CN102447044B - 绝缘底板发光芯片封装结构 - Google Patents
绝缘底板发光芯片封装结构 Download PDFInfo
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- CN102447044B CN102447044B CN201010594930.6A CN201010594930A CN102447044B CN 102447044 B CN102447044 B CN 102447044B CN 201010594930 A CN201010594930 A CN 201010594930A CN 102447044 B CN102447044 B CN 102447044B
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- conduction
- luminescence chip
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010594930.6A CN102447044B (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010594930.6A CN102447044B (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN102447044A CN102447044A (zh) | 2012-05-09 |
CN102447044B true CN102447044B (zh) | 2014-05-14 |
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CN201010594930.6A Active CN102447044B (zh) | 2010-12-10 | 2010-12-10 | 绝缘底板发光芯片封装结构 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103515502A (zh) * | 2012-06-29 | 2014-01-15 | 展晶科技(深圳)有限公司 | 发光二极管装置 |
CN103985807B (zh) * | 2013-02-07 | 2016-12-28 | 深圳大道半导体有限公司 | 无机基板及其制造方法 |
CN103311410A (zh) * | 2013-06-13 | 2013-09-18 | 苏州金科信汇光电科技有限公司 | 一种高导热高击穿电压集成式led |
CN103296189A (zh) * | 2013-06-20 | 2013-09-11 | 苏州金科信汇光电科技有限公司 | 一种高导热率高取光高耐压集成式led |
CN106784245A (zh) * | 2016-12-28 | 2017-05-31 | 安徽连达光电科技有限公司 | 一种高气密性的led封装支架及其制作方法 |
CN115696721B (zh) * | 2022-09-26 | 2023-07-18 | 北京金百泽科技有限公司 | 印制电路板及其发光器件封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2867599Y (zh) * | 2005-11-03 | 2007-02-07 | 东贝光电科技股份有限公司 | 混光发光二极管结构 |
CN101079461A (zh) * | 2006-05-23 | 2007-11-28 | 台达电子工业股份有限公司 | 发光装置 |
CN201112414Y (zh) * | 2007-09-21 | 2008-09-10 | 万喜红 | 大功率led封装结构 |
CN201327844Y (zh) * | 2008-12-02 | 2009-10-14 | 苏州久腾光电科技有限公司 | 表面贴装led模组封装结构 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2657204Y (zh) * | 2003-04-29 | 2004-11-17 | 洪千惠 | 一种带发光二极体的电路板 |
CN100407462C (zh) * | 2006-05-25 | 2008-07-30 | 吴质朴 | 一种发光二极管的封装方法 |
-
2010
- 2010-12-10 CN CN201010594930.6A patent/CN102447044B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2867599Y (zh) * | 2005-11-03 | 2007-02-07 | 东贝光电科技股份有限公司 | 混光发光二极管结构 |
CN101079461A (zh) * | 2006-05-23 | 2007-11-28 | 台达电子工业股份有限公司 | 发光装置 |
CN201112414Y (zh) * | 2007-09-21 | 2008-09-10 | 万喜红 | 大功率led封装结构 |
CN201327844Y (zh) * | 2008-12-02 | 2009-10-14 | 苏州久腾光电科技有限公司 | 表面贴装led模组封装结构 |
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CN102447044A (zh) | 2012-05-09 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: LUO RONG Free format text: FORMER OWNER: FENGHUA KUANGLEI SEMICONDUCTOR LIGHTING CO., LTD. Effective date: 20130123 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 315500 NINGBO, ZHEJIANG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20130123 Address after: Nanshan District Xili Town, Shenzhen city of Guangdong Province in 518000 Liuxian Avenue Southland Belvedere 5-1002 Applicant after: Luo Rong Address before: 315500, No. 68, West Town, Fenghua, Zhejiang Applicant before: Fenghua Kuanglei Semiconductor Lighting Co., Ltd. |
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Effective date of registration: 20160219 Address after: 518000 Guangdong province Shenzhen Nanshan District Nantou Street Shennan 10128 Nanshan digital cultural industry base West Tower 508-3 Patentee after: SHENZHEN DADAO SEMICONDUCTOR CO., LTD. Address before: Nanshan District Xili Town, Shenzhen city of Guangdong Province in 518000 Liuxian Avenue Southland Belvedere 5-1002 Patentee before: Luo Rong |