CN1261753C - 电子变压器/电感器器件及其制造方法 - Google Patents
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Abstract
本发明涉及优选由铁磁材料构成电感元件的方法，如用作制造PCB或FLEX的集成部分的电感器、扼流器和变压器。在一个优选实施例中，贯穿铁磁基底(50)形成孔(56，58)并用导电材料镀覆。这些孔的设置以及后面的设计将在其中形成该器件的介质平面内形成电感元件；该基底(50)用于磁芯(90)。通过采用这种方案，电感元件可以最小化到与用于集成电路(IC)的现代表面安装技术(SMT)的需求相容的物理尺寸。这种工艺还允许这些元件采用大批量生产技术制造，由此避免在制造工艺期间需要操纵单个器件。在另一优选实施例中，在基底(330)上刻蚀一系列薄的、同心的高导磁率的环(315)，以便提供具有最小涡流效应的高导磁率变压器和电感器。
Description
发明领域
本发明涉及电感元件及这些部件的制造方法。
发明背景
电感元件通常是采用铁磁芯和绝缘电线的线圈制造的。铁磁芯通常是环形芯、棒状芯、或由E下部形状的铁磁部分和连接E的三个腿的铁磁帽构成的组件，如图1所示。
环形和棒状芯被绝缘铜线手动或自动缠绕，形成变压器的大量多匝线圈或电感器的单线圈。然后通常将该组件封装以保护铜线。电路接点按照应用需要而通过电线的焊接端形成。这个方案由于操作单个部件而具有高的劳动力成本。还有电子参数的很大的可变性，如漏电感、分布和绕组间电容、和由于很难实现铜线的准确定位而造成的线圈之间的共态失衡。
图1的E形和包封盖组件按照需要通过围绕E的腿手动或自动缠绕铜绝缘线制成为电感元件。在原位粘接或夹住帽并最后封状完成这个子组件。同样，电路接点借助电线的焊接端按照应用的需要而制成。不仅这种器件具有环形和棒状芯的限制，如上所述，而且一般是体积较大的器件。由于帽是分离器件，因此磁通路具有在E和帽之间的非铁磁间隙电阻，因而减小了变压器的效率。
如图所示构成的功率变压器还具有以下缺点：由线圈中的电阻损失产生的热量不容易散去，因为E芯和帽将这些线圈和散热片分隔开了。
发明概述
本发明的优选实施例提供电感器和变压器以及制造这些器件的方法，本发明提供了优于现有技术状态的显著优点。根据本发明连接的这些电感器和变压器在电子、无线电通信和计算机领域具有大量应用。在下述一个优选实施例中，矩形铁磁材料片被封闭在印制电路之间。在制造期间从片的顶面到片的底面钻成或形成多个穿孔(通路)，孔的数量对应所希望的绕线的匝数。本实施例利用安培定律以非常新颖的方式在电路板内形成变压器、电感器等而不是采用或组装与电路板分立的电感器件。这样，绕线不是绝缘的电线。而且，穿过片的孔通过孔镀或类似技术而获得电导性并与封装该片的印制电路电连接。镀覆穿孔的图形和印制电路形成电感器和变压器绕线，并且电感器和变压器的芯是被钻孔或形成的铁磁材料片。这个实施例提供相当大的改进，特别是在制造高频电感器和变压器时。
在下述另一优选实施例中，电感器或变压器的芯包括由支撑在合适基底如柔性电路(FLEX)或印制电路板(PCB)上的薄同心铁磁金属环的多层系列形成。靠近这些同心环芯的穿孔提供与印制电路的电连接以提供电感器和变压器绕线。这个实施例使得可以制造具有最小涡流效应的高导磁率电感器和变压器。如此构成的电感器和变压器在微小低频电源供应方面有特殊应用。
除了上述优点之外，优选实施例具有大量附加的显著优点。这些优点包括：优异的散热性能，更易实现的外部连接以简化电连接，较短的磁通路径以提高磁性能，更简单的制造，更高度集成的互连，较小的电感器件，良好的性能和优异的可重复制造性。
附图简要说明
总之，通过参照附图的详细说明，对于本领域普通技术人员来说很容易理解本发明的一般原理和基本特征以及优点、某些优选实施例及其改型，其中：
图1是具有匹配铁磁帽的现有技术铁磁E芯的概念性的示意图；
图2A是传统环形变压器的顶视图；
图2B是传统变压器的侧视图；
图3A是表示“虚拟”环形变压器的顶视图；
图3B是图3的虚拟变压器的侧视图；
图4表示虚拟变压器的另一优选实施例的顶视图；
图5表示层叠到FLEX的大面片上的70个磁芯阵列的示意图，其中为显示单个磁芯而除去了顶部FLEX层；
图6是表示层叠到单个磁芯片的顶部和底部FLEX的放大侧视图；
图7表示单个片中的一个穿孔的剖面图；
