KR20090008405A - 차폐된 가요성 회로 및 이의 제조 방법 - Google Patents

차폐된 가요성 회로 및 이의 제조 방법 Download PDF

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Publication number
KR20090008405A
KR20090008405A KR1020087028721A KR20087028721A KR20090008405A KR 20090008405 A KR20090008405 A KR 20090008405A KR 1020087028721 A KR1020087028721 A KR 1020087028721A KR 20087028721 A KR20087028721 A KR 20087028721A KR 20090008405 A KR20090008405 A KR 20090008405A
Authority
KR
South Korea
Prior art keywords
conductive
conductor
flexible
support member
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087028721A
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English (en)
Korean (ko)
Inventor
데일 웨셀만
찰스 이. 탭 스코트
Original Assignee
멀티-파인라인 일렉트로닉스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 멀티-파인라인 일렉트로닉스, 인크. filed Critical 멀티-파인라인 일렉트로닉스, 인크.
Publication of KR20090008405A publication Critical patent/KR20090008405A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Communication Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020087028721A 2006-05-02 2007-04-26 차폐된 가요성 회로 및 이의 제조 방법 Withdrawn KR20090008405A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US79671606P 2006-05-02 2006-05-02
US60/796,716 2006-05-02
US81192706P 2006-06-08 2006-06-08
US60/811,927 2006-06-08
US11/739,550 US7645941B2 (en) 2006-05-02 2007-04-24 Shielded flexible circuits and methods for manufacturing same
US11/739,550 2007-04-24

Publications (1)

Publication Number Publication Date
KR20090008405A true KR20090008405A (ko) 2009-01-21

Family

ID=38694381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087028721A Withdrawn KR20090008405A (ko) 2006-05-02 2007-04-26 차폐된 가요성 회로 및 이의 제조 방법

Country Status (4)

Country Link
US (2) US7645941B2 (enExample)
JP (1) JP2009535848A (enExample)
KR (1) KR20090008405A (enExample)
WO (1) WO2007133405A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170132931A (ko) * 2016-05-24 2017-12-05 엘지디스플레이 주식회사 케이블 및 두루마리형 연성표시장치
WO2023075141A1 (ko) * 2021-10-27 2023-05-04 삼성전자 주식회사 Rf 케이블을 포함하는 전자 장치
US12113303B2 (en) 2021-10-27 2024-10-08 Samsung Electronics Co., Ltd. Electronic device comprising radio frequency cable

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US8456851B2 (en) * 2008-05-16 2013-06-04 Apple Inc. Flex circuit with single sided routing and double sided attach
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TWI387407B (zh) * 2009-06-10 2013-02-21 Htc Corp 軟式印刷電路板其及組成方法
CN101932188B (zh) * 2009-06-18 2013-05-08 宏达国际电子股份有限公司 柔性印刷电路板及其组成方法
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US8127432B2 (en) 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US8362856B2 (en) * 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
KR101301105B1 (ko) * 2011-11-02 2013-08-27 포항공과대학교 산학협력단 선박용 전송선로
JP2013187248A (ja) * 2012-03-06 2013-09-19 Nec Computertechno Ltd 誘電体フィルム、プリント基板、および特性インピーダンスの調整方法
CN205609247U (zh) 2012-11-08 2016-09-28 3M创新有限公司 具有纵向轴线的电缆线
KR101705973B1 (ko) * 2015-04-22 2017-02-13 연세대학교 산학협력단 유전체 전자기파 차폐막
CN106376169A (zh) * 2015-07-24 2017-02-01 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
JP7390779B2 (ja) * 2017-04-28 2023-12-04 日東電工株式会社 フレキシブル配線回路基板および撮像装置
EP3729916A1 (en) * 2018-03-16 2020-10-28 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
WO2020008729A1 (ja) * 2018-07-06 2020-01-09 天竜精機株式会社 伝送線路、伝送線路の製造方法及び伝送線路の製造装置
CA3109467C (en) * 2018-08-16 2024-01-02 Micro Motion, Inc. Electromagnetic interference resistant electronics enclosure
CN113973420B (zh) * 2020-07-22 2024-05-31 庆鼎精密电子（淮安）有限公司 软硬结合板及软硬结合板的制作方法

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Publication number Priority date Publication date Assignee Title
KR20170132931A (ko) * 2016-05-24 2017-12-05 엘지디스플레이 주식회사 케이블 및 두루마리형 연성표시장치
WO2023075141A1 (ko) * 2021-10-27 2023-05-04 삼성전자 주식회사 Rf 케이블을 포함하는 전자 장치
US12113303B2 (en) 2021-10-27 2024-10-08 Samsung Electronics Co., Ltd. Electronic device comprising radio frequency cable

Also Published As

Publication number Publication date
US20100071935A1 (en) 2010-03-25
WO2007133405A2 (en) 2007-11-22
JP2009535848A (ja) 2009-10-01
HK1131718A1 (en) 2010-01-29
US7645941B2 (en) 2010-01-12
WO2007133405A3 (en) 2008-12-11
US20080202807A1 (en) 2008-08-28

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PA0105 International application

Patent event date: 20081124

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid