KR20090042777A - 반도체 플립칩 패키지를 위한 기판 및 공정 - Google Patents

반도체 플립칩 패키지를 위한 기판 및 공정 Download PDF

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Publication number
KR20090042777A
KR20090042777A KR20097001617A KR20097001617A KR20090042777A KR 20090042777 A KR20090042777 A KR 20090042777A KR 20097001617 A KR20097001617 A KR 20097001617A KR 20097001617 A KR20097001617 A KR 20097001617A KR 20090042777 A KR20090042777 A KR 20090042777A
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KR
South Korea
Prior art keywords
substrate
bumps
chip
holes
solder
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Ceased
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KR20097001617A
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English (en)
Korean (ko)
Inventor
치 와 콕
예 칭 탐
Original Assignee
인텔렉츄얼 벤처스 펀드 27 엘엘씨
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Application filed by 인텔렉츄얼 벤처스 펀드 27 엘엘씨 filed Critical 인텔렉츄얼 벤처스 펀드 27 엘엘씨
Publication of KR20090042777A publication Critical patent/KR20090042777A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07234—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
KR20097001617A 2006-07-31 2007-07-23 반도체 플립칩 패키지를 위한 기판 및 공정 Ceased KR20090042777A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/496,111 2006-07-31
US11/496,111 US7652374B2 (en) 2006-07-31 2006-07-31 Substrate and process for semiconductor flip chip package

Publications (1)

Publication Number Publication Date
KR20090042777A true KR20090042777A (ko) 2009-04-30

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ID=38985352

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Application Number Title Priority Date Filing Date
KR20097001617A Ceased KR20090042777A (ko) 2006-07-31 2007-07-23 반도체 플립칩 패키지를 위한 기판 및 공정

Country Status (7)

Country Link
US (1) US7652374B2 (https=)
EP (1) EP2054933A4 (https=)
JP (1) JP4988843B2 (https=)
KR (1) KR20090042777A (https=)
CN (1) CN101496168B (https=)
MY (1) MY151533A (https=)
WO (1) WO2008017232A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016175394A1 (ko) * 2015-04-30 2016-11-03 하나마이크론(주) 팬 아웃 패키지, 팬 아웃 pop 패키지 및 그 제조 방법
US10014248B2 (en) 2014-06-27 2018-07-03 Sony Corporation Semiconductor device with less positional deviation between aperture and solder

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759137B2 (en) * 2008-03-25 2010-07-20 Stats Chippac, Ltd. Flip chip interconnection structure with bump on partial pad and method thereof
US9345148B2 (en) 2008-03-25 2016-05-17 Stats Chippac, Ltd. Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
JP5426124B2 (ja) * 2008-08-28 2014-02-26 株式会社東芝 半導体発光装置の製造方法及び半導体発光装置
KR101211724B1 (ko) * 2009-04-30 2012-12-12 엘지이노텍 주식회사 반도체 패키지 및 그 제조방법
US8424748B2 (en) * 2009-12-21 2013-04-23 Intel Corporation Solder in cavity interconnection technology
US8372692B2 (en) * 2010-01-27 2013-02-12 Marvell World Trade Ltd. Method of stacking flip-chip on wire-bonded chip
US20110285013A1 (en) * 2010-05-20 2011-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
US8922004B2 (en) 2010-06-11 2014-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. Copper bump structures having sidewall protection layers
DE102010041917B4 (de) 2010-10-04 2014-01-23 Smartrac Ip B.V. Schaltungsanordnung und Verfahren zu deren Herstellung
FR2969374B1 (fr) * 2010-12-16 2013-07-19 St Microelectronics Crolles 2 Procédé d'assemblage de deux circuits intégrés et structure correspondante
US8936967B2 (en) * 2011-03-23 2015-01-20 Intel Corporation Solder in cavity interconnection structures
CN102368495A (zh) * 2011-10-09 2012-03-07 常熟市华海电子有限公司 一种防静电芯片封装结构
US8970035B2 (en) * 2012-08-31 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bump structures for semiconductor package
JP2014060211A (ja) * 2012-09-14 2014-04-03 Omron Corp 基板構造、半導体チップの実装方法及びソリッドステートリレー
US9627347B2 (en) * 2012-09-24 2017-04-18 National Institute Of Advanced Industrial Science And Technology Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
JP6044258B2 (ja) * 2012-10-19 2016-12-14 コニカミノルタ株式会社 インクジェットヘッド
US20140362550A1 (en) * 2013-06-11 2014-12-11 Nvidia Corporation Selective wetting process to increase solder joint standoff
KR102111739B1 (ko) 2013-07-23 2020-05-15 삼성전자주식회사 반도체 패키지 및 그 제조방법
CN104425287A (zh) * 2013-08-19 2015-03-18 讯芯电子科技（中山）有限公司 封装结构及制造方法
CN103579012B (zh) * 2013-10-24 2016-08-17 天水华天科技股份有限公司 带焊球面阵列四面扁平无引脚封装件生产方法
US20150187681A1 (en) * 2013-12-26 2015-07-02 Ravi V. Mahajan Flexible microelectronic assembly and method
KR101534705B1 (ko) * 2013-12-30 2015-07-07 현대자동차 주식회사 반도체 기판의 접합 방법
KR101542965B1 (ko) * 2013-12-30 2015-08-07 현대자동차 주식회사 반도체 기판의 접합 방법
US9935072B2 (en) * 2015-11-04 2018-04-03 Sfa Semicon Co., Ltd. Semiconductor package and method for manufacturing the same
TWI606565B (zh) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 封裝結構及其製作方法
CN106816417B (zh) * 2017-01-13 2019-02-12 南京大学 一种高密度封装及其制造方法
KR20190117514A (ko) * 2017-02-17 2019-10-16 소니 세미컨덕터 솔루션즈 가부시키가이샤 반도체 장치, 칩형상 반도체 소자, 반도체 장치를 구비한 전자 기기 및 반도체 장치의 제조 방법
KR102432216B1 (ko) * 2017-07-11 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
US10269672B2 (en) * 2017-08-24 2019-04-23 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
KR102393035B1 (ko) * 2017-09-01 2022-05-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
EP3483943B1 (en) * 2017-09-12 2021-04-28 LG Innotek Co., Ltd. Light emitting device package
US10598874B2 (en) * 2017-11-02 2020-03-24 International Business Machines Corporation Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
DE102018104279B4 (de) * 2018-02-26 2025-02-06 Tdk Corporation Elektronische Vorrichtung
JP7214966B2 (ja) 2018-03-16 2023-01-31 富士電機株式会社 半導体装置及び半導体装置の製造方法
CN114864535A (zh) * 2021-02-04 2022-08-05 日月光半导体制造股份有限公司 半导体结构及其形成方法
KR20230020129A (ko) 2021-08-03 2023-02-10 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
US12601621B2 (en) 2022-03-30 2026-04-14 Applied Materials, Inc. Methods of manufacturing plasma generating cells for a plasma source
CN115312638A (zh) * 2022-08-03 2022-11-08 惠州华星光电显示有限公司 发光基板及其制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2034703A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
JP3215424B2 (ja) * 1992-03-24 2001-10-09 ユニシス・コーポレイション 微細自己整合特性を有する集積回路モジュール
US5329423A (en) * 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
JP3160175B2 (ja) * 1995-02-13 2001-04-23 三菱電機株式会社 電子部品の実装方法
US5795818A (en) * 1996-12-06 1998-08-18 Amkor Technology, Inc. Integrated circuit chip to substrate interconnection and method
US6330967B1 (en) * 1997-03-13 2001-12-18 International Business Machines Corporation Process to produce a high temperature interconnection
US6492600B1 (en) * 1999-06-28 2002-12-10 International Business Machines Corporation Laminate having plated microvia interconnects and method for forming the same
JP2001257453A (ja) * 2000-03-09 2001-09-21 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びそれらの製造方法
US6787918B1 (en) * 2000-06-02 2004-09-07 Siliconware Precision Industries Co., Ltd. Substrate structure of flip chip package
US6573610B1 (en) * 2000-06-02 2003-06-03 Siliconware Precision Industries Co., Ltd. Substrate of semiconductor package for flip chip package
DE10104574A1 (de) * 2001-02-01 2002-08-08 Epcos Ag Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung
JP2002033349A (ja) * 2001-06-07 2002-01-31 Matsushita Electric Ind Co Ltd 半導体素子の実装方法、及び回路基板
JP3829325B2 (ja) * 2002-02-07 2006-10-04 日本電気株式会社 半導体素子およびその製造方法並びに半導体装置の製造方法
US6975035B2 (en) * 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
JP3897250B2 (ja) 2002-08-28 2007-03-22 日本シイエムケイ株式会社 半導体パッケージ用基板とその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10014248B2 (en) 2014-06-27 2018-07-03 Sony Corporation Semiconductor device with less positional deviation between aperture and solder
WO2016175394A1 (ko) * 2015-04-30 2016-11-03 하나마이크론(주) 팬 아웃 패키지, 팬 아웃 pop 패키지 및 그 제조 방법
KR20160129407A (ko) * 2015-04-30 2016-11-09 하나 마이크론(주) 팬 아웃 패키지, 팬 아웃 pop 패키지 및 그 제조 방법

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JP4988843B2 (ja) 2012-08-01
MY151533A (en) 2014-05-30
CN101496168B (zh) 2011-06-01
EP2054933A4 (en) 2010-04-21
US20080023829A1 (en) 2008-01-31
CN101496168A (zh) 2009-07-29
WO2008017232A1 (en) 2008-02-14
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JP2009545180A (ja) 2009-12-17
US7652374B2 (en) 2010-01-26

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