TW432412B - Method for fabricating built-in printed circuit board inductor and transformer - Google Patents

Method for fabricating built-in printed circuit board inductor and transformer Download PDF

Info

Publication number
TW432412B
TW432412B TW88119817A TW88119817A TW432412B TW 432412 B TW432412 B TW 432412B TW 88119817 A TW88119817 A TW 88119817A TW 88119817 A TW88119817 A TW 88119817A TW 432412 B TW432412 B TW 432412B
Authority
TW
Taiwan
Prior art keywords
copper
built
circuit board
copper foil
scope
Prior art date
Application number
TW88119817A
Other languages
Chinese (zh)
Inventor
Jiun-Ji Jang
Wen-Yan Lin
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW88119817A priority Critical patent/TW432412B/en
Application granted granted Critical
Publication of TW432412B publication Critical patent/TW432412B/en

Links

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

This invention is about method for fabricating built-in printed circuit board inductor and transformer. In this invention, after the insulation layer formed by resin rubber plate is inserted into multi-layered copper foil and the iron core mezzanine formed by ferromagnetic metal is inserted into the middle layer, the composite structure is pressed together, in which the procedures of drilling hole and punching-hole electroplating are performed onto each copper foil layer so as to obtain the mutual connection. Additionally, photolithography is used to strip extra copper foil and form copper circuit on the insulation layer such that coil winding set can be formed. Because the coil winding set is formed by surrounding iron core that has high permeability, the inductance of coil winding set can be increased under the premise of without increasing the turn number of coil and thickness of printed circuit board. The method aforementioned can be used to fabricate built-in printed circuit board inductor and transformer.

Description

經濟部智慧財產局員工消費合作社印製 4 3 2 4 1 2 A7 —_____ B7 _ 五、發明說明(/ ) 本發明係關於一種内建印刷電路板式電感、變壓器之 製造方法,尤指一種可在不提高線圈匝數及印刷電路板厚 度的前提下’而增加電感量之内建式電感。 今 按’尚速與微型化係電子元件恒久不變之追求目標, 由於該等趨勢與實際需求,電路板上有越來越多内層連線 的尺寸大小與電氣特性被提出檢討,再者如依然採用外建 的被動元件’即意謂將無法達成系統產品微型化的目標; 此外’整性(外建的被動元件)無可避免的在率絲中 產.圭領外的電感效應’更不利的是,通常在高频狀態下, .述額外產生的電感效應將成為電磁輕射及相關阻抗轡動 與象的主要,如熟習此項技藝者所能理解,前述狀況 將嚴重影響電路工作的正確性。 基於微型体與改善電氣特性等因素,將被動元件内建 於印刷電路板中的想法即應運而生。而常用的被動元件包 括電阻、電容及電感等三種,其中電阻、電容引起了較多 注意’如利用高介電係數材料製作高電容密度的元件,一 種將錄金屬薄膜爽在銅猪和絕緣層間的構造用來製作電 阻。然而’電感及其他相關元件(如變壓器),一直到最 近幾年才受到重視,而第一個被提出來的實際電感產品是 呈平面狀’主要係在印刷電路板中内建金屬線圈,如欲構 成一變壓器’則需要兩組同心的金屬線圈,其中一組為輸 入端,係供與電源或信號源連接,另外一組用作為輪出線 圈。 然而’内建平面式變壓器有一重大缺點在於其相對容 3 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) II— I -裳 ---I--I 訂.—--1----線 (請先閱讀背面之注意事項再填寫本頁) 432412 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明說明(2) 許的電流密度過小。根據過去的經驗’最大容許電流密产 可以藉由改變金屬線圈的線寬以獲得改善。但在高頻要求 下’伴隨著任何迴路而來的集膚效應(skin ef feet),即 使透過線圈線寬的改變,並不會產生顯著的改善效果。主 要原因在於.導線通過電流時將產生磁場,該磁場將令帶 電粒子向導線表面推擠,因此在一條長直導線中,電流只 會在表面至表面以下一定深度間的區域傳導,同時傳導的 區域將隨著電流頻率的升高而減少。故在呈螺旋狀的線圈 結構中’電流將由中心處被推擠到最外層表面,而對於平 面狀的電感而言’金屬導線的厚度與集膚效應在某頻率下 深度的乘積方為電流能夠通過的有效區域,故而,不論如 何增加線寬’在電流流經區域相同的限制下,對於提升電 流密度將不會有多大的幫助。 又由於電感量的大小與線圈的匝數(η )、線圈所圍 繞的面積(Α)及線圈内材料的磁導率(V)呈正比,意 即如要增加電感量則須提高線圈匝數或線圈面積、線圈材 料之導磁率,但提高匝數或線圈面積均將導致電路板面積 或厚度增加’在輕薄短小的要求下,前述方案將受限制, 因此,選擇高導磁率的材料成為較佳的選擇。 因此,本發明主要目的即在提供一種無須透過改變線 圈線寬即可改善電流密度之内建電感。 為達成前述目的採取的主要技術手段係令前述電感係 於多層鋼箔間夾設有樹脂膠片構成之絕緣層,並於中間層 處夾設鐵磁性金屬構成之鐵心夾層後予以壓合,其中各層 4 本紙張尺度適用令國國家標準(CNS)A4規格(210 x 297公釐) --—It* — - — —— — — — 'll—--- - « — — — —lilt (锖先閱讀背面之注意事項再填寫本頁) A7 B7 ^3241^ 五、發明說明(J ) 銅’泊係先經鑽孔及穿孔電鍍等步驟以相互連接,又利用光 製版術去除多餘銅箔而於絕緣層上形成銅線路,隨即可構 成線圈繞組; ~ 由於前述線圈繞組係由環繞高導磁率的鐵心構成,可 在不增加線圈匝數及印刷電路板厚度的前提下,提高繞線 通過電流密度及線圈繞组的電感量。 前述的内建式電感製造方法包括有: 一「高導磁鐵心層」製作步驟,係用以製作高導磁率 之鐵心夾層: 一「壓合」步驟,係於前述鐵心夾層的表、底面處依 序設以不特定層數的絕緣層及鋼箔並予壓合; 一「鑽孔電鍍」步驟,係於壓合構造上進行鑽孔,並 於孔洞進行穿礼電链,以連接各層銅箱; ' -「銅線路」形成步驟,係以製版術去除多餘銅箱, 於絕緣層上形成銅線路; 經過前述步驟後,即可構成一内建式電感,由於其線 圈繞组係環繞高導磁率的鐵心構成’可在不增加線圈阻數 及印刷線路板厚度的前提下,提高線圈繞組的電感量。 前述的「高導磁鐵心層」步驟係於一高導磁率的合金 表底面分別壓合乾膜’並作選擇性蝕刻後去除乾膜,即於 高導磁合金上形成若干穿孔’該穿孔適對應於各層鋼落間 之電鍍穿孔,。 前述的高導磁率之合金係由鐵、錄、錄、疑等鐵磁性 金屬或其合金構成。 (紙張疋度適用中國國家標準(CNS)A4規格(21〇χ 297公釐) ------- --- 裝--------訂 -----1 —線 (請先閱讀背面之注意事項再填窝本頁} 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 2 4 1 2 A7 —_____ B7 _ V. Description of the Invention (/) This invention relates to a method for manufacturing a built-in printed circuit board inductor and transformer, especially a method that can be used in Built-in inductor without increasing coil turns and printed circuit board thickness. Today, according to the constant pursuit of the goal of “Shangsu and Miniaturization Department of Electronic Components”, due to these trends and actual needs, more and more inner layer wiring sizes and electrical characteristics are being reviewed on circuit boards. Still using external built-in passive components 'means that the goal of miniaturizing system products will not be achieved; In addition,' integrity (external built-in passive components) will inevitably be produced in the rate wire. The inductance effect outside Guizhou is even more unfavorable The reason is that, usually at high frequencies, the additional inductive effect will become the main cause of electromagnetic light emission and related impedance vibration and image. As those skilled in the art can understand, the aforementioned conditions will seriously affect the circuit operation. Correctness. Based on factors such as miniature bodies and improved electrical characteristics, the idea of building passive components into printed circuit boards came into being. The commonly used passive components include resistance, capacitance, and inductance. Among them, resistance and capacitance have attracted more attention. 'For example, high-density materials are used to make high-capacitance-density components, and a metal film is placed between a copper pig and an insulating layer. The structure is used to make resistors. However, 'inductors and other related components (such as transformers) have not been valued until recent years, and the first practical inductor products that have been proposed to be flat are mainly built with metal coils in printed circuit boards, such as To form a transformer, two sets of concentric metal coils are needed, one of which is an input terminal, which is used to connect with a power source or a signal source, and the other is used as a wheel-out coil. However, one of the major disadvantages of the built-in planar transformer is its relative capacity. This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). II— I -Sang --- I--I order .—- -1 ---- line (please read the precautions on the back before filling this page) 432412 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (2) The allowed current density is too small. Based on past experience, the maximum allowable current density can be improved by changing the wire width of the metal coil. However, under high-frequency requirements, the skin effect that comes with any circuit, even if the line width of the transmission coil is changed, it will not produce a significant improvement effect. The main reason is that when a wire passes a current, a magnetic field will be generated. This magnetic field will cause the charged particles to push against the surface of the wire. Therefore, in a long straight wire, the current will only be conducted in the area between the surface and a certain depth below the surface, and at the same time. Will decrease with increasing current frequency. Therefore, in a spiral coil structure, the 'current will be pushed from the center to the outermost surface, and for a planar inductor, the product of the thickness of the metal wire and the depth of the skin effect at a certain frequency is the current. Through the effective area, therefore, no matter how to increase the line width ', under the same restrictions of the current flowing area, it will not help much to increase the current density. Because the amount of inductance is proportional to the number of turns of the coil (η), the area surrounded by the coil (A), and the magnetic permeability (V) of the material in the coil, which means that if you want to increase the inductance, you must increase the number of coil turns Or the coil area and the magnetic permeability of the coil material, but increasing the number of turns or the coil area will result in an increase in the area or thickness of the circuit board. Under the requirements of lightness, thinness, and shortness, the aforementioned solutions will be limited. Therefore, the choice of high-permeability materials becomes The best choice. Therefore, the main object of the present invention is to provide a built-in inductor which can improve the current density without changing the coil width. The main technical measures adopted in order to achieve the foregoing purpose are to make the aforementioned inductor be an insulating layer composed of a resin film sandwiched between multilayer steel foils, and sandwich the core sandwiching layer made of ferromagnetic metal at the middle layer, and then press the layers together. 4 The paper size is applicable to the national standard (CNS) A4 specification (210 x 297 mm) --- It * —-— — — — — 'll —----«— — — —lilt (锖 先Read the notes on the back and fill in this page) A7 B7 ^ 3241 ^ V. Description of the invention (J) The copper moorings are first connected with each other through drilling and perforation plating, and the photolithography is used to remove excess copper foil. A copper line is formed on the insulation layer, and then a coil winding can be formed; ~ As the aforementioned coil winding is composed of a high-permeability iron core, the current density of the winding can be increased without increasing the number of coil turns and the thickness of the printed circuit board. And the inductance of the coil winding. The aforementioned built-in inductor manufacturing method includes: a "high-permeability magnetic core layer" manufacturing step, which is used to make a high-magnetic-permeability core sandwich: a "press-fitting" step, which is located on the surface and bottom surface of the foregoing core sandwich Insulation layers and steel foils with an unspecified number of layers are sequentially set and laminated; a "drilling and plating" step is to drill holes in the laminated structure, and perform an electrical chain through the holes to connect the various layers of copper "-" Copper line "forming step is to remove excess copper boxes by platemaking to form copper lines on the insulation layer; after the foregoing steps, a built-in inductor can be formed, because its coil windings are high The core structure of magnetic permeability can increase the inductance of the coil winding without increasing the coil resistance and the thickness of the printed circuit board. The aforementioned "high-permeability magnetic core layer" step is to press dry films on the bottom surface of a high-permeability alloy, and remove the dry films after selective etching, that is, to form a number of perforations on the high-permeability alloy. Corresponding to the electroplated perforation between steel layers. The aforementioned high-permeability alloy is made of ferromagnetic metal such as iron, magnetic recording, magnetic recording, or magnetic resonance, or an alloy thereof. (Paper size is in accordance with Chinese National Standard (CNS) A4 (21〇χ 297 mm)) ------- --- Packing -------- Order ----- 1 —Line ( Please read the notes on the back before filling in this page} Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

4 3 2 4 彳 2 五、發明說明( 前述的内建式變壓器製造方法包括有: -「高導磁鐵心層」製作步驟,係用以製作高導磁 之鐵心夾層; 一「壓合」步驟,係於前述鐵心夾層的表、底面處依 序設以不特定層數的絕緣層及銅箔並予壓合; 一「鑽孔電鍍」步驟,係於壓合構造上進行鑽孔,並 於孔洞進行穿孔電鍍,以連接各層銅箔; 一「銅線路」形成步驟,係以製版術去除多餘鋼箔’ 於絕緣層上形成銅線路: 重覆前述「壓合」步驟; 重覆前述「鑽孔電鍍」步驟; 重覆前述「銅線路」形成步驟。 為使貴寧查委員進一步瞭解前述目的及本發明之技 術特徵’茲附以圖式詳細說明如后: (一)圖式部分: 第一圖:係本發明一較佳實施例之流程圖。 第一圖:係本發明中合金鐵心層之構造剖視圖。 第三圖A〜C:係本發明於高導磁合金上形成線路之製程 示意圖。 第四圖A、B :係本發明一較佳實施例之「壓合」步驟示 意圖。 第五圖A〜C ‘係本發明一較佳實施例之「鑽孔.電錢」步 驟示意圖。 第’、圖A〜C 係本發明一較佳實施例之「銅線路」形 ----I---I -------------------I Ϊ (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財岌局員X消費合作社印髮 6 432412 A7 B7 五、發明說明(r)4 3 2 4 彳 2 V. Description of the Invention (The aforementioned method of manufacturing a built-in transformer includes:-"High-permeability magnetic core layer" production step, which is used to make a high-magnetic-permeability core sandwich; a "compression" step A series of insulating layers and copper foils with an unspecified number of layers are sequentially placed on the surface and bottom surface of the aforementioned core sandwich and pressed together; a "drilling and plating" step is performed on the pressed structure and drilling Holes are perforated and electroplated to connect the various layers of copper foil. A "copper circuit" forming step is to remove excess steel foil by platemaking. To form copper circuits on the insulating layer: Repeat the aforementioned "compression" step; Repeat the aforementioned "drilling" "Hole plating" step; Repeat the aforementioned "copper circuit" formation step. In order to make the Guining investigation committee better understand the aforementioned purpose and the technical features of the present invention, a detailed description is attached as follows: (1) Schematic part: Section A picture: is a flowchart of a preferred embodiment of the present invention. The first picture: is a sectional view of the structure of the alloy core layer in the present invention. The third picture A ~ C: is the process of forming a circuit on a highly magnetically permeable alloy according to the present invention. Schematic. A, B: Schematic diagram of the "pressing" step of a preferred embodiment of the present invention. The fifth diagram A ~ C 'is a schematic diagram of the "drilling. Electric money" step of a preferred embodiment of the present invention. A ~ C are "copper lines" of a preferred embodiment of the present invention ---- I --- I ------------------- I Ϊ (please first Read the notes on the back and fill in this page) Member of the Smart Finance Bureau of the Ministry of Economic Affairs X Consumer Cooperatives 6 432412 A7 B7 V. Description of the invention (r)

步驟示意圖。 第七圖:係本發明又—較佳實施例之變㈣平面構造示意 圖。 a 第八圖A〜D 係本發明再一較佳實施例之「壓合 「鑽孔電鑛」步驟示意圖。 係本發明再一較佳實施例之 成步驟示意圖。 )圖號部分:Steps schematic. Fig. 7 is a schematic diagram of a variable plane structure of another preferred embodiment of the present invention. a The eighth diagrams A to D are schematic diagrams of the steps of "pressing" and "drilling power mining" according to yet another preferred embodiment of the present invention. It is a schematic diagram of the forming steps of another preferred embodiment of the present invention. ) Figure number part:

第九圖A〜C 鋼線路!形 (1 0)鐵磁性金屬 (1 2 )穿孔 (14)(14 ‘)銅箔 (16)(16 ‘)乾膜 (3 0 0 )線圈 (3 0 2 )二次側繞組 (1 1 )乾膜 (13) (13 (15) (15 (17) (17 (3 0 1 ) —次側繞組(303) (3〇4)線頭 )絕緣層 )電鍍銅 )銅線路 經濟部智慧財產局員工消費合作社印製 有關本發明之第一較佳實施例係用以製作具有高電流 密度的平面式電感,其流程係如第一圖所示,主要包括 有: 一「高導磁鐵心層」製作步驟,係用以製作高導磁率 之鐵心失層; 一「壓合」步驟,係於前述鐵心夾層的表、底面處依 序設以絕緣層及銅箔並予壓合; 一「鑽孔電鍍」步驟,係於壓合構造上進行鑽孔,並 於孔洞進行穿孔電鍍,以連接各層銅箔; 一「銅線路」形成步驟,係以製版術去除多餘銅箱, 本紙張尺度適用中國固家標準(CNS)A4規格(210 X 297公釐) -------------裝--------訂i-------綠 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 432412 A7 _____ B7_ '~ ------- 五、發明說明(6) 於絕緣層上形成銅線路; 如為多層構造即重疊前述「壓合」至「鋼線路」步 驟;其中: ,」^ 有關「高導磁鐵心層」之實施步驟’參閱第二圖所 不,主要係先於间導磁率的鐵磁性金屬(1 〇)的表底 面分別覆設乾膜(1 1 ),再經曝光顯影等影像轉移步驟 將圖案轉移至乾膜(ln上(如第三圖A所示),隨後 進行選擇性蝕刻,去除線路圖案處的乾膜及金屬(如第三 圖B所示),最後再將乾膜(11)去除,即於高導磁率 鐵磁性金屬(1〇 )上形成若干鏤空的線路,該高導磁鐵 磁性金屬可由鐵、鎳、鈷、錳等鐵磁性金屬或其合金構 成,於本實施例,該鐵磁性金屬(1 〇 )係由鐵錄合金構 成’其上形成孓線路係若干穿孔(12)(如第三圖cm 示)。 s玄「Μ合」步驟,請參閱第四圖所示,主要係於鐵磁. 性金屬(1 〇 )的表、底面分別依序覆設有樹脂構成的絕 緣層(13)及銅箔(14)(如第四圊Α所示),並進 —步予以壓合(如第四圖B所示),而於壓合時,絕緣層 (1 3 )之樹脂將填入鐵磁性金屬(1 〇 )之穿孔(1 2 )中。 該「鑽孔電鍍」步驟,請參閱第五圖所示,為連接前 述的上下兩層銅箔(1 4),於前述壓合完成的構造上進 行鑽孔’該鑽孔位置適對應於鐵磁性金屬(1 〇 )上原形 成的穿孔(12)處(如第五圖A所示),隨後再於穿孔 8 本紙張尺度適用中國國家標準(CMS)A4規格(210 X 297公釐) I — I I — I I I I ! 1 ] I I ϊ ----I I · I I I I I I I I (請先閱讀背面之注意事項再填寫本頁) 4 3 241 2 A7 經濟部智慧財產局員工消費合作社fp製 五、發明說明( 内進行電鍍而形成電鍍銅(15)(如第五圖B所示), 而上下兩層鋼箔(14)即透過該電鍍銅(15)構成電 性連接。 a 當前述製程用於製作平面式電感時,在完成電鍍銅步 驟後,即直接進行「銅線路」形成步驟,主要係利用製版 術以達成,如第六圖A所示,係於前述經過電鑛步驟的上 下兩層銅箔(1 4)表面分別覆設以乾膜(i 6),又乾 膜(1 6 )表面以曝光顯影方式轉移線路圖案:隨後再經 過選擇性钮刻去除線路圖案以外的銅箔.(如第六圊B所 示),經將未蝕刻乾膜(i 6 )完全去除後,即分別上下 兩絕緣層(13)表面形成有銅線路(丄7)(如第六圖 C所示),且上下兩層銅線路(17)並透過電鍍銅(1 5)構成電性連接,隨即構成一平面式電感。 月ϋ述方法除用以製作平面式電感外,亦可用以製造平 面式變壓器,其一較佳實施例,係利用前述平面式電感直 接構成變壓器的一次側繞組與二次側繞組,如第七圖所 示,該平面式電感係由具有適當匝數的線圈(3 〇〇)構 成,當利用前述線圈(3 0 0 )構成變壓器時,係令線圈 (3 0 0 )於適當匝數處中斷,而分別構成一次側繞組 (3 0 1 )及二次側繞組(3 0 2 ),又分別於一次側繞 組(3 0 1 )與二次側繞組(3 〇 2)兩端分別拉出線頭 (3 0 3 )( 3 0 4 ),即構成變壓器之—次側與二次 側。 又關於用以製造平面式變壓器之第二較佳實施例,其 9 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 裝-------1訂---------線 (請先閱讀背面之注意事項再填窝本頁) 4 3 2 4 1 2 五、發明說明(ί) 製程係前述平面式電感製造方法 -「高導磁鐵心層」製作步驟;’其依然包括有: 一「壓合」步驟; 「鑽孔電鑛」步驟; 「銅線路」形成步驟等。 惟在「壓合」、「鑽孔電鍍」及「銅線路 驟之次數則略有變化。 」形成等步The ninth picture A ~ C steel line! (1 0) ferromagnetic metal (1 2) perforated (14) (14 ') copper foil (16) (16') dry film (3 0 0) coil (3 0 2) secondary winding (1 1) Dry film (13) (13 (15) (15 (17) (17 (3 0 1)-secondary winding (303) (304) wire head) insulation layer) copper plating) copper wire) Intellectual Property Bureau of the Ministry of Economic Affairs The first preferred embodiment of the present invention printed by an employee consumer cooperative is used to make a planar inductor with a high current density. The process is shown in the first figure. It mainly includes: A "high-conductivity magnetic core layer" The manufacturing step is used to make the core loss layer with high magnetic permeability. A "press-fitting" step is to sequentially place an insulating layer and copper foil on the surface and bottom of the core sandwich and press them together; a "drilling hole" The "plating" step is to drill holes on the laminated structure and perform perforation plating on the holes to connect the various layers of copper foil. A "copper circuit" forming step is to remove excess copper boxes by platemaking. Home Standard (CNS) A4 Specification (210 X 297 mm) ------------- Installation -------- Order i ------- Green (Please read first (Notes on the back then fill out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 432412 A7 _____ B7_ '~ ------- V. Description of the invention (6) Form a copper circuit on the insulation layer; if it is a multi-layer structure, the aforementioned “compression” is overlapped to "Steel circuit" steps; of which: "" ^ For the implementation steps of "high-permeability magnetic core layer", refer to the second figure, which is mainly covered by the bottom surface of the ferromagnetic metal (10) before the magnetic permeability. Set the dry film (1 1), and then transfer the pattern to the dry film (ln (as shown in the third figure A)) through image transfer steps such as exposure and development, and then perform selective etching to remove the dry film and metal at the circuit pattern. (As shown in the third figure B), and finally the dry film (11) is removed, that is, a number of hollow lines are formed on the high-permeability ferromagnetic metal (10). The high-permeability magnetic metal can be made of iron, nickel, Ferromagnetic metals such as cobalt and manganese or alloys thereof. In this embodiment, the ferromagnetic metal (10) is composed of a ferroalloy, and a plurality of perforations (12) are formed on the samarium line system (as shown in the third figure cm). ). Suan "Μ 合" steps, please refer to the fourth picture, It should be tied to the ferromagnetic. The surface and bottom surface of the ferrous metal (10) are respectively covered with an insulating layer (13) and a copper foil (14) made of resin (as shown in the fourth 圊 A), and then- Pressing (as shown in the fourth figure B), and during pressing, the resin of the insulating layer (1 3) will be filled in the perforations (1 2) of the ferromagnetic metal (10). The "drilling plating" For the steps, please refer to the fifth figure. In order to connect the above two layers of copper foil (1 4), drill holes on the above-mentioned laminated structure. The position of the drill holes is corresponding to the ferromagnetic metal (1 0). Uehara formed the perforations (12) (as shown in the fifth figure A), and then perforated 8 paper sizes to the Chinese National Standard (CMS) A4 (210 X 297 mm) I — II — IIII! 1] II ϊ ---- II · IIIIIIII (Please read the precautions on the back before filling out this page) 4 3 241 2 A7 Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives, fp system 5. Description of the invention (Electroplating inside to form electroplated copper ( 15) (as shown in the fifth figure B), and the upper and lower layers of steel foil (14) form an electrical connection through the electroplated copper (15) . a When the aforementioned process is used to make a planar inductor, after the copper plating step is completed, the "copper circuit" formation step is directly performed, which is mainly achieved by using platemaking. As shown in Figure 6A, The surface of the upper and lower copper foils (1 4) of the mining step are respectively covered with a dry film (i 6), and the surface of the dry film (1 6) is transferred to the circuit pattern by exposure and development: the circuit pattern is subsequently removed by selective button engraving. (As shown in Section 6B), after the unetched dry film (i 6) is completely removed, copper lines (丄 7) are formed on the surface of the upper and lower insulation layers (13), respectively (as in (Shown in Figure 6C), and the upper and lower two layers of copper lines (17) are electrically connected through electroplated copper (15), and then form a planar inductor. The method described above can be used not only to make planar inductors, but also to make planar transformers. A preferred embodiment uses the aforementioned planar inductors to directly form the primary and secondary windings of a transformer, such as the seventh As shown in the figure, the planar inductor is composed of a coil (300) with an appropriate number of turns. When a transformer is formed by using the foregoing coil (300), the coil (300) is interrupted at an appropriate number of turns. , And respectively constitute the primary winding (3 0 1) and the secondary winding (3 0 2), and draw wires at the ends of the primary winding (3 0 1) and the secondary winding (3 002) respectively. The head (3 0 3) (3 0 4) constitutes the secondary side and the secondary side of the transformer. Regarding the second preferred embodiment for manufacturing the planar transformer, the 9 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). ------ Line (please read the precautions on the back before filling this page) 4 3 2 4 1 2 V. Description of the invention (ί) The manufacturing process is the aforementioned planar inductor manufacturing method-"high-conductivity magnetic core layer" Production steps; 'It still includes: a "compression" step; a "drilling power ore" step; a "copper line" forming step and so on. However, the number of "press-fitting", "drilling plating", and "copper wiring steps have changed slightly."

/體而言,平面式變壓器之前段製程與前 以刖所不步騾完全相同; 弟五圖B 不同處在於平面式變壓器 π 益於別述步驟後重覆「壓八, 步驟,請參閱第八圖所示,主 坠'」 銅蝮路M \ 要係於剛述構造表、底面之 銅J路(17)外分別依序覆設有第二 如 及第二銅箔(i 4,)(如第 丄3 第八圖B所示)。("八圖A所示)並谢( 主 訂 「:合」步驟完成後,即進行「鑽孔 要係為連接前述的上下兩層銅落 艾驟 Λ J ^ 1 4 ),於前述壓合 元成的構造上進行鑽孔(如第八 ^ % ^ b所不)’隨後再於穿 _、二, 、丄0 )(如第八圖D所 , Ί c ^ { 1 4 )即透過該電 鑛銅(1 5 )構成電性連接。隨德i ^ %/ Γ 设丨道傻再繼續進行「銅線 路」形成步驟’使第二鋼箔4 . Ν 7,)。 J 4 ^丄4 )構成銅線路(;[ 該铜線路具體的形成步驟請參閱第九圖A所示,係於 前述透過電鑛而構成電性連接的兩層相對的第二銅猪(1 ___ 10 i紙張尺度適用t國國家標準(CNS)A4規‘⑵0 x 297公髮) 4 3 241 2In terms of physical structure, the process of the front stage of the planar transformer is exactly the same as the previous step; the fifth figure B is different from the planar transformer π. As shown in the eight pictures, the main pendant '' 'Copper cymbal road M \ should be tied to the structure table on the bottom and the copper J road (17) on the bottom surface, and the second copper foil and the second copper foil (i, 4) are sequentially covered. (As shown in Figure 丄 3, Figure 8B). (&Quot; As shown in Figure A) and thank you (After the main ": closing" step is completed, the "drilling should be performed to connect the two upper and lower layers of copper drop Ai ^ J ^ 1 4). Combined with the structure to drill holes (as the eighth ^% ^ b does not) 'and then to wear _, two, 丄 0) (as in the eighth figure D, Ί c ^ {1 4) through The electric ore copper (1 5) constitutes an electrical connection. As de ^% / Γ is set, the "copper line" forming step is continued to make the second steel foil 4. Ν7,). J 4 ^ 丄 4) constitutes a copper circuit (; [For specific formation steps of the copper circuit, please refer to FIG. 9A, as shown in FIG. 9A. It is a two-layer opposite second copper pig (1 ___ 10 i Paper size is applicable to National Standards (CNS) A4 regulations (⑵0 x 297) 4 3 241 2

經濟部智慧財產局員工消費合作杜印製 五、發明說明(7) 4 ‘)表面分別覆設以乾膜(丄6,),又乾膜(1 6 ‘)表面以曝光顯影方式轉移線路圖案;隨後再經過選擇 性钮刻去除線路圖案以外的銅箱(如第九_阶示),經 將未触刻乾膜(16,)完全去除後,即分別於兩上下相 對的第二絕緣層(13 ‘)表面形成銅線路(17,) (如第九圖c所示),而兩層相對的鋼線路(17 並 透過電鍍銅(1 5,)構成電性連接。 ^ 透過前述製程步驟,即分別構成同一鐵心的内側繞组 與外側繞組’而可作為變壓器之用。 另,如考慮到渦電流(eddy current)引發的熱穩定問 題,可將前述的鐵鎳鐵磁性金屬(i 〇 )分割成許多更薄 的層,並在各薄層間加入絕緣材料,如此一來,不僅可以 降低渴電流,同時也可以降低變壓器的發熱量。 經上述說明可看出,本發明分別用以製作平面式電感 及平面式變壓器的詳細步驟,以該等方法係利用高導磁率 的合金作為鐵心’而透過層狀構造令銅線路環繞著鐵心’ 藉以提高電流密度的平面式電感或變壓器,以該等設計無 須加寬線圈的線寬,即可達成提高電流密度之目的,同時 亦不受集膚效應所影響’故可提供一高效率、低成本之内 建式電感與變壓器,由此可見,本發明相較於既有的内建 式電感及變壓器已具備顯著功效增進,故已兼具產業上可 利用性與進步性’並符合發明專利要件,爰依法提起申 請。 11 本紙張尺度適用中關家標準(CNS)A4規格咖χ 297公楚) 1 I 1 - -- 1 1 - I - - - - - - - - « — — — — — — I— (請先閱讀背面之注意事項再填寫本頁)Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs on consumer cooperation Du V. Invention description (7) 4 ') The surface is covered with dry film (丄 6,), and the surface of dry film (1 6') is transferred to the circuit pattern by exposure and development ; Then, the copper box other than the circuit pattern is removed by selective button engraving (such as the ninth step). After the untouched dry film (16,) is completely removed, the second insulating layer is opposite to the upper and lower sides respectively. Copper wires (17,) are formed on the (13 ') surface (as shown in Fig. 9c), and two opposite steel wires (17) are electrically connected through copper plating (1 5,). ^ Through the foregoing process steps That is, the inner winding and the outer winding that constitute the same iron core can be used as transformers. In addition, if the thermal stability problem caused by eddy current is considered, the aforementioned iron-nickel-ferromagnetic metal (i 〇 ) Is divided into many thinner layers, and insulating materials are added between the thin layers. In this way, not only the thirst current can be reduced, but also the heat generation of the transformer can be reduced. As can be seen from the above description, the present invention is used to separate Making plane electric Induct the detailed steps of the planar transformer, using these methods to use a high-permeability alloy as the iron core, and through a layered structure to surround the copper line with the iron core, thereby increasing the current density of the planar inductor or transformer. It is not necessary to widen the line width of the coil to achieve the purpose of increasing the current density, and it is not affected by the skin effect. Therefore, a high-efficiency, low-cost built-in inductor and transformer can be provided. It can be seen that the present invention Compared with the existing built-in inductors and transformers, it has already achieved significant efficiency improvements, so it has both industrial availability and advancement, and meets the requirements of invention patents. It is submitted according to law. 11 This paper applies to Zhongguanjia. Standard (CNS) A4 size coffee x 297 male Chu 1 I 1--1 1-I--------«— — — — — — I— (Please read the notes on the back before filling in this page)

Claims (1)

經濟部智慧財產局員工消費合作社印製 Α8 Β8 C8 D8 六、申請專利範圍; .—— 1 一種内建印刷電路板式電感之製造方法,其包括 有: 、 -「南導磁鐵心層」製作步驟,係用以製把高導磁率 之鐵心夾層; -「壓合」步驟’係於前述鐵心爽層的表、底面處依 序設以不特定層數的絕緣層及銅箔並予壓合; 一 Γ鑽孔電鍍」步驟’係於壓合構造上進行鑽孔,並 於孔洞進行穿孔電鍍,以連接各層銅箔; 一「銅線路」形成步驟,係以製版術去除多餘銅箔, 於絕緣層上形成銅線路。 2 .如申請專利範圍第丄項所述内建印刷電路板式電 感之製造方法,該「高導磁鐵心層」步驟係於一高導磁率 的合金表底面,分別壓合乾膜,並作選擇性蝕刻後去除乾 膜,即於高導磁合金上形成若干穿孔,該穿孔適對應於各 層銅箔間之電鍍穿孔。 3 ’如申請專利範圍第1項所述内建印刷電路板式電 感之製造方法’該「壓合」步驟中的絕緣層係由樹脂構 成。 4 _如申請專利範圍第2或3項所述内建印刷電路板 式電感之製造方法,該銅箔、絕緣層及高導磁合金進行 「壓合」時,絕緣層之樹脂將填入高導磁合金的穿孔中。 5 ’如申請專利範圍第1、2或3項所述内建印刷電 路板式電感之製造方法,該高導磁合金係由鐵、鎳、鈷、 錳等鐵磁性金屬或其合金構成。 ]2 本紙張尺度適用令國國家#準(CNS) Α4規格(210><297公嫠) n n ^ 11 I (請先閲讀背面之注意事項再填寫本頁) A8 B8 C8 D8 申請專利範圍, 口 6如申请專利範圍第1項所述内建印刷電路板式電 感之製造方法’該「鑽孔電鍍」步驟係於壓合後的銅箔、 絕緣層及两導磁合金之構造上進行鑽孔,並進市穿孔電 鐘以便令上下兩層銅猪辑成電性連接。 、7如申請專利範圍第2或6項所述内建印刷電路板 ,電感之製造方法,該「鑽孔電鐘」之錢孔位置係對應於 雨導磁合金的穿孔處。 1 8如申請專利範圍第1項所述内建印刷電路板式電 感之製造方法,該「銅線路」形成步驟係於銅箔上壓上乾 膜,並透過曝光方式將線路圖案轉移至乾膜上,又進行選 擇性蝕刻去除多餘乾膜,最後去除線路圖案處的乾膜,即 完成銅線路。 9·一種棵據申請專利範圍第1項所述方法製造的内 建式平面變壓器,主要係令平面式電感之線圈於適當匝數 處中斷’而分別構成一次側繞組及二次側繞組。 10♦如申請專利範圍第9項所述之内建式平面變壓 器,該一次侧繞組與二次側繞組兩端分別拉出線頭,以構 成變壓器之一次側與二次側。 11.一種内建印刷電路板式變壓器之製造方法,其 包括有·· 一「尚導磁鐵心層」製作步驟,係用以製作高導罐率 之鐵心夾層; 一「壓合」步驟’係於前述鐵心夾層的表、底面處依 序設以不特定層數的絕緣層及銅箔並予壓合; 13 本紙張尺度適用中國國家禕率(CNS ) A4規格{ 2丨0X297公釐) ---------裝— (請先閱讀背面之注意事項再填寫本頁} 、δτ 經濟部智慧財產局員工消費合作社印製 4 3 24 A8 B8 C8 D8 六、申請專利範園, 一「鑽孔電鍍」步驟,係於壓合構造上進行鑽孔,並 於孔洞進行穿孔電鍍,以連接各層銅箔; 一「銅線路」形成步驟,係以製版術去除多,餘銅箔, 於絕緣層上形成銅線路; 重覆前述「壓合」步驟,於前述銅線路外侧分別依序 覆δ又第一絕緣層及第二銅箔,並予壓合; 重覆前述「鑽孔電鍍」步驟,係於前述壓合構造外層 處進行鑽孔,並於孔洞進行穿孔電鍍,以連接上下相對的 第二銅箔; 重覆「銅線路」形成步驟,係以製版術去除多餘銅 箔’於第二絕緣層上分別形成外層鋼線路。 1 2 .如申請專利範圍第1 1項所述内建印刷電路板 式變麼器之製填方法,該「高導磁鐵心層」步驟係於一高 導磁率的合金表底面分別壓合乾膜,並作選擇性蝕刻後去 除乾膜,即於鬲導磁合金上形成若干穿孔,該穿孔適對應 於各層銅箔間之電鍍穿孔。 1 3 .如申§青專利範圍第1 1項所述内建印刷電路板 式變壓器之製造方法,該「壓合」步驟中的絕緣層係由樹 脂構成。 1 4 ·如申清專利範圍第1 2或1 3項所述内建印刷 電路板式變壓器之製造方法’該銅箔、絕緣層及高導磁合 金進行壓合」時,絕緣層之樹脂將填入高導磁合金的穿 孔中。 1 5 _如申請專利範圍第χ χ、丄2或丄3項所述内 14 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 丁 經濟部智慧財產局員工消費合作社印製 A8 B3 C8 D8 申請專利範圍> 建印刷電路板式變壓n之製造方法,該高導磁合金係由 鐵、鎳、钻、猛等鐵磁性金屬或其合金構成。 1 6如申請專利範圍帛1 1項所述内以产刷電路板 式變壓器之製造方法,胃「鑽孔電鍍」步驟係於壓合後的 銅箔、絕緣層及尚導磁合金之構造上進行鑽孔’並進行穿 孔電鍍,以便令上下相對的兩層銅箔構成電性連接。 1 7 .如申請專利範圍第χ 2或丄6項所述内建印刷 電路板式變壓器之製造方法,該r鑽孔電鍍」之鑽孔位置 係對應於高導磁合金的穿孔處。 1 8 .如申請專利範圍第χ χ項所述内建印刷電路板 式變壓器之製造方法,該「銅線路」形成步驟係於銅箔上 壓上乾膜,並透過曝光方式將線路圖案轉移至乾膜上,又 進行選擇性蝕刻去除多餘乾膜,最後去除線路圖案處的乾 膜,即完成銅線路。 ---------裝一 訂. ^ (請先閲讀背面之注^^項再填寫本頁> 經濟部智慧財產局員工消費合作社印K 15 表紙張尺度適用中國國家揉準(CNS ) 210X29?公釐)Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, A8, B8, C8, D8 VI. Application scope of patents;. —— 1 A method for manufacturing a built-in printed circuit board inductor, which includes: It is used to make a high-permeability core sandwich;-The "compression step" is to place an insulating layer and a copper foil with an unspecified number of layers on the surface and bottom surface of the core core layer and press them together; A Γ drilling plating step is to drill holes on the laminated structure and perform perforation plating on the holes to connect the various layers of copper foil. A "copper line" forming step is to remove excess copper foil by platemaking and insulate Copper lines are formed on the layers. 2. According to the method for manufacturing a built-in printed circuit board inductor as described in item 丄 of the scope of the patent application, the "high-permeability magnetic core layer" step is on the bottom surface of a high-permeability alloy surface, and a dry film is pressed and selected separately. After the dry etching, the dry film is removed, that is, a number of perforations are formed on the high-permeability alloy, and the perforations are suitable for the electroplating perforations between the copper foil layers. 3'The method of manufacturing a built-in printed circuit board inductor as described in item 1 of the scope of patent application 'The insulating layer in the "press-bonding" step is made of resin. 4 _ As described in the method for manufacturing a built-in printed circuit board inductor as described in item 2 or 3 of the scope of patent application, when the copper foil, insulation layer and high-permeability alloy are "press-bonded", the resin of the insulation layer will be filled in the high-conductivity Perforation of magnetic alloy. 5 'As described in the method for manufacturing a built-in printed circuit board inductor as described in item 1, 2, or 3 of the patent application scope, the high magnetic permeability alloy is composed of a ferromagnetic metal such as iron, nickel, cobalt, manganese, or an alloy thereof. ] 2 This paper size is applicable to the national standard #CNS (A4) specification (210 > < 297 gong) nn ^ 11 I (Please read the precautions on the back before filling this page) A8 B8 C8 D8 Patent application scope, Port 6: The manufacturing method of the built-in printed circuit board inductor as described in item 1 of the scope of the patent application. The "drilling plating" step is to drill holes on the structure of the laminated copper foil, insulation layer and two magnetically permeable alloys. , And enter the city's perforated electric clock in order to make the two layers of copper pigs electrically connected. 7, 7 According to the built-in printed circuit board and the manufacturing method of the inductor described in item 2 or 6 of the scope of the patent application, the position of the money hole of the "drilling electric clock" corresponds to the perforation of the rain magnetic alloy. 18 According to the manufacturing method of the built-in printed circuit board inductor described in item 1 of the scope of the patent application, the "copper circuit" forming step is to press a dry film on the copper foil, and transfer the circuit pattern to the dry film by exposure. Then, selective etching is performed to remove the excess dry film, and finally the dry film at the circuit pattern is removed to complete the copper circuit. 9. A built-in planar transformer manufactured according to the method described in item 1 of the scope of the patent application, which mainly interrupts the coil of the planar inductor at an appropriate number of turns' to form a primary winding and a secondary winding, respectively. 10 ♦ According to the built-in planar transformer described in item 9 of the scope of the patent application, the ends of the primary winding and the secondary winding are respectively drawn out to form the primary and secondary sides of the transformer. 11. A method for manufacturing a built-in printed circuit board transformer, comprising: a "still-conducting magnetic core layer" manufacturing step, which is used to make a high-conductivity can core sandwich; a "compression step" is based on The surface and bottom surface of the aforementioned core sandwich are sequentially provided with an insulating layer and copper foil of an unspecified number of layers and laminated; 13 This paper size is applicable to the Chinese National Standard (CNS) A4 specification {2 丨 0X297 mm)- ------- Installation— (Please read the precautions on the back before filling out this page} 、 δτ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 3 24 A8 B8 C8 D8 The step of "drilling and plating" is to drill holes on the laminated structure and perform perforation and plating on the holes to connect the various layers of copper foil. A "copper circuit" forming step is to remove a large number of copper foils by plate-making technology. A copper circuit is formed on the layer; repeat the aforementioned "compression bonding" step, and sequentially cover δ, a first insulating layer and a second copper foil on the outside of the aforementioned copper circuit, respectively, and press-bond; repeat the aforementioned "drilling plating" step , Attached to the outer layer of the aforementioned laminated structure Drill holes, and perform perforation plating on the holes to connect the second copper foil opposite to each other. Repeat the "copper circuit" formation step to remove the extra copper foil by plate-making. 'Each outer steel circuit is formed on the second insulation layer. 1 2. According to the filling method of the built-in printed circuit board type transformer described in item 11 of the scope of the patent application, the step of "high-permeability magnetic core layer" is based on the high-permeability alloy surface and the bottom surface of the alloy are respectively pressed and dried. After the selective etching, the dry film is removed, that is, a number of perforations are formed on the magnetically permeable alloy, and the perforations are suitable for the electroplated perforations between the copper foils of various layers. The manufacturing method of the built-in printed circuit board transformer is described, and the insulating layer in the "press-fitting" step is made of resin. 1 4 · As described in Item No. 12 or 13 of the scope of patent application, Manufacturing method 'When the copper foil, insulating layer and high-permeability alloy are laminated,' the resin of the insulating layer will be filled in the perforations of the high-permeability alloy. 1 5 _If the scope of the patent application is χ χ, 丄 2 or 丄14 papers in 3 items Standards are applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) (please read the precautions on the back before filling this page) Ding Intellectual Property Bureau, Ministry of Economic Affairs, Employee Consumption Cooperative Printed A8 B3 C8 D8 Patent Scope > Construction Printing A method for manufacturing a circuit board type transformer n, the highly magnetically permeable alloy is composed of ferromagnetic metals such as iron, nickel, drill, and fierce, or alloys thereof. 16 According to the scope of the patent application 帛 11, the circuit board type can be produced. Transformer manufacturing method, the stomach "drilling plating" step is to drill holes on the structure of the laminated copper foil, insulation layer and magnetically permeable alloy, and perform perforation plating, so that the two layers of copper foil opposite to each other constitute Electrical connection. 17. According to the manufacturing method of the built-in printed circuit board transformer described in item 2 or item 6 of the scope of the patent application, the drilling position of the r-drilling plating corresponds to the perforation of the high-permeability alloy. 18. According to the manufacturing method of the built-in printed circuit board transformer described in item χ χ in the scope of the patent application, the "copper circuit" forming step is to press a dry film on the copper foil, and transfer the circuit pattern to dry by exposure. On the film, selective etching is performed to remove the excess dry film, and finally the dry film at the circuit pattern is removed to complete the copper circuit. --------- Binding. ^ (Please read the note ^^ on the back before filling out this page > K 15 printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. CNS) 210X29? Mm)
TW88119817A 1999-11-15 1999-11-15 Method for fabricating built-in printed circuit board inductor and transformer TW432412B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88119817A TW432412B (en) 1999-11-15 1999-11-15 Method for fabricating built-in printed circuit board inductor and transformer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88119817A TW432412B (en) 1999-11-15 1999-11-15 Method for fabricating built-in printed circuit board inductor and transformer

Publications (1)

Publication Number Publication Date
TW432412B true TW432412B (en) 2001-05-01

Family

ID=21643023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88119817A TW432412B (en) 1999-11-15 1999-11-15 Method for fabricating built-in printed circuit board inductor and transformer

Country Status (1)

Country Link
TW (1) TW432412B (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6674355B2 (en) 2000-05-19 2004-01-06 M-Flex Multi-Fineline Electronix, Inc. Slot core transformers
US6820321B2 (en) 2000-09-22 2004-11-23 M-Flex Multi-Fineline Electronix, Inc. Method of making electronic transformer/inductor devices
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7271697B2 (en) 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
CN103714963A (en) * 2013-12-27 2014-04-09 陕西烽火电子股份有限公司 Method for designing inductor through printed circuit board
US9363902B2 (en) 2012-05-03 2016-06-07 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
CN106163107A (en) * 2015-04-09 2016-11-23 中国科学院金属研究所 Micro-induction structure on a kind of pcb board based on ferrum ni-based amorphous alloy magnetic core
TWI763499B (en) * 2021-05-24 2022-05-01 大陸商宏啟勝精密電子(秦皇島)有限公司 Circuit board and its manufacturing method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7477124B2 (en) 2000-05-19 2009-01-13 Multi-Fineline Electronix, Inc. Method of making slotted core inductors and transformers
US6796017B2 (en) 2000-05-19 2004-09-28 M-Flex Multi-Fineline Electronix, Inc. Slot core transformers
US6674355B2 (en) 2000-05-19 2004-01-06 M-Flex Multi-Fineline Electronix, Inc. Slot core transformers
US7178220B2 (en) 2000-05-19 2007-02-20 Multi-Fineline Electronix, Inc. Method of making slotted core inductors and transformers
US6820321B2 (en) 2000-09-22 2004-11-23 M-Flex Multi-Fineline Electronix, Inc. Method of making electronic transformer/inductor devices
US7277002B2 (en) 2002-09-16 2007-10-02 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7696852B1 (en) 2002-09-16 2010-04-13 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7271697B2 (en) 2004-12-07 2007-09-18 Multi-Fineline Electronix Miniature circuitry and inductive components and methods for manufacturing same
US7602272B2 (en) 2004-12-07 2009-10-13 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7656263B2 (en) 2004-12-07 2010-02-02 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7690110B2 (en) 2004-12-07 2010-04-06 Multi-Fineline Electronix, Inc. Methods for manufacturing miniature circuitry and inductive components
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
US9363902B2 (en) 2012-05-03 2016-06-07 Qualcomm Mems Technologies, Inc. Three-dimensional multilayer solenoid transformer
CN103714963A (en) * 2013-12-27 2014-04-09 陕西烽火电子股份有限公司 Method for designing inductor through printed circuit board
CN103714963B (en) * 2013-12-27 2016-06-15 陕西烽火电子股份有限公司 The method designing inducer with printed board
CN106163107A (en) * 2015-04-09 2016-11-23 中国科学院金属研究所 Micro-induction structure on a kind of pcb board based on ferrum ni-based amorphous alloy magnetic core
CN106163107B (en) * 2015-04-09 2018-10-26 中国科学院金属研究所 Micro- induction structure on a kind of pcb board based on iron-nickel-based amorphous alloy magnetic core
TWI763499B (en) * 2021-05-24 2022-05-01 大陸商宏啟勝精密電子(秦皇島)有限公司 Circuit board and its manufacturing method

Similar Documents

Publication Publication Date Title
TW301004B (en)
JP3772778B2 (en) Antenna coil, identification tag using the same, reader / writer device, reader device and writer device
US8941457B2 (en) Miniature power inductor and methods of manufacture
US6820321B2 (en) Method of making electronic transformer/inductor devices
JP6361082B2 (en) Coil component and manufacturing method thereof
TW554354B (en) Multilayer inductor
TW432412B (en) Method for fabricating built-in printed circuit board inductor and transformer
JP2002319508A (en) Laminated impedance element
KR102016490B1 (en) Coil Component
US20090128258A1 (en) EMI filter with an integrated structure of common-mode inductors and differential-mode capacitors realized by flexible printed circuit board
JP2011054672A (en) Electric magnetic element, and method for manufacturing the same
JP7306219B2 (en) Inductor array components and substrates with built-in inductor array components
JP3545701B2 (en) Common mode choke
JP5126338B2 (en) Transformer parts
JP2019520714A (en) Electromagnetic induction device and method of manufacturing the same
JP2003188023A (en) Electronic circuit module
US20020002771A1 (en) Method for making a planar inductor/transformer in a laminated printed circuit board
JP2003272929A (en) Plane transformer, multilayer substrate, and switching power supply device
CN101587769A (en) Magnetic element
JP2008205350A (en) Magnetic device
TW436822B (en) Planar-circuit plate type inductor, transformer and the fabricating method of the same
KR20010114120A (en) PCB Inductor and Transformer using the PCB Inductor
TW432406B (en) Fabricating method of printed circuit board inductor
KR100733279B1 (en) Method of fabricating printed circuit board with embedded inductor
JP2970303B2 (en) Print coil type transformer

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees