CN102544318A - 发光二极管装置 - Google Patents
发光二极管装置 Download PDFInfo
- Publication number
- CN102544318A CN102544318A CN2012100004234A CN201210000423A CN102544318A CN 102544318 A CN102544318 A CN 102544318A CN 2012100004234 A CN2012100004234 A CN 2012100004234A CN 201210000423 A CN201210000423 A CN 201210000423A CN 102544318 A CN102544318 A CN 102544318A
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- light
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- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000002310 reflectometry Methods 0.000 claims abstract description 11
- 238000001579 optical reflectometry Methods 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 12
- 238000007747 plating Methods 0.000 abstract description 3
- 238000012938 design process Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210000423.4A CN102544318B (zh) | 2012-01-04 | 2012-01-04 | 发光二极管装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210000423.4A CN102544318B (zh) | 2012-01-04 | 2012-01-04 | 发光二极管装置 |
Publications (2)
Publication Number | Publication Date |
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CN102544318A true CN102544318A (zh) | 2012-07-04 |
CN102544318B CN102544318B (zh) | 2015-06-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210000423.4A Active CN102544318B (zh) | 2012-01-04 | 2012-01-04 | 发光二极管装置 |
Country Status (1)
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CN (1) | CN102544318B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113328024A (zh) * | 2021-05-18 | 2021-08-31 | 泉州三安半导体科技有限公司 | 半导体发光装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1893130A (zh) * | 2005-07-04 | 2007-01-10 | 三星电机株式会社 | 具有改进的侧壁反射结构的侧光发光二极管 |
JP2007012993A (ja) * | 2005-07-01 | 2007-01-18 | Rohm Co Ltd | チップ型半導体発光素子 |
CN101691908A (zh) * | 2009-07-10 | 2010-04-07 | 东莞市万丰纳米材料有限公司 | Led封装模块 |
CN101752470A (zh) * | 2008-12-03 | 2010-06-23 | 一诠精密工业股份有限公司 | 发光二极管结构的电镀制程改良方法 |
CN202018960U (zh) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | 绝缘底板发光芯片封装结构 |
CN202423381U (zh) * | 2012-01-04 | 2012-09-05 | 歌尔声学股份有限公司 | 发光二极管装置 |
-
2012
- 2012-01-04 CN CN201210000423.4A patent/CN102544318B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007012993A (ja) * | 2005-07-01 | 2007-01-18 | Rohm Co Ltd | チップ型半導体発光素子 |
CN1893130A (zh) * | 2005-07-04 | 2007-01-10 | 三星电机株式会社 | 具有改进的侧壁反射结构的侧光发光二极管 |
CN101752470A (zh) * | 2008-12-03 | 2010-06-23 | 一诠精密工业股份有限公司 | 发光二极管结构的电镀制程改良方法 |
CN101691908A (zh) * | 2009-07-10 | 2010-04-07 | 东莞市万丰纳米材料有限公司 | Led封装模块 |
CN202018960U (zh) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | 绝缘底板发光芯片封装结构 |
CN202423381U (zh) * | 2012-01-04 | 2012-09-05 | 歌尔声学股份有限公司 | 发光二极管装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113328024A (zh) * | 2021-05-18 | 2021-08-31 | 泉州三安半导体科技有限公司 | 半导体发光装置 |
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Publication number | Publication date |
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CN102544318B (zh) | 2015-06-03 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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TR01 | Transfer of patent right |
Effective date of registration: 20201123 Address after: 225700, Jiangsu, Taizhou province Xinghua Chen town industrial concentration area Patentee after: Taizhou Durun composite new material Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201218 Address after: No. 10, Yingbin Avenue, Dongtai Development Zone, Yancheng City, Jiangsu Province Patentee after: Jiangsu Chuangqi Testing Technology Co.,Ltd. Address before: 225700 Chen Bao town industrial concentration area, Xinghua City, Taizhou, Jiangsu Patentee before: Taizhou Durun composite new material Co.,Ltd. |
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TR01 | Transfer of patent right | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20120704 Assignee: DONGTAI GAOKE TECHNOLOGY INNOVATION PARK Co.,Ltd. Assignor: Jiangsu Chuangqi Testing Technology Co.,Ltd. Contract record no.: X2023980048819 Denomination of invention: LED device Granted publication date: 20150603 License type: Common License Record date: 20231202 |
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EE01 | Entry into force of recordation of patent licensing contract |