CN101828275A - Led封装基板以及使用该led封装基板的led封装 - Google Patents

Led封装基板以及使用该led封装基板的led封装 Download PDF

Info

Publication number
CN101828275A
CN101828275A CN200880112148.7A CN200880112148A CN101828275A CN 101828275 A CN101828275 A CN 101828275A CN 200880112148 A CN200880112148 A CN 200880112148A CN 101828275 A CN101828275 A CN 101828275A
Authority
CN
China
Prior art keywords
electrode
led
packaging
base plate
writing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880112148.7A
Other languages
English (en)
Chinese (zh)
Inventor
祝迫恭
皆本钢辉
仓井聪
田口常正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tungsten Co Ltd
Original Assignee
Nippon Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Tungsten Co Ltd filed Critical Nippon Tungsten Co Ltd
Publication of CN101828275A publication Critical patent/CN101828275A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CN200880112148.7A 2007-10-19 2008-10-16 Led封装基板以及使用该led封装基板的led封装 Pending CN101828275A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007272206 2007-10-19
JP2007-272206 2007-10-19
PCT/JP2008/068749 WO2009051178A1 (ja) 2007-10-19 2008-10-16 Ｌｅｄパッケージ基板およびそれを用いたｌｅｄパッケージ

Publications (1)

Publication Number Publication Date
CN101828275A true CN101828275A (zh) 2010-09-08

Family

ID=40567440

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880112148.7A Pending CN101828275A (zh) 2007-10-19 2008-10-16 Led封装基板以及使用该led封装基板的led封装

Country Status (5)

Country Link
JP (1) JPWO2009051178A1 (ja)
KR (1) KR20100093527A (ja)
CN (1) CN101828275A (ja)
TW (1) TW200937681A (ja)
WO (1) WO2009051178A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130278A (zh) * 2010-12-31 2011-07-20 昆山琉明光电有限公司 发光二极管封装
CN102306695A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Led光源单杯模块用镀陶瓷层底座
CN102563452A (zh) * 2010-09-29 2012-07-11 三星电子株式会社 具有发光二极管封装件的背光组件及具有其的显示装置
CN103022332A (zh) * 2012-11-29 2013-04-03 芜湖德豪润达光电科技有限公司 倒装基板及其制造方法及基于该倒装基板的led封装结构
WO2015032256A1 (en) * 2013-09-06 2015-03-12 Yung Pun Cheng Floating heat sink support with copper sheets and led package assembly for led flip chip package

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101610378B1 (ko) * 2009-09-30 2016-04-08 엘지이노텍 주식회사 발광장치
JP5742844B2 (ja) 2010-07-07 2015-07-01 旭硝子株式会社 発光素子用反射枠体、発光素子用基板、および発光装置
JP2012084786A (ja) * 2010-10-14 2012-04-26 Showa Denko Kk Ｌｅｄパッケージ
JP2012094679A (ja) * 2010-10-27 2012-05-17 Showa Denko Kk 基板の製造方法
WO2012066461A1 (en) * 2010-11-19 2012-05-24 Koninklijke Philips Electronics N.V. Islanded carrier for light emitting device
CN102692592B (zh) * 2011-03-22 2014-08-27 展晶科技(深圳)有限公司 发光二极管测试方法及在该方法中使用的发光二极管型材
US8796665B2 (en) 2011-08-26 2014-08-05 Micron Technology, Inc. Solid state radiation transducers and methods of manufacturing
JP2013197310A (ja) * 2012-03-19 2013-09-30 Toshiba Corp 発光装置
KR101340250B1 (ko) * 2012-09-20 2013-12-10 주식회사 효성 유전체층의 열 방출 특성이 개선된 ｌｅｄ 패키지 및 ｌｅｄ 어레이
JP5379320B1 (ja) * 2012-10-15 2013-12-25 有限会社 ナプラ 発光装置
KR101356475B1 (ko) * 2013-03-27 2014-01-29 한국생산기술연구원 고성능 엘이디 기판 및 이의 제조방법
TWI566441B (zh) * 2014-04-08 2017-01-11 新世紀光電股份有限公司 發光二極體裝置及用於封裝發光二極體之支架陣列
CN106164334B (zh) * 2014-04-15 2019-11-29 住友金属矿山株式会社 包覆膜的形成方法以及发光二极管器件的制造方法
JP6539956B2 (ja) * 2014-08-08 2019-07-10 株式会社カネカ リードフレーム、樹脂成型体、表面実装型電子部品、表面実装型発光装置、及びリードフレーム製造方法
US9601673B2 (en) 2014-11-21 2017-03-21 Cree, Inc. Light emitting diode (LED) components including LED dies that are directly attached to lead frames
CN105938866A (zh) * 2016-06-13 2016-09-14 开发晶照明（厦门）有限公司 Led支架和led封装结构
JP6925694B2 (ja) * 2017-04-12 2021-08-25 シチズン電子株式会社 発光装置
FR3073320B1 (fr) * 2017-11-08 2019-11-22 Photonis France Procede de realisation d'une liaison electrique etanche dans un boitier ceramique et tube intensificateur d'image comportant un tel boitier

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3312723B2 (ja) * 1996-10-09 2002-08-12 松下電器産業株式会社 熱伝導シート状物とその製造方法及びそれを用いた熱伝導基板とその製造方法
JP3410935B2 (ja) * 1997-08-05 2003-05-26 オーツタイヤ株式会社 金属製クローラ用弾性パッド及び金属製クローラ
JP4075268B2 (ja) * 2000-02-24 2008-04-16 松下電工株式会社 回路基板の製造方法
JP4085917B2 (ja) * 2003-07-16 2008-05-14 松下電工株式会社 高熱伝導性発光素子用回路部品及び高放熱モジュール
JP4674487B2 (ja) * 2005-04-25 2011-04-20 パナソニック電工株式会社 表面実装型発光装置
JP2007073575A (ja) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd 半導体発光装置
JP2007250979A (ja) * 2006-03-17 2007-09-27 Zeniya Sangyo Kk 半導体パッケージ

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102563452A (zh) * 2010-09-29 2012-07-11 三星电子株式会社 具有发光二极管封装件的背光组件及具有其的显示装置
US8870402B2 (en) 2010-09-29 2014-10-28 Samsung Display Co., Ltd. Backlight assembly having light emitting diode package and display apparatus having the same
CN102563452B (zh) * 2010-09-29 2015-12-09 三星显示有限公司 具有发光二极管封装件的背光组件及具有其的显示装置
CN102130278A (zh) * 2010-12-31 2011-07-20 昆山琉明光电有限公司 发光二极管封装
CN102130278B (zh) * 2010-12-31 2013-04-03 昆山琉明光电有限公司 发光二极管封装
CN102306695A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 Led光源单杯模块用镀陶瓷层底座
CN103022332A (zh) * 2012-11-29 2013-04-03 芜湖德豪润达光电科技有限公司 倒装基板及其制造方法及基于该倒装基板的led封装结构
CN103022332B (zh) * 2012-11-29 2015-10-21 芜湖德豪润达光电科技有限公司 倒装基板及其制造方法及基于该倒装基板的led封装结构
WO2015032256A1 (en) * 2013-09-06 2015-03-12 Yung Pun Cheng Floating heat sink support with copper sheets and led package assembly for led flip chip package
US9379300B2 (en) 2013-09-06 2016-06-28 Yung Pun Cheng Floating heat sink support with copper sheets and LED package assembly for LED flip chip package

Also Published As

Publication number Publication date
KR20100093527A (ko) 2010-08-25
JPWO2009051178A1 (ja) 2011-03-03
TW200937681A (en) 2009-09-01
WO2009051178A1 (ja) 2009-04-23

Similar Documents

Publication Publication Date Title
CN101828275A (zh) Led封装基板以及使用该led封装基板的led封装
CN100391019C (zh) 半导体发光器件及其制造方法
KR101209759B1 (ko) 반도체 발광모듈 및 그 제조방법
TWI304659B (en) Substrate for mounting light emitting element and manufacturing method thereof, light emitting element module and manufacturing method thereof, display apparatus, illumination apparatus, and traffic signal device
JP5262054B2 (ja) 発光装置の製造方法
CN102192423A (zh) 发光装置
EP1890340B1 (en) Method for producing a porcelain enameled substrate for light-emitting device mounting.
CN102201524A (zh) 发光元件用基板及发光装置
CN102208516A (zh) 发光元件用基板及发光装置
KR20100072163A (ko) 반도체 발광 장치, 및, 이를 이용한 광원 장치 및 조명 시스템
CN101290964A (zh) 发光装置、光源装置及发光装置的制造方法
KR20080006641A (ko) 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기
CN101189738A (zh) 发光元件安装用基板、发光元件模块、照明装置、显示装置以及交通信号机
CN102770977A (zh) 发光元件搭载用基板及发光装置
CN101449392A (zh) 发光元件安装用基板、发光元件封装体、显示装置及照明装置
CN101520569A (zh) Lcd背光模组用功率型片式led光源
CN105280801A (zh) 发光模块
JP2006310584A (ja) 発光素子実装用ホーロー基板及び光源装置
CN102437267B (zh) 金属基底板发光芯片封装结构
JP2006287126A (ja) Ｌｅｄランプ、およびそのユニット板の製造方法
CN101963296A (zh) 一种led集成结构的制造方法
CN102447044B (zh) 绝缘底板发光芯片封装结构
CN103325778B (zh) 发光装置以及照明器具
JP2007123302A (ja) 発光装置
CN202018960U (zh) 绝缘底板发光芯片封装结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20100908