TWI258154B - Electronic transformer/inductor devices and methods for making same - Google Patents

Electronic transformer/inductor devices and methods for making same Download PDF

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Publication number
TWI258154B
TWI258154B TW090123454A TW90123454A TWI258154B TW I258154 B TWI258154 B TW I258154B TW 090123454 A TW090123454 A TW 090123454A TW 90123454 A TW90123454 A TW 90123454A TW I258154 B TWI258154 B TW I258154B
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Taiwan
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core
transformer
holes
hole
ferromagnetic
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TW090123454A
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English (en)
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Philip A Harding
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Flex Multi Fineline Electronix
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/016—Method or apparatus with etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Description

1258154 B7 五、發明說明l ,) ί發明領域] 本發明係關於電感構件以及供製造此等構件之方法。 [發明背景] 電感構件係通常運用鐵磁性鐵心（ferr〇magnetlc c〇re)以 及絕緣電線繞組所製成。鐵磁性鐵心係典型爲環形 (toroidal)鐵心、桿狀(r〇d)鐵心、或者諸如第丄圖所示之由 ^ 一下部E形鐵磁性部份與連接該E形者的三個腳部之一鐵 磁性蓋部(cap)所作成的一個組件。 環形鐵心與桿狀鐵心係手動或自動繞製絕緣銅線，以 形成用於變壓器之多個複數匝繞組或者用於電感器之單一 繞組。典型而言，該組件係接著封裝以保護導線。電路連 接係隨應用所需而藉著導線之焊接終結所作成。此種方式 係因爲各別零件操縱而具有高勞力成本。因爲銅線之正確 置放的困難度，於g者如漏電感、分佈與繞組間的電容、以 及於繞組間的共模不平衡之電子參數係具有大的變化性 〇 第1圖之E形及圍繞的蓋部組件係作成爲一電感構件 ’藉者如爲所需而手動或自動繞製絕緣銅線於該E形者的 腳部。將該蓋部黏固或鉗固於定位與最終封裝係完成此子 組件。同樣地，電路連接係隨應用所需而藉由導線之焊接 終結所作成。此裝置不僅是具有如前文所述之環形與桿形 鐵心的限制，並且其係一般爲較大許多的裝置。因爲該蓋 部係-個單獨的裝置，磁性路徑係具有介於該E形者與蓋 部之間的非鐵磁性間隙之電阻而降低變壓器之效率。 3 纸張灵度適用中國國家標準（CNS)A4規格（210 x 297公釐) "' --- (請先閱讀背面之注意事項再填寫本頁) 裝--------訂i 1258154 A7 __ _B7__ 五、發明說明（> ) [發明槪論] (請先閱讀背面之注意事項再填寫本頁) 本發明之較佳實施例係提出電感器與變壓器以及製造 此等裝置之方法，其提供優於現今技術之極爲重大的優點 。