KR20100093527A - Led 패키지 기판 및 그것을 사용한 led 패키지 - Google Patents
Led 패키지 기판 및 그것을 사용한 led 패키지 Download PDFInfo
- Publication number
- KR20100093527A KR20100093527A KR1020107010899A KR20107010899A KR20100093527A KR 20100093527 A KR20100093527 A KR 20100093527A KR 1020107010899 A KR1020107010899 A KR 1020107010899A KR 20107010899 A KR20107010899 A KR 20107010899A KR 20100093527 A KR20100093527 A KR 20100093527A
- Authority
- KR
- South Korea
- Prior art keywords
- electrode
- led package
- led
- package substrate
- ceramic
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 70
- 239000000919 ceramic Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 24
- 238000011049 filling Methods 0.000 description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000006750 UV protection Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007272206 | 2007-10-19 | ||
JPJP-P-2007-272206 | 2007-10-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100093527A true KR20100093527A (ko) | 2010-08-25 |
Family
ID=40567440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107010899A KR20100093527A (ko) | 2007-10-19 | 2008-10-16 | Led 패키지 기판 및 그것을 사용한 led 패키지 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2009051178A1 (ja) |
KR (1) | KR20100093527A (ja) |
CN (1) | CN101828275A (ja) |
TW (1) | TW200937681A (ja) |
WO (1) | WO2009051178A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101340250B1 (ko) * | 2012-09-20 | 2013-12-10 | 주식회사 효성 | 유전체층의 열 방출 특성이 개선된 led 패키지 및 led 어레이 |
KR101356475B1 (ko) * | 2013-03-27 | 2014-01-29 | 한국생산기술연구원 | 고성능 엘이디 기판 및 이의 제조방법 |
EP3221902A4 (en) * | 2014-11-21 | 2018-04-11 | Cree, Inc. | Light emitting diode (led) components including led dies that are directly attached to lead frames |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101610378B1 (ko) * | 2009-09-30 | 2016-04-08 | 엘지이노텍 주식회사 | 발광장치 |
JP5742844B2 (ja) | 2010-07-07 | 2015-07-01 | 旭硝子株式会社 | 発光素子用反射枠体、発光素子用基板、および発光装置 |
KR101775671B1 (ko) * | 2010-09-29 | 2017-09-20 | 삼성디스플레이 주식회사 | 발광다이오드 패키지를 갖는 백라이트 어셈블리 및 이를 갖는 표시장치 |
JP2012084786A (ja) * | 2010-10-14 | 2012-04-26 | Showa Denko Kk | Ledパッケージ |
JP2012094679A (ja) * | 2010-10-27 | 2012-05-17 | Showa Denko Kk | 基板の製造方法 |
WO2012066461A1 (en) * | 2010-11-19 | 2012-05-24 | Koninklijke Philips Electronics N.V. | Islanded carrier for light emitting device |
CN102130278B (zh) * | 2010-12-31 | 2013-04-03 | 昆山琉明光电有限公司 | 发光二极管封装 |
CN102692592B (zh) * | 2011-03-22 | 2014-08-27 | 展晶科技(深圳)有限公司 | 发光二极管测试方法及在该方法中使用的发光二极管型材 |
US8796665B2 (en) | 2011-08-26 | 2014-08-05 | Micron Technology, Inc. | Solid state radiation transducers and methods of manufacturing |
CN102306695A (zh) * | 2011-09-09 | 2012-01-04 | 福建省万邦光电科技有限公司 | Led光源单杯模块用镀陶瓷层底座 |
JP2013197310A (ja) * | 2012-03-19 | 2013-09-30 | Toshiba Corp | 発光装置 |
JP5379320B1 (ja) * | 2012-10-15 | 2013-12-25 | 有限会社 ナプラ | 発光装置 |
CN103022332B (zh) * | 2012-11-29 | 2015-10-21 | 芜湖德豪润达光电科技有限公司 | 倒装基板及其制造方法及基于该倒装基板的led封装结构 |
CN203521475U (zh) | 2013-09-06 | 2014-04-02 | 郑榕彬 | 用于led倒装晶片封装的浮动散热铜片支架及led封装件 |
TWI566441B (zh) * | 2014-04-08 | 2017-01-11 | 新世紀光電股份有限公司 | 發光二極體裝置及用於封裝發光二極體之支架陣列 |
CN106164334B (zh) * | 2014-04-15 | 2019-11-29 | 住友金属矿山株式会社 | 包覆膜的形成方法以及发光二极管器件的制造方法 |
JP6539956B2 (ja) * | 2014-08-08 | 2019-07-10 | 株式会社カネカ | リードフレーム、樹脂成型体、表面実装型電子部品、表面実装型発光装置、及びリードフレーム製造方法 |
CN105938866A (zh) * | 2016-06-13 | 2016-09-14 | 开发晶照明(厦门)有限公司 | Led支架和led封装结构 |
JP6925694B2 (ja) * | 2017-04-12 | 2021-08-25 | シチズン電子株式会社 | 発光装置 |
FR3073320B1 (fr) * | 2017-11-08 | 2019-11-22 | Photonis France | Procede de realisation d'une liaison electrique etanche dans un boitier ceramique et tube intensificateur d'image comportant un tel boitier |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3312723B2 (ja) * | 1996-10-09 | 2002-08-12 | 松下電器産業株式会社 | 熱伝導シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法 |
JP3410935B2 (ja) * | 1997-08-05 | 2003-05-26 | オーツタイヤ株式会社 | 金属製クローラ用弾性パッド及び金属製クローラ |
JP4075268B2 (ja) * | 2000-02-24 | 2008-04-16 | 松下電工株式会社 | 回路基板の製造方法 |
JP4085917B2 (ja) * | 2003-07-16 | 2008-05-14 | 松下電工株式会社 | 高熱伝導性発光素子用回路部品及び高放熱モジュール |
JP4674487B2 (ja) * | 2005-04-25 | 2011-04-20 | パナソニック電工株式会社 | 表面実装型発光装置 |
JP2007073575A (ja) * | 2005-09-05 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
JP2007250979A (ja) * | 2006-03-17 | 2007-09-27 | Zeniya Sangyo Kk | 半導体パッケージ |
-
2008
- 2008-10-16 JP JP2009538130A patent/JPWO2009051178A1/ja not_active Withdrawn
- 2008-10-16 KR KR1020107010899A patent/KR20100093527A/ko not_active Application Discontinuation
- 2008-10-16 WO PCT/JP2008/068749 patent/WO2009051178A1/ja active Application Filing
- 2008-10-16 CN CN200880112148.7A patent/CN101828275A/zh active Pending
- 2008-10-17 TW TW97139947A patent/TW200937681A/zh unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101340250B1 (ko) * | 2012-09-20 | 2013-12-10 | 주식회사 효성 | 유전체층의 열 방출 특성이 개선된 led 패키지 및 led 어레이 |
KR101356475B1 (ko) * | 2013-03-27 | 2014-01-29 | 한국생산기술연구원 | 고성능 엘이디 기판 및 이의 제조방법 |
EP3221902A4 (en) * | 2014-11-21 | 2018-04-11 | Cree, Inc. | Light emitting diode (led) components including led dies that are directly attached to lead frames |
US10950769B2 (en) | 2014-11-21 | 2021-03-16 | Cree, Inc. | Light emitting diode (LED) components including multiple LED dies that are attached to lead frames |
Also Published As
Publication number | Publication date |
---|---|
CN101828275A (zh) | 2010-09-08 |
JPWO2009051178A1 (ja) | 2011-03-03 |
TW200937681A (en) | 2009-09-01 |
WO2009051178A1 (ja) | 2009-04-23 |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |