CN202018960U - 绝缘底板发光芯片封装结构 - Google Patents
绝缘底板发光芯片封装结构 Download PDFInfo
- Publication number
- CN202018960U CN202018960U CN 201020667614 CN201020667614U CN202018960U CN 202018960 U CN202018960 U CN 202018960U CN 201020667614 CN201020667614 CN 201020667614 CN 201020667614 U CN201020667614 U CN 201020667614U CN 202018960 U CN202018960 U CN 202018960U
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- bonding area
- conduction
- top board
- crystal bonding
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- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020667614 CN202018960U (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201020667614 CN202018960U (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN202018960U true CN202018960U (zh) | 2011-10-26 |
Family
ID=44812628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201020667614 Expired - Fee Related CN202018960U (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
Country Status (1)
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CN (1) | CN202018960U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437273A (zh) * | 2011-12-02 | 2012-05-02 | 华中科技大学 | 利用表面改性实现无透镜封装的led封装器件及其方法 |
CN102544318A (zh) * | 2012-01-04 | 2012-07-04 | 歌尔声学股份有限公司 | 发光二极管装置 |
CN105047790A (zh) * | 2015-08-14 | 2015-11-11 | 何蓓 | 一种实用的大功率led封装结构 |
CN109713107A (zh) * | 2018-12-13 | 2019-05-03 | 佛山市国星光电股份有限公司 | 支架结构、led器件和灯组阵列 |
CN112447896A (zh) * | 2020-05-26 | 2021-03-05 | 开发晶照明(厦门)有限公司 | 光电器件及其制作方法 |
-
2010
- 2010-12-10 CN CN 201020667614 patent/CN202018960U/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102437273A (zh) * | 2011-12-02 | 2012-05-02 | 华中科技大学 | 利用表面改性实现无透镜封装的led封装器件及其方法 |
CN102437273B (zh) * | 2011-12-02 | 2014-08-27 | 华中科技大学 | 利用表面改性实现无透镜封装的led封装器件及其方法 |
CN102544318A (zh) * | 2012-01-04 | 2012-07-04 | 歌尔声学股份有限公司 | 发光二极管装置 |
CN102544318B (zh) * | 2012-01-04 | 2015-06-03 | 歌尔声学股份有限公司 | 发光二极管装置 |
CN105047790A (zh) * | 2015-08-14 | 2015-11-11 | 何蓓 | 一种实用的大功率led封装结构 |
CN109713107A (zh) * | 2018-12-13 | 2019-05-03 | 佛山市国星光电股份有限公司 | 支架结构、led器件和灯组阵列 |
CN112447896A (zh) * | 2020-05-26 | 2021-03-05 | 开发晶照明(厦门)有限公司 | 光电器件及其制作方法 |
US11569213B2 (en) | 2020-05-26 | 2023-01-31 | Kaistar Lighting (Xiamen) Co., Ltd. | Optoelectronic device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LUO RONG Free format text: FORMER OWNER: FENGHUA KUANGLEI SEMICONDUCTOR LIGHTING CO., LTD. Effective date: 20130128 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 315500 NINGBO, ZHEJIANG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130128 Address after: Nanshan District Xili Town, Shenzhen city of Guangdong Province in 518000 Liuxian Avenue Southland Belvedere 5-1002 Patentee after: Luo Rong Address before: 315500, No. 68, West Town, Fenghua, Zhejiang Patentee before: Fenghua Kuanglei Semiconductor Lighting Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111026 Termination date: 20141210 |
|
EXPY | Termination of patent right or utility model |