於下文所述之一個較佳實施例中，鐵磁性材料之一矩形 厚板（slab)係具有複數個孔，其由厚板頂面至厚板底面而鑽 孔穿過該厚板，孔之數目係對應於期望繞組的數目。然而 ，該等繞組係非絕緣電線。反而，穿過該厚板之孔係由頂 部至底部所電鍍，且係與形成於厚板之頂與底表面上的電 鍍導體爲電氣連接。此型式之電鍍穿孔與電鍍導體係構成 電感器與變壓器，該等電感器與變壓器之鐵心係爲鐵磁性 材料之已鑽孔的厚板。 如下文所述，本發明之較佳實施例係以極爲新穎的方 式而運用一種物理法則，安培定律（Ampere’s Law)，即環 繞任何閉合路徑之磁場強度的數學線積分係等於所包圍的 電流之淨値。本發明係運用此法則以於電路板內而形成一 種電壓器、電感器、或其他類似者，且無須使用或組裝離 散裝置至電路板。 根據本發明所連接之電感器與變壓器係具有於電子、 電訊以及電腦領域之諸多應用。根據本發明之較佳實施例 所構成之電感器與變壓器係提供重大的優點，諸如小型化 、改良之熱移除、極佳的性能、以及優越的製造可重複性 〇 [圖式簡單I兌明] 本發明之槪括性質以及其主要特徵與優點係已作摘要 4
A7 1258154 _______B7 _________ 五、發明說明（> ) ，藉由參照隨附圖式之詳細說明，本發明之某些較佳實施 例與修正例係將對於熟悉此技藝之人士而言爲變得顯明’ 其中： 第1圖係一*種先前技藝之鐵磁性E鐵心的槪疋、不思Η ，具有匹配的鐵磁性蓋部； 第2圖係一種習用環形變壓器的俯視圖； 第2Α圖係一種習用變壓器的側視圖； 第3Α圖係一種“虛擬”環形變壓器之代表的俯視圖； 第3圖係第3Α圖之虛擬變壓器的側視圖； 第4圖顯示一種虛擬變壓器之其他較佳實施f!J的俯視 圖； 第5圖顯示疊合於FLEX之一大面板上的一陣列之7〇 個鐵心，頂部FLEX層係移開以顯示個別的鐵心； 第6圖係一放大側視圖，顯示疊合至個別的鐵心厚板 之頂部與底部FLEX; 第7圖顯示於個別的厚板中之一通孔的橫截面； 第.8圖顯示一 PCB聚脂膠片之實例，其具有一陣列之 25個孔以容納25個鐵心； 第9圖係個別的鐵心之放大側視圖，顯示疊合至鐵心 之頂部與底部PCB; ^ 第10圖係於個別的鐵磁性厚板中之一通孔的放大橫截 面； 第11圖係塡有屏蔽導電塗料之一通孔的放大橫截面; 及 5 --^-----------^--------^--------^I 線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（.210 X 297公釐） 1258154 A7 ____B7___ 五、發明說明（斗） 第12圖說明本發明之散熱特性，其藉著改良之表面積 對於體積的比値。 [元件符號說明] 30 環形鐵心 32 二匝繞組 34 四匝繞組 36 各匝 38 磁通路徑 40 內側半徑 42 外側半徑 44 內側孔(通孔） 46 外側孔(通孔） 50 鐵磁性材料之厚板 52 頂表面 54 底表面 56 外側孔(通孔） 58 導體 60 、60，墊 62 橢圓路徑 64 外側半徑 66 內側半徑 68 內側孔(通孔） 70 鐵磁性厚板 72 、74虛擬鐵心 (請先閱讀背面之注意事項再填寫本頁) ，裝—— 訂------- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1258154 A? ____B7_ 五、發明說明（< ) (請先閱讀背面之注意事項再填寫本頁) 75矩形虛擬環 76內側矩形 77外側矩形 90鐵磁性厚板(鐵心） 92銅電路圖案(pattern) 110環氧樹脂薄板(epoxy sheet) 112頂表面 114底表面 115黏著物 116頂層FLEX電路 117底層FLEX電路 150鐵磁性(鐵心)片(piece) 154孔 156聚脂膠片(prepreg)陣列 170頂層PCB電路 172底層PCB電路 190通孔
192組合層PCB 194頂層PCB電路 196底層PCB電路 198導電油墨 210鐵心 212載體 214孔 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1258154 B7 五、發明說明（b ) 215頂側 216底側 230表面積 232散熱板 [較佳實施例詳細說明] 第2圖說明一種具有一環形鐵心30之典型先前技藝的 變壓器。爲求簡化，此種變壓器具有二個絕緣線繞組:一個 二匝繞組32與一個四匝繞組34。各匝36係環繞該鐵心30 之材料，俾使當電流係通過一個繞組時，一個環繞的磁通 路徑38係流通於鐵心30之內。第2A圖說明其通過鐵心 30的中心且繞於鐵心30的外側之繞組32、34。 本發明之較佳賓施例係具有極爲不同的鐵心與繞組酉己 置。第3圖顯示鐵磁性材料之厚板50的側視圖，厚板50 具有一頂表面52與底表面54，並顯示於厚板50之內的二 個外側孔(通孔）56與一個內側孔(通孔)68之橫截面。 第3A圖顯示根據本發明較佳實施例所構成之一_ “ 虛擬(virtual)”環形變壓器，其運用具有12個通孔56之厚 板50。導體58係形成於該厚板之頂表面52與底表面54 $ 該等導體具有供連接至其他裝置或電路之墊60。如下文所 述，此等外側通孔56與內側通孔68係由頂部至底部所電 鍍穿過且與導體58爲電氣接觸，使得一完整的電氣電路係 延伸介於例如墊60與墊60,之間。如下文所述，一種虛擬 環形變壓器62係因此形成具有一橢圓路徑62。 第4圖說明顯示一種鐵磁性厚板70，其具有位於相同 8 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂---------说 % 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1258154 A7 五、發明說明（7) 厚板7〇之上的二個獨立虛擬鐵心72、74。第二變壓器74 說明本發明之另一個實施例，其中之通孔係重新配置爲特 定圖案。此種重新配置係形成一矩形的虛擬環75，其具有 一內側矩形76與一外側矩形77。 如第2圖所示之繞組32、34係藉由鐵心30所電氣耦 接在一起。鐵心30提供一磁通路徑，其耦接第一繞組32 至第二繞組34，藉以當第一繞組存在有一電壓時係產生一 電壓於桌〜繞組。此係變壓器之基本理論，其將能量由一 個繞組而轉變至另一個繞組。該磁通之主要部分係被限制 於鐵心的內側半徑40與外側半徑42之間。 安培定律係無關鐵心形狀而限制磁通路徑，因此其係 無須實際製造該環形鐵心之甜甜圏形狀以產生其表現類似 之裝置。 因此，本發明係以極爲新穎的方式而運用安培定律。 通孔係以使得允許磁通路徑存在於基板上所形成的二個繞 組間之該種方式而形成。如第3A圖所示，落於該等內側 通孔68之內的任何圍繞路徑係將包含零値淨電流，因此該 等路徑係將不具有磁通。包圍該等外側通孔56之任何路徑 係將亦包含零値淨電流，因爲由流通過該等內側通孔之電 流所產生的磁通係將抵消由流通過該等外側通孔之電流所 產生的磁通。然而，介於該等內側通孔68與外側通孔56 之間的圍繞路徑係歸因於該等內側通孔68之圍繞者而將具 有一淨磁通。部份圍繞內側通孔68或外側通孔56之其他 路徑係將不具有重大的磁通，因爲磁通係類似於電流而將 9 (請先闓讀背面之注意事項再填寫本頁) f: 訂---------. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 1258154 五、發明說明（f ) 會選擇最短的實際路徑。因此，此種結構將表現極爲類似 於第1圖之環形鐵心，而係顯不爲一虛擬環62。 將係顯明的是，通孔之適當選擇係使得能夠具有多種 不同形狀之虛擬鐵心以及於基板上之鐵心配置。因此，諸 多獨立的磁路係可構成於相同基板上。因爲此緣故，係可 能構成相較於簡單電感器與變壓器爲複雜的電路，藉著通 孔與電路導體之適當置放於第3圖所示之鐵磁性厚板50的 頂表面52與底表面54。舉例而言，運用於習用PCB與 FLEX(flexible circuit boards，可撓曲電路板)產業所用之製 程(光-(photo-)沉積、蝕刻、及電鍍），諸如電阻器、電容器 、與積體電路之多個構件係可置放於相同基板以形成微小 型化電路組件。 作爲部份FLEX之製遙 一種製造方法係嵌入多數個鐵磁性厚板(鐵心9〇)於諸 如第5、6、與7圖所示者之FLEX 92電路的頂與底層內。 對應於期望繞組之銅電路圖案92係形成於〜環氧樹脂萍板 110，其係由黏著物Π5所黏固至厚板之頂袠面U2與^ 面1丨4。鐵心9〇係因此藉由一種疊合製程所容納於電运表 。通孔係係形成通過組合層FLEX 92與鐵心，以形'八92 頂層FLEX電路II6至底層FLEX電路117次二 j丨於 <間的_換 如第6與7圖所示。以導電油墨塡充於通孔球女 安’ 電鍍製程係運用以同時作成供大量虛擬鐵心之連接:^褰 方法。此種結構之橫截面係顯示於第6與7 _。 的較隹 作爲部份PCB之製 10 (請先閱讀背面之注意事項再填寫本頁) 裝--------訂-— 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1258154 A7 ^___ 五、發明說明（1 ) 第8、9、與10圖所示之另一種方法係嵌入多數個鐵 磁性片150介於頂層I70與底層172的電路之間。第 8圖顯示一陣列之孔154於一 PCB黏著物或聚脂膠片 (prepreg)陣列156。此片面板156係形成以容納各 個鐵心片150。如第9圖所示，在該等鐵心片150係插入 於孔154之後’ 一頂段170與一底段172之PCB係疊合至 陣列15 6。該等片15 〇係因此藉者暨合製程所容納，疊合 製程係將該等鐵心片150夾於二個環氧樹脂薄板之間。通 孑L 190係形成通過組合層PCB 192與鐵心片150，以形成 介於頂層PCB電路194與底層PCB電路196之間的連接 。塡充有導電油墨198之通孔190或者標準工業電鍍製程 係有利運用，以同時作成用於大量鐵心之連接。此種結構 之橫截面係類似於第6與7圖所示之FLEX 117結構。主 要之差異係歸因於PCB材料之非可撓曲性，其係並未順應 於個別的鐵心片150 ° 不亘FLEX或PCB之製造 又一種製造方法係顯示於第11圖，其中，多數個鐵心 210係保持於一載體212之上。各個鐵心210係模製有適 當的孔214。接著’運用標準工業導電油墨屏蔽(screening) 製程以形成電路於鐵心210之頂側215與底側216，而且 同時塡充該等孔214以作成介於頂側215與底側216之間 的所需連接。 熱移除:‘ 根據本發明較佳實施例所構成之電感器與變壓器的一 (請先閱讀背面之注意事項再填寫本頁) ，裝-----
· I —II I % 11 1258154 A7 _______B7_ ___ 五、發明說明（/ 〇 ) 個重要特點係在於，該種“虛擬，，鐵心變壓器/電感器之熱 產生繞組係並非如同傳統變壓器般之埋藏於一組件內或者 繞於彼此的頂部上。反之，電鍍繞組係實質爲位於該種“ 虛擬，，鐵心變壓器或電感器裝置之頂與底平面上。此種佈 局（layout)係提供優越的散熱，而並無陷入的熱量爲埋藏於 繞組內。該PCB係可有利爲附接至一散熱座’僅係由典型 爲僅僅0.005英吋厚之薄的防焊膜(solder mask)所分離’置 放一半之繞組以與散熱座爲熱接觸，藉以提供優越的表面 積對熱量比値。第12圖顯示供優良熱移除之大表面積230 的一個實例，直接安裝至諸如標準FR4 PCB之一散熱板 232 ° —件式(One Piece)鐵心： 如第1圖所示，於E鐵心結構中，一間隙係形成介於 E鐵心與蓋部之間，其係無法避免。大部份的變壓器係運 用E型鐵心，其需例如運用環氧樹脂與鉗固而將一半之鐵 心接合至另一半者。此等製程係耗時，引入損失，且歸因 於介於E鐵心與蓋部之間的造成間隙而引起於裝置參數之 變動。反之，本發明較佳實施例之鐵心係一種連續件，因 而改良變壓器效率。一件式之設計係亦免除於分離處理步 驟中將二個分離件接合在一起之需要。 表面安裝： 根據本發明較佳實施例所形成之繞組係可易於形成至 表面女裝引線’而無須單獨的引線架(lea(^frame)結構、複 雜的接腳處理(pinning)或者末端電鍍處理(plating)。 (請先閱讀背面之注意事項再填寫本頁) ，裝------- —訂---------. 12 1258154 A7 ___B7______ 五、發明說明（il ) 磁性穩固（Sound): 根據本發明較佳實施例所構成之“虛擬”鐵心係提供 較爲有效率的磁通路徑，並且具有相較於傳統變壓器爲少 的損失。此等特徵係極爲密切類似於一環形鐵心之設計與 作用。此外，該磁通路徑係相較於運用諸如E鐵心與PQ 鐵心之傳統鐵心的同等變壓器者爲短。 尺寸: 根據本發明較佳實施例所構成之變壓器與電感器係適 以小型化。因此，其係免除對於複雜接腳或者引線架之需 求。因此，一種具有直徑0.03英吋的通孔之長1.5英吋、 寬1英吋、以及厚〇·〇5英吋[insert X not attached]之厚板係 可提供用於二或多種變壓器之鐵心。該等鐵磁性厚板係可 爲極小。於頂與底表面上的表面墊係形成連接，且係可直 接爲表面連接至PCB者，因此減小該裝置之佔有面積 (footprint)而讓出較多空間給其他構件。所計劃之繞組係實 質爲於二個平行平面。因此，一種典型應用之十（10)層平 面變壓器裝置的繞組可係以五（5)之因數而減小整體高度。 鐵磁性厚板係可爲極薄(例如0.05英吋），使得本發明之電 感器與變壓器係可實質構成於一極薄平面而並非一個三維 E鐵心結構，進而以大因數而減小整體高度。 成本： 根據本發明所構成之變壓器與電感器係可由二個簡單 的單側撓曲電路所作成，且相較於多層平面繞組而言係極 爲不昂貴以製造。此外，其免除對於引線架、嵌裝 (請先閱讀背面之注意事項再填寫本頁) T n n n n w ^ I n 1^1 In n I ϋ I 言 13 1258154 A7 __B7 五、發明說明（、> ) (potting)、以及蓋部黏固之需要，因此使得裝置易於製造 〇 結論： 根據本發明較佳實施例所構成之變壓器與電感器係具 有該裝置之其熱零件，對於熱移除係較可達成，外側連接 係較可達成以簡化連接，磁通路徑係較短而提高磁性的性 肯g，製程係較爲簡單，互相連接係較爲整合，且整體裝置 係較小。 14 (請先閱讀背面之注意事項再填寫本頁) ，裝------- 1訂-------- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）

Claims (1)

1258154 A8 B8 . C8 ·：·ί . ，、〇 " % 'J i π、申請專利範園 1。 一種供製造用於印刷電路板設計的裝置之方法，包 含： 印製電路圖案於該電路板上； 引入一鐵磁性基板於該印刷電路板； 形成穿過該鐵磁性基板之孔； 將一導電材料塡於該等孔;及 運用連接與該圖案以使得製成一裝置，其運用該電路 板作爲一磁心。 2. —種電感器或變壓器，包含： 一厚板之磁性材料，具有貫穿於其之一組間隔的孔； 一導電材料，位於該等孔之內;及 , 電氣印刷電路，位於該厚板之頂與底表面上，分別與 該導電材料爲電氣接觸。 (請先閲讀背面之注意事項再填寫本頁) ΐ-Γΰ'" 線- 0 本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297公釐) 1258154
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CN1261753C (zh) 2006-06-28
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WO2002025797A3 (en) 2002-06-13
EP1325545A4 (en) 2004-11-24
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AU2001294646A1 (en) 2002-04-02
WO2002025797A2 (en) 2002-03-28
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JP4247518B2 (ja) 2009-04-02
CN1466679A (zh) 2004-01-07

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