KR20090048362A - 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

반도체 장치의 제조 방법 및 반도체 장치 Download PDF

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Publication number
KR20090048362A
KR20090048362A KR1020080110509A KR20080110509A KR20090048362A KR 20090048362 A KR20090048362 A KR 20090048362A KR 1020080110509 A KR1020080110509 A KR 1020080110509A KR 20080110509 A KR20080110509 A KR 20080110509A KR 20090048362 A KR20090048362 A KR 20090048362A
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South Korea
Prior art keywords
semiconductor chip
wiring board
semiconductor device
wiring
layer
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English (en)
Korean (ko)
Inventor
기요시 오이
마사히로 스노하라
도모하루 후지이
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신꼬오덴기 고교 가부시키가이샤
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Publication of KR20090048362A publication Critical patent/KR20090048362A/ko
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1020080110509A 2007-11-09 2008-11-07 반도체 장치의 제조 방법 및 반도체 장치 Withdrawn KR20090048362A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-292142 2007-11-09
JP2007292142A JP2009117767A (ja) 2007-11-09 2007-11-09 半導体装置の製造方法及びそれにより製造した半導体装置

Publications (1)

Publication Number Publication Date
KR20090048362A true KR20090048362A (ko) 2009-05-13

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KR1020080110509A Withdrawn KR20090048362A (ko) 2007-11-09 2008-11-07 반도체 장치의 제조 방법 및 반도체 장치

Country Status (4)

Country Link
US (1) US20090121334A1 (enExample)
JP (1) JP2009117767A (enExample)
KR (1) KR20090048362A (enExample)
TW (1) TW200921821A (enExample)

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US8410604B2 (en) * 2010-10-26 2013-04-02 Xilinx, Inc. Lead-free structures in a semiconductor device
US8698303B2 (en) 2010-11-23 2014-04-15 Ibiden Co., Ltd. Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
KR101719636B1 (ko) * 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
JP2013183002A (ja) * 2012-03-01 2013-09-12 Ibiden Co Ltd 電子部品
US9406579B2 (en) * 2012-05-14 2016-08-02 STATS ChipPAC Pte. Ltd. Semiconductor device and method of controlling warpage in semiconductor package
JP6470095B2 (ja) * 2014-07-25 2019-02-13 京セラ株式会社 配線基板
TWI632647B (zh) * 2016-01-18 2018-08-11 矽品精密工業股份有限公司 封裝製程及其所用之封裝基板
US10580710B2 (en) 2017-08-31 2020-03-03 Micron Technology, Inc. Semiconductor device with a protection mechanism and associated systems, devices, and methods
US10381329B1 (en) 2018-01-24 2019-08-13 Micron Technology, Inc. Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
US10475771B2 (en) 2018-01-24 2019-11-12 Micron Technology, Inc. Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
JP7189672B2 (ja) * 2018-04-18 2022-12-14 新光電気工業株式会社 半導体装置及びその製造方法
US12205877B2 (en) * 2019-02-21 2025-01-21 AT&S(Chongqing) Company Limited Ultra-thin component carrier having high stiffness and method of manufacturing the same
CN115547846A (zh) * 2019-02-21 2022-12-30 奥特斯科技(重庆)有限公司 部件承载件及其制造方法和电气装置
CN114582731A (zh) * 2022-05-05 2022-06-03 华进半导体封装先导技术研发中心有限公司 一种层叠封装的下封装体结构及其形成方法
CN118782478A (zh) * 2024-07-01 2024-10-15 中科同德微电子科技(大同)有限公司 Igbt芯片封装方法及igbt芯片封装模块

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