2000-06-08 2002-09-27 Showa Denko Kk 半導体発光素子
JP3991612B2 (ja) * 2001-04-09 2007-10-17 日亜化学工業株式会社 発光素子
JP2002313826A (ja) * 2001-04-17 2002-10-25 Shinko Electric Ind Co Ltd 半導体装置の樹脂封止装置及び半導体装置の樹脂封止方法
JP4020092B2 (ja) * 2004-03-16 2007-12-12 住友電気工業株式会社 半導体発光装置
JP4516337B2 (ja) * 2004-03-25 2010-08-04 シチズン電子株式会社 半導体発光装置
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
JP4698986B2 (ja) * 2004-08-23 2011-06-08 岡谷電機産業株式会社 発光ダイオード及びその製造方法
JP3936365B2 (ja) * 2004-09-14 2007-06-27 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
JP2006314082A (ja) * 2005-04-04 2006-11-16 Nippon Sheet Glass Co Ltd 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
KR20070033801A (ko) * 2005-09-22 2007-03-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
GB2432967A (en) * 2005-11-30 2007-06-06 Unity Opto Technology Co Ltd White light LED with fluorescent powder containing wavelength converting plate
TW200725940A (en) * 2005-12-29 2007-07-01 Anteya Technology Corp LED package structure
WO2007080803A1 (ja) * 2006-01-16 2007-07-19 Matsushita Electric Industrial Co., Ltd. 半導体発光装置
WO2007085977A1 (en) * 2006-01-24 2007-08-02 Philips Intellectual Property & Standards Gmbh Light-emitting device
US8062925B2 (en) * 2006-05-16 2011-11-22 Koninklijke Philips Electronics N.V. Process for preparing a semiconductor light-emitting device for mounting
US8169136B2 (en) * 2008-02-21 2012-05-01 Nitto Denko Corporation Light emitting device with translucent ceramic plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140110368A (ko) * 2013-03-07 2014-09-17 포항공과대학교 산학협력단 Uv led칩을 이용하는 백색 발광소자

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CN102132428B (zh) 2015-07-08
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WO2010027672A2 (en) 2010-03-11
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US20100051984A1 (en) 2010-03-04

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