图8表示具有安装了25个芯的25个孔的阵列的PCB胶片(prepreg)的例子；
图9是表示层叠到磁芯的顶部和底部PCB的单个磁芯的放大的侧视图；
图10表示单个铁磁片中的一个穿孔的放大剖面图；
图11是用丝网印刷导电膏填充的穿孔的放大剖面图；
图12表示通过提高的表面积与体积比的本发明的散热特性；
图13是显示了一个金属环形芯，其说明其中涡流的产生方式；
图14表示通过刻蚀铁磁金属的同心环而形成的多个磁芯叠层；
图15是图14的磁芯叠层之一的放大示意图；
图16A是表示多个堆叠磁芯叠层的剖面图；
图16B是图16A的磁芯叠置体之一的放大示意图；
图17A是表示在已经添加顶部和底部印制电路之后的图16A的叠置体的剖面图；
图17B是图17A的磁芯叠置体之一的放大示意图；
图18A是图17A中的层叠结构在钻成镀覆穿孔之后的剖面图；和
图18B是图18A的磁芯叠置体之一的放大图。
优选实施例的详细说明
图2表示具有环形磁芯30的现有技术的典型变压器。为简化起见，这个变压器具有两个绝缘线绕线：两匝绕线32和四匝绕线34。每匝36环绕磁芯30的材料，以便当电流通过一个绕线时，在磁芯30内部流动环形磁通路38。图2A表示通过磁芯30的中心并围绕磁芯30的外部的绕线32、34。
本发明的优选实施例具有非常不同的磁芯和绕线设置。在这些优选实施例的一个中，通常示于图3中，铁磁材料片50具有顶表面52和底表面54，并以剖面图示出，两个外孔(穿孔)56和在片50内的一个内孔64。如下所述，对于微型电感器和变压器，片50有利地是具有相对高电阻率的铁氧体薄层。
图3A和3B表示根据本发明的一个优选实施例采用具有8个外穿孔56和6个内穿孔68(图3B中没有都示出)的片50构成的“虚拟”环形变压器。导体58形成在片的顶表面52和底表面54上。导体具有用于连接到其它器件或电路的焊盘60。如下所述，这些外穿孔和内穿孔56、68从顶部到底部镀覆而成并与导体58电接触，以便完成的电路在例如焊盘60和60’之间延伸。如下所述，由此形成具有环形通路62的虚拟环形变压器62。
图4表示具有位于同一片70上的两个独立虚拟磁芯72、74的铁磁片70。第二变压器74说明本发明的另一实施例，其中穿孔重新设置为特殊图形。这个重新设置形成具有内矩形76和外矩形77的矩形虚拟环75。
如图2所示的绕线32、34借助磁芯30感应耦合在一起。磁芯30提供将第一绕线32耦合到第二绕线34的磁通路，由此当在第一绕线上存在电压时在第二绕线上产生电压。这是变压器的基本原理，从一个绕线向另一绕线转换能量。磁通的主要部分被限制在磁芯的内径40和外径42之间。
安培定律限制磁通路而与磁芯的形状无关；因此，如下面详细所述，不必实际上制造环的环形形状以构成同样运行的器件。
作为FLEX部件的制造
一种制造方法是在FLEX92电路的顶和底层内部埋置多个铁磁片(磁芯90)，如图5，6和7所示。在通过粘接剂粘接到片的顶表面和底表面112、114的环氧树脂板110上形成对应所需绕线的铜电路图形92。由此通过层叠工艺将磁芯90包含在电路92中。通过FLEX92的复合层和磁芯形成穿孔，以便形成顶部FLEX116电路到底部FLEX117电路的连接，如图6和7所示。用导电墨水和标准工业镀覆工艺填充穿孔是用于同时连接大量虚拟磁芯的最佳方法。这个结构的剖面图示于图6和7中。
作为PCB部件的的制造
示于图8，9和10中的另一制造方法是在PCB电路的顶层170和底层172之间埋置多个铁磁片150。图8表示PCB粘接剂中的孔阵列154或胶片阵列156。这个胶片156面盘形成得能容纳每个磁芯片150。如图9所示，将片150插入孔154中之后，PCB的顶部170和底部172层叠到阵列156上。由此通过层叠工艺包含片150，在两个环氧树脂板之间夹住片150。穿孔190通过PCB192的复合层和片150而形成，并形成顶部PCB194和底部PCB196电路之间的连接。用导电墨水198或标准工业镀覆工艺填充的穿孔190有利地用于同时连接大量磁芯。这种结构的剖面类似于图6和7中所示的FLEX117结构。主要差别是由于PCB材料的非柔性造成的，这不符合单个片150。
没有FLEX或PCB的制造
图11中示出了另一种制造方法，其中多个磁芯210保持在载体212上。每个磁芯210用合适的孔214模制而成。然后采用标准工业导电墨水丝网印刷工艺以在磁芯210的底部215和底部216上形成电路，同时填充孔214，在顶部215和底部216两侧之间形成所需连接。
安培定律的新应用
具有通过磁片的导电穿孔的上述本发明实施例以非常新颖的方式利用安培定律。形成穿孔的方式允许形成在基底上的两个绕线之间存在磁通路。这样，如图3A所示，在内穿孔68内的任何封闭路径将包围零净电流，因此这种路径没有磁通。包围外穿孔56的任何路径也包围零净电流，因为内穿孔68具有与外穿孔56中流动的电流相等但相反的电流，因而在包围外穿孔56的区域中产生零净磁通。然而，内穿孔和外穿孔68、56之间的封闭路径由于内穿孔68的封闭而具有净磁通。部分地封闭内穿孔或外穿孔68、56的别的路径将不具有显著的磁通，因为磁通将选择最短物理路径，与电流相同。这样，这种结构的行为与图2的环相同，并且作为虚拟环62示出。
很显然穿孔的合适选择可以形成很多不同形状的磁芯和在基底上的磁芯设置。这样，将在同一基底上构成很多独立的磁电路。因此，通过在图3所示的铁磁片50的顶表面和底表面52、54上适当设置穿孔和电路导体，可以构成比简单电感器和变压器更复杂的电路。例如，采用在常规PCB和FLEX(柔性电路板)工业中使用的工艺(光学淀积、刻蚀和镀覆)可以在同一基底上设置多个元件如电阻器、电容器和集成电路，以便形成微观小型电路组件。
可以根据前述实施例构成的电感器和变压器适用于高频电路，通常是在100KHz到100MHz范围内的射频电路。有利的是铁磁片50由薄层铁氧体材料形成，该材料具有在100-10000范围内的典型导磁率和在1000欧姆/cm-109欧姆/cm的电阻率。典型的铁氧体成分包括氧化铁和磁钢。这种铁氧体材料具有足够高的电阻率以致通过磁片的镀覆穿孔互相绝缘。如此构成的变压器和电感器适于微型化。它们不再需要复杂的管脚或引线框架。这样，一个长1.5英寸、宽1英寸和厚0.05英寸并具有直径为0.03英寸穿孔的片可提供用于两个或更多个变压器的磁芯。铁磁片可以非常小。顶表面和底表面上的表面焊盘形成接点，并且可以是直接安装到PCB上，由此减少了器件的着脚点(footprint)并给其它元件留下更多的空间。设计的绕线基本上处于两个平行平面内。因此通常使用的十(10)层平面变压器件的绕线可以在总高度上减少五(5)倍。铁磁片可以非常薄，例如0.05英寸，因此本发明的电感器和变压器可以基本上在一个非常薄的平面内构成而不是三维E磁芯结构，这又进一步大大减少了总高度。
具有高磁通密度和最小涡流的变压器/电感器器件的进一步优选实施例
很多电感器件如低频功率变压器需要具有通常在10000-100000范围内的相对高的相对导磁率的磁芯。然而，由优选实施例提供的改进可用于更低和更高值，例如1000-1000000范围内。某些金属和金属合金提供这些高磁通密度，包括钢、铁、硅钢(silica Iron)、78导磁合金(permalloy)、阿姆科铁(Mumetal)、精炼铁和超导磁合金(supermalloy)。虽然这些高磁通密度在构成变压器和电感器上可提供显著的优点，但是金属的低电阻率允许感应涡流流动，这抵消了较高磁通密度的优点。由在金属磁芯中流动的磁通产生的感应涡流300示于图13中。通过在层叠金属E条外部构成环形或E形磁芯，并且每个条由某种类型的绝缘粘合材料分离，减少了目前用金属作磁芯的变压器/电感器的这些涡流。整个E芯包含很多这种条以形成整个磁芯。借助这种结构，将涡流限制到每个条的横截面区域。如上所述，本发明的明显优点是进一步减少了磁芯截面面积。
采用铁磁金属用于磁芯材料的本发明的一个实施例的制造示于图14-18中，其中柔性电路或印制电路板290支撑形成在FLEX或PCB上并由绝缘层分开的一系列层叠薄金属圆环。圆环的中心和外部的镀覆穿孔和镀覆完成围绕磁芯的电气绕线。如下所述，通过显著减小每个叠层磁芯截面的横截面面积，这个实施例显著地最小化了涡流。
通过首先在PCB或FLEX290上层叠铁磁金属片，然后刻蚀掉部分铁磁片以形成多个紧密排列的、窄的连续磁芯段的图形，形成多个磁芯叠层。这样，图14示出了具有16个被刻蚀磁芯阵列的PCB或FLEX310的单个层。应该理解本领域中公知的层叠和刻蚀工艺一般允许制造16个以上的这种阵列，这取决于阵列和图形的尺寸。有利地，采用公知的双面工艺刻蚀磁芯阵列315，以便在片310的顶部和底部形成相同的阵列。
单个磁芯阵列315的放大图示于图15中，该图示出了具有16个同心铁磁导电金属环320a-320p的阵列，这些金属环通过各个被刻蚀的间隔或空隙325a-325o而互相绝缘。同样，阵列315外部的区域330和最内部环320内部的区域335没有磁性材料。然而，本发明不限于同心环阵列，对于本领域技术人员来说很显然可以构成其它磁芯阵列，如互相绝缘的一系列连续更大的正方形或矩形形状。
下一制造步骤是将多个PCB和FLEX层310基本上对准地与阵列315堆叠起来。如图16A中所示，同心环315a-315h的磁芯阵列安装每层上的磁芯图形对准的方式一个一个堆叠在一起。结果是制造了具有非常小的涡流面积的多个高磁通承载金属磁芯。这样，用于刻蚀阵列315的原片可以是非常薄的，通常在0.0005”到0.010”英寸范围内。可以采用传统的PCB或FLEX(FPC)刻蚀技术将同心环刻蚀到在0.002”-0.003”量级上的非常窄的宽度。结果是，关于磁芯的横截面涡流产生的区域，大大减小了尺寸。
作为部分堆叠工艺，薄层绝缘材料340与每个被刻蚀同心环阵列315的顶表面相邻设置。通常，采用环氧树脂材料。这种绝缘片和支撑被刻蚀铁磁环的绝缘片可以是不同材料的。代表性材料包括由Dupont和Rogers Corp制造的用于制造PCB板和FLEX的环氧树脂和丙烯酸(acrylics)。环氧树脂和胶片(具有玻璃的环氧树脂)一般用于构成PCB板，丙烯酸一般用于制造FLEX。在层叠工艺期间，图15中所示的间隙325、间隙330和间隙335用绝缘材料340填充，如图18A和18B所示。
如上所述，通过与磁芯结构两侧上与印制电路接触的导电穿孔，有利地提供本发明的优选实施例电气绕线。用于图14-18的实施例的绕线的制造步骤示于图17A、17B、18A和18B中。
参见图17A和17B，附加铜层350、355分别层叠在顶表面和底表面上，而两个附加绝缘层360、365将铜表面与被刻蚀金属表面分开。
图18A和18B中示出了具有通过整个层叠阵列钻成的穿孔370的完成结构。这些穿孔位于低电阻率铁磁环附近但不与其接触，以便电绝缘由镀覆穿孔提供的绕线匝。然后用导电材料、(通常为铜)镀覆这些孔370。也可以采用在穿孔内的导电墨水和导电膏。然后刻蚀铜层350、355以便形成与镀覆穿孔370电接触的电路图形，用于形成围绕同心环磁芯阵列315的绕线。
为了清楚示出，图18A和18B中所示的实施例表示每个变压器的少量穿孔370a，370b，370c，和370d。对于本领域普通技术人员来说很显然图14-18的实施例可以通过添加附加穿孔而具有多个绕线。如果需要，附加铜层可以叠置在层350、355上以提供到附加穿孔的所需连接。
可通过“冲模”(die)切割或从阵列选择部件的常用方法从图18A和18B中的层叠阵列中抽取单个变压器和电感器器件。每个这种器件可用于替代图1-13中所示的传统电感器件。而且，由于刻蚀金属磁芯是阵列的一部分，如图16中所示，因此可以互连到其它元件。
优选实施例的优点
一片磁芯：
在E形磁芯结构中，如图1所示，不可避免地在E形磁芯和帽之间形成间隙。大多数变压器采用要求采用例如环氧树脂和夹子将一半磁芯连接到其它磁芯上的E型磁芯。这些工艺是耗时的、造成损失和由于E形磁芯和帽之间形成的间隙而使器件参数变化。相比较而言，本发明的优选实施例的磁芯是连续片的，由此提供改进的变压器效率。一片设计不再需要在分离处理步骤中将两个分立片连接在一起。
如果希望在图14-18的实施例中有意形成间隙以避免磁饱和，可以在图15中所示的同心环中刻蚀形成间隔。这种被刻蚀间隙环消除了E形芯的传统机械分隔的大变化。
减少了涡流：
按照图14-18的方式构成的电感器和变压器通过在两个方向分隔金属叠层可提供具有很少涡流的优异性能。产生这个结果是因为所示优选实施例借助(a)由其刻蚀环320的金属片可以是比采用PCB或FLEX制造材料更薄(b)单个绝缘环320可以制成为非常窄而具有比传统层叠磁芯薄的磁芯。由于涡流与段的横截面面积的平方成正比，因此与制造变压器或电感器的传统方法相比优选实施例显著地减少了涡流。例如，参照图1中所示的传统E形磁芯，这种磁芯的金属叠层不能在两个方向分开，因为条会散开或简单地说不具有机械整体性。
表面安装：
根据本发明优选实施例形成的绕线可以在不需要分开的引线框架结构、复杂管脚或最终镀覆的情况下形成为表面安装引线。
互连：
由于刻蚀变压器/电感器是采用与制造PCB或FPC的相同工艺制造的，因此变压器可以有利地成为电源或电路组件的集成部件，由此减小物理尺寸，减少接点，和通常使组件更紧凑和更小。电路元件可以直接设置在被刻蚀变压器的上面或下面，用变压器的区域作为用于平衡电路的载体，以便整个电路的面积将与变压器面积一样小。
磁性噪声：
根据优选实施例构成的磁芯提供具有损失比传统变压器少的更有效的磁通路径。这些特性在设计和功能上更类似于环。磁通路径短于采用传统磁芯如E-磁芯和PQ磁芯的可比变压器。
尺寸：
优选实施例可以做得更小，因为它们不需要复杂的管脚或引线框架。顶表面和底表面上的表面焊盘形成它们自己的接点，并且它们可以直接表面安装到PCB上，由此减少器件着脚点和给其它元件留出更多的空间。绕线处于2个平面内，因此通常使用的十(10)层平面变压器器件的绕线可在总高度上减少五(5)倍。“磁芯”处于一个平面内代替三维E形磁芯结构，进一步大大减少了总高度。
成本：
优选实施例可以由柔性电路制成并可以比多层平面绕线更便宜地制造。而且不再需要引线框架、封装、和帽粘接，由此使器件更容易制造。
散热性能：
根据本发明优选实施例构成的电感器和变压器的显著优点是产热绕线不埋置在组件内或互相缠绕在每个绕线的顶部，如传统变压器那样，而且它们不需要像平面变压器那样叠置在一起。代替地，镀覆绕线基本上位于变压器或电感器器件的顶面和底面。这种布置提供优异的散热性能而不会将热量收集掩埋在绕线内。只通过通常只有0.005英寸厚的薄焊接掩膜，将绕线的一半放置成与散热片热接触，可以将PCB有利地固定到散热片上，由此提供优异的表面面积与热量比。图12示出了用于优异散热性能的安装到如铜和铝的散热片232上的大表面面积230的一个例子。
前面已经参照一些优选实施例介绍了本发明，这些实施例仅是借助例子提供的，并不限制本发明的范围。因而，本发明的范围应该只根据所附权利要求书界定。
Claims (14)
1.一种小型电感器/变压器，其包括：
一个铁磁材料层；以及
通过所述铁磁材料的多个导电穿孔，所述穿孔提供了所述电感器/变压器的电线圈，所述穿孔中的一些相对于其他的外部穿孔处于内部位置，并被布置成在使用时在所述内部和外部穿孔之间提供封闭的磁通路，从而在所述铁磁材料中形成磁芯。
2.根据权利要求1所述的小型电感器/变压器，进一步包括顶部和底部导体，相对于所述铁磁材料层；所述导体与所述穿孔电接触，且所述顶部导体与内部和外部穿孔的顶部的相应组相连，从而基本上在两个平行平面内形成所述线圈。
3.根据权利要求1或2所述的小型电感器/变压器，其中所述内部和外部穿孔被布置成形成一个具有环形磁通路的封蔽式磁芯(torroid)。
4.根据权利要求1或2所述的小型电感器/变压器，其中所述内部和外部穿孔被布置成形成一个矩形磁通路。
5.根据权利要求1或2所述的小型电感器/变压器，其中所述铁磁材料层包括一个铁氧体材料薄层。
6.根据权利要求5所述的小型电感器/变压器，其中所述铁氧体材料的导磁率为100-10000，电阻率为1000欧姆/cm-109欧姆/cm。
7.根据权利要求1或2所述的小型电感器/变压器，进一步包括多层FLEX电路，所述铁磁材料层被层叠在其间。
8.根据权利要求1或2所述的小型电感器/变压器，进一步包括多层PCB电路，所述铁磁材料层被层叠在其间。
9.一种用于制造权利要求1所述小型电感器/变压器的方法，其包括：
在顶部和底部层之间一个由多个铁磁片构成的叠层；
在所述顶部和底部层上形成导体；
形成多个与所述导体电连接的并通过所述铁磁材料的导电穿孔，所述穿孔提供了所述电感器/变压器的电线圈，所述穿孔中的一些相对于其他的外部穿孔处于内部位置，并被布置成在使用时在所述内部和外部穿孔之间提供封闭的磁通路，从而在所述铁磁材料中形成磁芯。
10.根据权利要求9所述的方法，其中所述顶部和底部导体与内部和外部穿孔的顶部的相应组相连，从而基本上在两个平行平面内形成所述线圈。
11.根据权利要求9或10所述的方法，其中所述内部和外部穿孔被布置成形成一个具有环形磁通路的封蔽式磁芯(torroid)。
12.根据权利要求9或10所述的方法，其中所述内部和外部穿孔被布置成形成一个矩形磁通路。
13.根据权利要求9或10所述的方法，其中所述顶部和底部层包括多个FLEX电路。
14.根据权利要求9或10所述的方法，其中所述顶部和底部层包括多个PCB电路。
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| Application Number | Priority Date | Filing Date | Title |
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| US23463600P | 2000-09-22 | 2000-09-22 | |
| US60/234,636 | 2000-09-22 | ||
| US23735600P | 2000-09-27 | 2000-09-27 | |
| US60/237,356 | 2000-09-27 |
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| CNB2005101257860A Division CN100511503C (zh) | 2000-09-22 | 2001-09-24 | 电子变压器/电感器器件及其制造方法 |
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| CN1261753C true CN1261753C (zh) | 2006-06-28 |
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| EP (1) | EP1325545A4 (zh) |
| JP (1) | JP4247518B2 (zh) |
| CN (1) | CN1261753C (zh) |
| AU (1) | AU2001294646A1 (zh) |
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- 2001-09-24 AU AU2001294646A patent/AU2001294646A1/en not_active Abandoned
- 2001-09-24 TW TW090123454A patent/TWI258154B/zh not_active IP Right Cessation
- 2001-09-24 US US09/961,789 patent/US6820321B2/en not_active Expired - Fee Related
- 2001-09-24 EP EP01975308A patent/EP1325545A4/en not_active Withdrawn
- 2001-09-24 JP JP2002528898A patent/JP4247518B2/ja not_active Expired - Fee Related
- 2001-09-24 CN CN01816181.2A patent/CN1261753C/zh not_active Expired - Fee Related
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- 2004-11-22 US US10/994,902 patent/US20050093672A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004515054A (ja) | 2004-05-20 |
| WO2002025797A3 (en) | 2002-06-13 |
| US20050093672A1 (en) | 2005-05-05 |
| WO2002025797A2 (en) | 2002-03-28 |
| US6820321B2 (en) | 2004-11-23 |
| CN1466679A (zh) | 2004-01-07 |
| TWI258154B (en) | 2006-07-11 |
| EP1325545A4 (en) | 2004-11-24 |
| JP4247518B2 (ja) | 2009-04-02 |
| AU2001294646A1 (en) | 2002-04-02 |
| US20020070831A1 (en) | 2002-06-13 |
| EP1325545A2 (en) | 2003-07-09 |
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