KR20110031100A - 전자파 실드성 필름 및 배선판 - Google Patents

전자파 실드성 필름 및 배선판 Download PDF

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Publication number
KR20110031100A
KR20110031100A KR1020100088675A KR20100088675A KR20110031100A KR 20110031100 A KR20110031100 A KR 20110031100A KR 1020100088675 A KR1020100088675 A KR 1020100088675A KR 20100088675 A KR20100088675 A KR 20100088675A KR 20110031100 A KR20110031100 A KR 20110031100A
Authority
KR
South Korea
Prior art keywords
shielding film
electromagnetic shielding
conductive layer
micrometers
silver powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020100088675A
Other languages
English (en)
Korean (ko)
Inventor
유지 니시야마
히데노부 고바야시
타카히로 마츠자와
Original Assignee
도요 잉키 세이조 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요 잉키 세이조 가부시끼가이샤 filed Critical 도요 잉키 세이조 가부시끼가이샤
Publication of KR20110031100A publication Critical patent/KR20110031100A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
KR1020100088675A 2009-09-18 2010-09-10 전자파 실드성 필름 및 배선판 Withdrawn KR20110031100A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-216317 2009-09-18
JP2009216317 2009-09-18

Publications (1)

Publication Number Publication Date
KR20110031100A true KR20110031100A (ko) 2011-03-24

Family

ID=43867163

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100088675A Withdrawn KR20110031100A (ko) 2009-09-18 2010-09-10 전자파 실드성 필름 및 배선판

Country Status (4)

Country Link
JP (2) JP2011086930A (OSRAM)
KR (1) KR20110031100A (OSRAM)
CN (1) CN102026530B (OSRAM)
TW (1) TW201121405A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107787111A (zh) * 2016-08-25 2018-03-09 上海逻骅投资管理合伙企业（有限合伙） 印刷电路板基材及其制造方法

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JP5726048B2 (ja) * 2011-11-14 2015-05-27 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
KR102017121B1 (ko) 2012-03-06 2019-09-02 토요잉크Sc홀딩스주식회사 도전성 미립자 및 그 제조 방법, 도전성 수지 조성물, 도전성 시트 및 전자파 차폐 시트
CN105744818A (zh) * 2016-02-03 2016-07-06 中电海康集团有限公司 一种柔性磁屏蔽和抗辐照薄膜
JP6564920B2 (ja) 2017-09-27 2019-08-21 Ｄｏｗａエレクトロニクス株式会社 銀粉混合物およびその製造方法並びに導電性ペースト
JP2021061365A (ja) * 2019-10-09 2021-04-15 信越ポリマー株式会社 電磁波シールドフィルム、回路基板、及び回路基板の製造方法
EP4181645A4 (en) 2020-07-08 2024-07-24 Daicel Corporation Resin molded body, and method for manufacturing same
EP4460161A4 (en) 2021-12-27 2025-11-26 Daicel Corp SURFACE STRUCTURES

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JPH06306201A (ja) * 1993-04-23 1994-11-01 Toyo Ink Mfg Co Ltd 電磁波遮蔽性樹脂組成物
JP2000216591A (ja) * 1999-01-25 2000-08-04 Matsushita Electric Ind Co Ltd シ―ルド材
JP3510834B2 (ja) * 2000-01-28 2004-03-29 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板
JP2002158487A (ja) * 2000-11-20 2002-05-31 Nok Corp グロメット
JP3874634B2 (ja) * 2001-08-10 2007-01-31 福田金属箔粉工業株式会社 導体ペースト用のフレーク状銀粉及びそれを用いた導体ペースト
JP2004022568A (ja) * 2002-06-12 2004-01-22 Nishizaki:Kk マイナスイオン効果を有する電磁波シールド部材
JP3894312B2 (ja) * 2002-10-31 2007-03-22 信越化学工業株式会社 導電性シリコーンゴム組成物及び導電性ゴム部材
JP2004231792A (ja) * 2003-01-30 2004-08-19 Nippon Perunotsukusu Kk 難燃性導電接着性組成物、フィルムおよびフラットケーブル
JP4363340B2 (ja) * 2004-03-12 2009-11-11 住友電気工業株式会社 導電性銀ペースト及びそれを用いた電磁波シールド部材
JP2005277262A (ja) * 2004-03-26 2005-10-06 Toray Ind Inc 電磁波シールドフィルム
JP4673573B2 (ja) * 2004-04-21 2011-04-20 小松精練株式会社 電磁波シールド材の製造方法
JP4324029B2 (ja) * 2004-06-25 2009-09-02 住友電工プリントサーキット株式会社 金属膜及び接着剤層を有する積層フィルム及びその製造方法
KR100624316B1 (ko) * 2004-12-30 2006-09-13 제일모직주식회사 도전성 페인트 조성물 및 이를 적용한 전자파 차폐용도전막
CN100584180C (zh) * 2005-02-18 2010-01-20 东洋油墨制造株式会社 电磁波屏蔽性粘合薄膜、其制备方法以及被粘合物的电磁波屏蔽方法
CN100363450C (zh) * 2005-11-04 2008-01-23 上海市合成树脂研究所 一种水基导电涂料
JP4635888B2 (ja) * 2006-02-01 2011-02-23 藤倉化成株式会社 導電性ペーストおよび導電性回路の製造方法
CN101108947A (zh) * 2006-07-21 2008-01-23 靳一名 一种镀银铜粉导电涂料及其制备方法
JP2008028258A (ja) * 2006-07-24 2008-02-07 Nisshinbo Ind Inc 積層シートおよびその製造方法
JP2008177463A (ja) * 2007-01-22 2008-07-31 Kyocera Chemical Corp フレキシブル配線板用接着剤組成物、フレキシブル配線板用カバーレイ、および電磁波シールド層付フレキシブル配線板
JP2008171828A (ja) * 2008-03-26 2008-07-24 Toyobo Co Ltd 導電性ペースト及びこれを用いた印刷回路
CN101279369B (zh) * 2008-05-15 2010-08-25 金川集团有限公司 高分散性片状银粉的制备方法
JP5847516B2 (ja) * 2010-10-01 2016-01-20 Ｄｏｗａエレクトロニクス株式会社 フレーク状銀粉及び導電性ペースト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107787111A (zh) * 2016-08-25 2018-03-09 上海逻骅投资管理合伙企业（有限合伙） 印刷电路板基材及其制造方法

Also Published As

Publication number Publication date
CN102026530B (zh) 2015-09-30
JP2015073105A (ja) 2015-04-16
TW201121405A (en) 2011-06-16
JP2011086930A (ja) 2011-04-28
CN102026530A (zh) 2011-04-20

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20100910

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid