580712 A7 ____21___ 五、發明說明（/ ) [優先權主張] 本申請案係主張西元2000年9月22日提出之標題爲 “電子變壓器/電感器裝置及其製造方法”的美國專利臨時 申請案序號60/234,636號以及西元2000年9月27日提出 之標題爲“電子變壓器/電感器裝置及其製造方法”的美國 專利臨時申請案序號6〇/237,356號之裨益。 [發明領域] 本發明係關於電感構件以及供製造此等構件之方法。 [發明背景] 電感構件係通常運用鐵磁性鐵心(ferromagnetic core)及 絕緣電線繞組所製成。鐵磁性鐵心係典型爲環形(toroidal) 鐵心、桿狀(rod)鐵心、或者諸如於第1圖所示之由一下部 E形鐵磁性部分與其連接該E形者的三個腳部之一鐵磁性 蓋部(cap)所作成的組件。 環形鐵心與桿狀鐵心係手動或自動繞製絕緣銅線，以 形成用於變壓器之多個複數匝繞組或者用於電感器之單一 繞組。典型而言，該組件係接著作封裝以保護導線。電路 連接係隨應用所需而藉著導線之焊接終結所作成。此方式 係因爲各別零件操縱而具有高勞力成本。因爲銅線之正確 置放的困難度，諸如漏電感、分佈與繞組間的電容、以及 介於繞組間的共模不平衡之電子參數係具有大的變化性。 第1圖之E形及圍繞的蓋部組件係作成一電感構件， 藉著如其所需而爲手動或自動繞製絕緣銅線於該E形者的 腳部。將該蓋部黏固或鉗固於定位與最終封裝係完成此個 ___±___ ___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --裝 線 580712 A7 ___B7 _ 五、發明說明（义） (請先閱讀背面之注意事項再填寫本頁) 子組件。類似而言，電路連接係隨應用所需而藉由導線之 焊接終結所作成。此裝置不僅是具有如前文所述之環形與 桿狀鐵心的限制’並且其係一^般爲較大§午多的裝置。因爲 該蓋部係一個單獨的裝置，磁性路徑係具有介於該E形者 與蓋部之間的非鐵磁性間隙之電阻而降低變壓器之效率。 如第1圖所示而構成之功率變壓器具有進一步的缺點 在於，由繞組中之電阻損失所造成的熱量係不易於消散， 因爲E形鐵心與蓋部係將此等繞組隔離自一散熱座。 [發明槪論] 本發明之較佳實施例係提出電感器與變壓器以及製造 此等裝置之方法，其提供優於現今技術之極爲重大的優 點。根據本發明所連接之此等電感器與變壓器係具有諸多 之應用於電子、電訊與電腦領域。於下文所述之一個較佳 實施例，鐵磁性材料之一矩形厚板(slab)係封裝爲介於印刷 電路之間。複數個穿孔(通孔，via)係於厚板製造期間而鑽孔 貫穿或形成，其由厚板之頂面而鑽孔至厚板之底面，孔之 數目係對應於繞組之期望匝數的數目。此實施例係以極爲 新穎的方式運用安培定律（Ampere’s Law)形成一種電壓 器、電感器、或類似者於電路板內，而並非使用或組裝離 散的裝置至電路板。因此，該等繞組係並非絕緣電線。反 而’穿過厚板之孔係藉著穿孔電鍍或類似者而作成導電且 電氣連接其封裝該厚板之印刷電路。此型態之電鍍穿孔與 印刷電路係構成電感器與變壓器繞組，且該等電感器與變 壓器之鐵心係爲鐵磁性材料之已鑽孔或形成的厚板。此實 _________5___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） 580712 A7 _ B7__ 五、發明說明（$ ) 施例係尤其提供於製造高頻的電感器與變壓器之實質改 良。 於下文所述之較佳實施例中，電感器或變壓器之鐵心 包含爲由多層組之薄且同心(concentric)的鐵磁性金屬環所 形成之鐵心，該等金屬環係支撐於諸如撓曲電路(FLEX， flex circuit)或印刷電路板(PCB，printed circuit board)之合 適的基板。鄰近此等同心的環之穿孔係提供爲與印刷電路 之電氣連接，以提供電感器與變壓器繞組。此實施例係使 得能夠構成其具有最小渦流(eddy current)效應之高磁導率 的電感器與變壓器。如此構成之電感器與變壓器係具有對 於小型的低頻電源供應器之特別應用。 除了上述優點之外，該等較佳實施例具有諸多另孙^ 重大優點。此等優點包括:優越之熱移除、其爲較易於接近 以簡化電氣連接之外側連接、較短的磁通路徑以提高磁性 能、較簡單之製造、較爲整合之互連、較小的電感元件、 優越的性能、以及優良的製造可重複性。 [圖式簡單說明] 本發明之槪括性質以及其主要特徵與優點已作摘要， 藉由參照隨附圖式之本文的詳細說明，對於熟悉此技藝之 人士而言，本發明之某些較佳實施例與其修正例係將變得 顯明，其中： 第1圖係一種先前技藝之鐵磁性E鐵心的槪念示意 圖，具有匹配的鐵磁性蓋部； 第2A圖係一種習用環形變壓器的俯視圖； ___6_____ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -t< · 線- A7 580712 ______Β7__ 五、發明說明（V ) 第2B圖係一種習用變壓器的側視圖； 第3A圖係一種“虛擬”環形變壓器之代表的俯視圖； 第3B圖係第3A圖之虛擬變壓器的側視圖； 第4圖顯示一種虛擬變壓器之其他較佳實施例的俯視 圖； 第5圖顯示其爲疊合於FLEX之一大面板上的一陣列 之70個鐵心，頂部FLEX層係移開以顯示個別的鐵心； 第6圖係一放大側視圖，顯示其爲疊合至個別的鐵心 厚板之頂部與底部FLEX; 第7圖顯示於個別的厚板中之一通孔的橫截面； 第8圖顯示一 PCB聚脂膠片之實例，其具有一陣列之 25個孔以容納25個鐵心； 第9圖係個別的鐵心之放大側視圖，顯示其爲疊合至 鐵心之頂部與底部PCB; 第10圖係個別的鐵磁性厚板中之一通孔的放大橫截面; 第11圖係塡有屏蔽導電塗料之一通孔的放大橫截面； 第12圖說明本發明之散熱特性，其藉著改良之表面積 對於體積的比値； 第13圖顯示一金屬環形鐵心，說明渦流爲產生於其中 之方式； 第14圖說明複數個鐵心疊層，其爲藉由蝕刻同心環之 鐵磁性金屬而形成； 第15圖係第14圖之一個鐵心疊層的放大圖； 第16A圖係一橫截面圖，顯示複數個堆疊的鐵心疊層； ___ 7 __ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -裝 ;線_ 580712 A7 _B7_ 五、發明說明（t ) 第16B圖係第16A圖之一個鐵心堆疊的放大圖； (請先閱讀背面之注意事項再填寫本頁) 第17A圖係一橫截面圖，顯示第16A圖之堆疊，其在 頂部與底部印刷電路已經加上之後； 第17B圖係第17A圖之一個鐵心堆疊的放大圖； 第18A圖係一橫截面圖，其在電鍍穿過的通孔係已經 鑽孔貫穿第17A圖的疊層結構之後;及 第18B圖係第18A圖之一個鐵心堆疊的放大圖。 [元件符號說明] 30環形鐵心 32二匝繞組 34四匝繞組 36各匝 38磁通路徑 40內側半徑 42外側半徑 44內側孔(通孔） 46外側孔(通孔） 50鐵磁性材料之厚板 52頂表面 54底表面 56外側孔(通孔） 導體 60 、 60，墊 62橢圓路徑 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 580712 A7 _B7_ 五、發明說明（么） (請先閱讀背面之注意事項再填寫本頁) 64外側半徑 66內側半徑 68內側孔(通孔） 70鐵磁性厚板 72、74虛擬鐵心 75矩形虛擬環 76內側矩形 77外側矩形 90鐵磁性厚板(鐵心） 92銅電路圖案(pattern) 110環氧樹脂薄板(epoxy sheet) 112頂表面 114底表面 Π5黏著物 116頂層FLEX電路 117底層FLEX電路 150鐵磁性(鐵心)片(piece) 154孔 156聚脂膠片(prepreg)陣列 170頂層PCB電路 172底層PCB電路 190通孔580712 A7 ____21___ V. Description of Invention (/) [Priority Claim] This application claims the serial number of the US Patent Provisional Application entitled "Electronic Transformer / Inductor Device and Manufacturing Method" filed on September 22, 2000 AD The benefits of US Patent Provisional Application Serial No. 60 / 237,356, entitled "Electronic Transformer / Inductor Device and Method of Manufacturing", filed on September 27, 2000, and dated September 27, 2000. [Field of the Invention] The present invention relates to an inductance component and a method for manufacturing such components. [Background of the Invention] Inductive components are generally made using a ferromagnetic core and an insulated wire winding. The ferromagnetic core is typically a toroidal core, a rod core, or one of the three legs of the E-shaped person connected to the E-shaped core by a lower E-shaped ferromagnetic portion such as shown in FIG. 1. A component made of a magnetic cap. The toroidal core and the rod-shaped core are manually or automatically wound insulated copper wires to form a plurality of windings for a transformer or a single winding for an inductor. Typically, this component is connected to a package to protect the wires. Circuit connections are made by soldering of wires as required by the application. This method has high labor costs due to the manipulation of individual parts. Because of the difficulty of correct placement of copper wires, electronic parameters such as leakage inductance, capacitance between the distribution and windings, and common-mode imbalance between the windings have large variability. The E-shaped and surrounding cover assembly shown in Fig. 1 is made as an inductance member, and an insulated copper wire is manually or automatically wound on the E-shaped person's leg as required. The cover is glued or clamped to the positioning and final packaging system to complete this. ___ ± ___ ___ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back first (Fill in this page again)-Installation line 580712 A7 ___B7 _ V. Description of invention (meaning) (Please read the precautions on the back before filling in this page) Sub-assembly. Similarly, circuit connections are made by solder termination of wires as required by the application. This device is not only a device with the limitations of the ring and rod cores as described above, but also a device that is generally larger. Because the cover is a separate device, the magnetic path has a non-ferromagnetic gap resistance between the E-shaped and the cover, reducing the efficiency of the transformer. The power transformer constructed as shown in Fig. 1 has a further disadvantage in that the heat caused by the resistance loss in the winding is not easy to dissipate, because the E-shaped core and the cover portion isolate this winding from a heat sink. [Inventive Discussion] The preferred embodiment of the present invention proposes inductors and transformers, and a method of manufacturing such devices, which provides extremely significant advantages over current technology. These inductors and transformers connected according to the present invention have many applications in the fields of electronics, telecommunications and computers. In a preferred embodiment described below, a rectangular slab of ferromagnetic material is packaged between printed circuits. A plurality of perforations (vias) are drilled through or formed during the manufacture of the thick plate, which are drilled from the top surface of the thick plate to the bottom surface of the thick plate. The number of holes corresponds to the desired number of turns of the winding number. This embodiment uses Ampere's Law to form a voltage regulator, inductor, or the like in a circuit board in a very novel way, instead of using or assembling discrete devices to the circuit board. Therefore, these windings are not insulated wires. Instead, the hole through the thick plate is made by perforation plating or the like to be conductive and electrically connected to a printed circuit which encapsulates the thick plate. This type of electroplated perforation and printed circuit constitute inductors and transformer windings, and the cores of these inductors and transformers are thick plates that have been drilled or formed of ferromagnetic materials. This fact _________5___ This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 x 297 mm) 580712 A7 _ B7__ V. Description of the invention ($) The examples are provided in particular for the manufacture of high-frequency inductors and transformers Improvement. In the preferred embodiment described below, the core of an inductor or transformer includes an iron core formed by multiple sets of thin and concentric ferromagnetic metal rings that are supported on a circuit such as a flex circuit (FLEX, flex circuit) or printed circuit board (PCB) suitable substrate. The perforations adjacent to this isocentric ring are provided as electrical connections to the printed circuit to provide inductor and transformer windings. This embodiment makes it possible to construct inductors and transformers having a high magnetic permeability with a minimum eddy current effect. The thus constructed inductors and transformers have special applications for small low-frequency power supplies. In addition to the advantages described above, the preferred embodiments have many other significant advantages. These advantages include: superior heat removal, it is easier to access to simplify electrical connections on the outer side, shorter magnetic flux paths to improve magnetic performance, simpler manufacturing, more integrated interconnects, smaller Inductive components, superior performance, and excellent manufacturing repeatability. [Brief description of the drawings] The comprehensive nature of the present invention and its main features and advantages have been summarized. With reference to the detailed description of the accompanying drawings, for those skilled in the art, some of the present invention The preferred embodiment and its modification will become apparent, in which: FIG. 1 is a schematic diagram of a ferromagnetic E iron core of the prior art with a matching ferromagnetic cover; FIG. 2A is a top view of a conventional toroidal transformer; ___6_____ This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -t < · Line-A7 580712 ______ Β7__ V. Description of Invention (V) Figure 2B is a side view of a conventional transformer; Figure 3A is a top view of a representative of a "virtual" toroidal transformer; Figure 3B is a side view of a virtual transformer of Figure 3A; Figure 4 shows other preferred aspects of a virtual transformer Top view of the embodiment; FIG. 5 shows that it is 70 cores superimposed on an array on a large panel of FLEX, and the top FLEX layer is removed to show individual cores; FIG. 6 An enlarged side view showing the top and bottom FLEX superimposed on individual thick plates; Figure 7 shows a cross-section of a through hole in an individual thick plate; Figure 8 shows a PCB polyester film For example, it has an array of 25 holes to accommodate 25 cores; Figure 9 is an enlarged side view of individual cores, showing it as a top and bottom PCB superimposed on the core; Figure 10 is individual ferromagnetic thick An enlarged cross-section of a through-hole in a plate; FIG. 11 is an enlarged cross-section of a through-hole having a shielded conductive coating; FIG. 12 illustrates the heat dissipation characteristics of the present invention, which has an improved surface area to volume ratio through improvement; Figure 13 shows a metal ring core, illustrating the way in which eddy currents are generated; Figure 14 illustrates a plurality of core stacks, which are formed by etching a ferromagnetic metal of concentric rings; Figure 15 is one of Figure 14 Enlarged view of the core stack; Figure 16A is a cross-sectional view showing multiple stacked core stacks; ___ 7 __ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (please first Read the note on the back (Please fill this page again)-installation; line _ 580712 A7 _B7_ 5. Description of the invention (t) Figure 16B is an enlarged view of a core stack of Figure 16A; (Please read the precautions on the back before filling this page) Figure 17A is a cross-sectional view showing the stack of Figure 16A after the top and bottom printed circuits have been added; Figure 17B is an enlarged view of a core stack of Figure 17A; Figure 18A is a cross-sectional view After the through-holes that have been plated through have been drilled through the laminated structure of FIG. 17A; and FIG. 18B is an enlarged view of a core stack of FIG. 18A. [Explanation of component symbols] 30 toroidal core 32 two-turn winding 34 four-turn winding 36 each turn 38 magnetic flux path 40 inside radius 42 outside radius 44 inside hole (through hole) 46 outside hole (through hole) 50 thick plate of ferromagnetic material 52 Top surface 54 Bottom surface 56 Outer hole (through hole) Conductor 60, 60, pad 62 Elliptical path This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 580712 A7 _B7_ ) (Please read the precautions on the back before filling this page) 64 outer radius 66 inner radius 68 inner hole (through hole) 70 ferromagnetic thick plate 72, 74 virtual iron core 75 rectangle virtual ring 76 inside rectangle 77 outside rectangle 90 ferromagnetic Thick plate (core) 92 Copper circuit pattern 110 epoxy sheet 112 Top surface 114 Bottom surface Π5 Adhesive 116 Top FLEX circuit 117 Bottom FLEX circuit 150 Ferromagnetic (core) piece 154 holes 156 polyester film (prepreg) array 170 top PCB circuit 172 bottom PCB circuit 190 through hole
192組合層PCB 194頂層PCB電路 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 580712 A7 _B7 五、發明說明（7 ) 196底層PCB電路 198導電油墨 210鐵心 212載體 214孔 215頂側 216底側 230表面積 232散熱板192 combined layer PCB 194 top PCB circuit This paper size applies to Chinese National Standard (CNS) A4 specification (210 X 297 mm) 580712 A7 _B7 V. Description of the invention (7) 196 bottom PCB circuit 198 conductive ink 210 iron core 212 carrier 214 holes 215 top side 216 bottom side 230 surface area 232 heat sink
290 PCB 或 FLEX 300渦流 305金屬鐵心290 PCB or FLEX 300 eddy current 305 metal core
310 PCB 或 FLEX 315鐵心陣列 315a-315h同心環 320a-320p導電金屬環 325a-325o空間或空隙（void) 330陣列315之外側的區域(空隙) 335最內環320之內的區域(空隙) 340介電材料 350、355 銅層 360、365介電層 370a-d通孔 [較佳實施例詳細說明] 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 48^--- (請先閱讀背面之注意事項再填寫本頁) · 線· 580712 A7 B7___ 五、發明說明) --------------裝—— (請先閱讀背面之注意事項再填寫本頁) 第2A圖說明一種具有一環形鐵心30之典型先前技藝 的變壓器。爲求簡化，此種變壓器具有二個絕緣線繞組:一 個二匝繞組32與一個四匝繞組34。各匝36係環繞該鐵心 30之材料，俾使當電流係通過一繞組時，一個環繞的磁通 路徑38係流通於鐵心30之內。第2B圖說明其通過鐵心 30的中心且繞於鐵心30的外側之繞組32、34。 本發明之較佳實施例係具有極爲不同的鐵心與繞組配 置。於第3A圖槪括顯示之此等較佳實施例的一者，鐵磁 性材料之厚板50具有一頂表面52與底表面54、及(顯示 於橫截面)於厚板50之內的二個外側孔(通孔)56與一個內 側孔（通孔）68。如下文所述，針對小型電感器與變壓器， 厚板50係有利爲一種具有相當高的電阻率之薄層的鐵氧 體。 •線· 第3A與3B圖顯示根據本發明之較佳實施例的一者所 構成之一種“虛擬(virtual)”環形變壓器，其運用具有八個 外側通孔56與六個內側通孔68之厚板50 (並非所有通孔 係均顯示於第3B圖）。導體58係形成於該厚板之頂表面 52與底表面54。該等導體具有供連接至其他裝置或電路之 墊60。如下文所述，此等外側與內側通孔56、68係由頂 部至底部所電鍍穿過且與導體58爲電氣接觸，使得一個完 整的電氣電路係延伸介於例如墊60與墊60,之間。如下所 述，一種虛擬環形變壓器62係因此形成具有一圓形路徑 62 〇 第4圖說明顯示一種鐵磁性厚板70，其具有位於相同 ______ 11__ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ' A7 580712 ___B7______ 五、發明說明（7 ) 厚板70之上的二個獨立虛擬鐵心72、74。第二變壓器74 說明本發明之另一個實施例，其中該等通孔係重新配置爲 特定型態。此重新配置係形成一矩形的虛擬環75 ’其具有 一內側矩形76與一外側矩形77。 如第2圖所顯示之繞組32、34係藉由鐵心30所電感 耦接在一起。鐵心30提供一磁通路徑，其稱接第一繞組 32至第二繞組34，藉以當第一繞組存在有一電壓時而產生 一電壓於第二繞組。此係變壓器之基本理論’其將能量由 一繞組而轉變至另一繞組。該磁通之主要部分係限制於鐵 心的內側半徑40與外側半徑42之間。 安培定律係無關該鐵心之形狀而限制磁通路徑;因此’ 如下文所詳細論述，其係無須實際製造該環形者之甜甜圈 (donut)形狀以產生其爲表現類似之裝置。 作爲部分的FLEX之製造 一種製造方法係嵌入多數個鐵磁性的厚板(鐵心90)於 諸如第5、6、與7圖所示者之FLEX 92電路的頂層與底層 內。對應於期望繞組之銅電路圖案92係形成於一環氧樹脂 薄板110,其係由黏著物115所黏固至厚板之頂表面Π2 與底表面114。鐵心90係因此藉由一疊合製程而容納於電 路％。通孔係形成通過組合層FLEX 92與鐵心，以形成介 於頂層FLEX電路116至底層FLEX電路117之間的連 接，如第6與7圖所示。以導電油墨塡充於通孔或者標準 工業電鍍製程係運用以同時作成供大量虛擬鐵心之連接的 較佳方法。此種結構之橫截面係顯示於第6與7圖。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -I--I-----I--I ___ Η" (請先閱讀背面之注意事項再填寫本頁) 訂： --線· 580712 A7 B7 五、發明說明（） 作爲部分的PCB之製浩 於第8、9、與10圖所顯示之另一種方法係嵌入多數 個鐵磁性片150介於頂層170與底層172的PCB電路之 間。第8圖顯示一陣列之孔154於一 PCB黏著物或聚脂膠 片(prepreg)陣列156。此聚脂膠片面板156係形成以容納 各個鐵心片150。如第9圖所示，在該等鐵心片150係插 入於孔I54之後，一頂段Π0與一底段172之PCB係疊合 至陣列B6。該等片15〇係因此藉著疊合製程所容納，疊 合製程係將該等鐵心片150夾於二個環氧樹脂薄板之間。 通孔190係形成通過組合層PCB 192與鐵心片150，以形 成介於頂層PCB電路194與底層PCB電路196之間的連 接。塡充有導電油墨198之通孔19〇或者標準工業電鍍製 程係爲有利運用，以同時作成用於大量鐵心之連接。此結 構之橫截面係類似於第6與7圖所顯示之FLEX 117結 構。主要之差異係歸因於PCB材料之非可撓曲性，其係並 未順應於個別的鐵心片150。 不具FLEX或PCB之製浩 又一種製造方法係顯示於第u圖，其中，多數個鐵心 210係保持於一載體212之上。各個鐵心21〇係模製有適 當的孔2丨4。接著，標準工業導電油墨屏蔽(screening)製程 係運用以形成電路於鐵心21〇之頂側川與麵川，而 且係同時塡充s亥等孔2Η以作成介於頂側出與底側训 之間的所需連接。 安培定律之新穎運用 (請先閱讀背面之注意事項再填寫本頁) i裝 •線·310 PCB or FLEX 315 iron core array 315a-315h concentric ring 320a-320p conductive metal ring 325a-325o space or void (void) 330 area outside the array 315 (gap) 335 area inside the innermost ring 320 (gap) 340 Dielectric materials 350, 355 Copper layers 360, 365 Dielectric layers 370a-d through holes [Detailed description of preferred embodiments] This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 48 ^- -(Please read the precautions on the back before filling this page) · Thread · 580712 A7 B7___ V. Description of the invention -------------- Installation—— (Please read the precautions on the back first (Refill this page) Figure 2A illustrates a typical prior art transformer with a toroidal core 30. For simplicity, this transformer has two insulated wire windings: a two-turn winding 32 and a four-turn winding 34. Each turn 36 is a material surrounding the core 30, so that when a current is passed through a winding, a surrounding magnetic flux path 38 flows within the core 30. FIG. 2B illustrates windings 32 and 34 which pass through the center of the core 30 and are wound around the outside of the core 30. The preferred embodiment of the present invention has extremely different core and winding configurations. As shown in FIG. 3A, one of these preferred embodiments is shown. The thick plate 50 of ferromagnetic material has a top surface 52 and a bottom surface 54, and (shown in cross section) two within the thick plate 50. An outer hole (through hole) 56 and an inner hole (through hole) 68. As described below, for small inductors and transformers, the thick plate 50 is advantageous as a thin layer of ferrite with a relatively high resistivity. • Lines. FIGS. 3A and 3B show a “virtual” toroidal transformer constructed in accordance with one of the preferred embodiments of the present invention, which uses eight outer through holes 56 and six inner through holes 68. Thick plate 50 (not all through-hole systems are shown in Figure 3B). The conductor 58 is formed on the top surface 52 and the bottom surface 54 of the thick plate. These conductors have pads 60 for connection to other devices or circuits. As described below, these outer and inner through holes 56, 68 are plated through from top to bottom and are in electrical contact with the conductor 58, so that a complete electrical circuit system extends between, for example, pad 60 and pad 60, between. As described below, a virtual toroidal transformer 62 is thus formed with a circular path 62. The illustration in Figure 4 shows a ferromagnetic thick plate 70 having the same ______ 11__ This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) 'A7 580712 ___B7______ 5. Description of the invention (7) Two independent virtual iron cores 72, 74 above the thick plate 70. The second transformer 74 illustrates another embodiment of the present invention, wherein the through holes are reconfigured to a specific type. This rearrangement forms a rectangular virtual ring 75 'which has an inner rectangle 76 and an outer rectangle 77. The windings 32, 34 as shown in Fig. 2 are coupled together inductively by the core 30. The core 30 provides a magnetic flux path, which is connected to the first winding 32 to the second winding 34, so that when a voltage is present in the first winding, a voltage is generated in the second winding. The basic theory of this transformer is that it transforms energy from one winding to another. The main part of the magnetic flux is confined between the inner radius 40 and the outer radius 42 of the core. Ampere's law restricts the magnetic flux path regardless of the shape of the core; therefore, 'as discussed in detail below, it is not necessary to actually make the donut shape of the donut to produce a device that behaves similarly. Manufacturing of FLEX as a part A manufacturing method is to embed a plurality of ferromagnetic thick plates (core 90) in the top and bottom layers of FLEX 92 circuits such as those shown in Figures 5, 6, and 7. The copper circuit pattern 92 corresponding to the desired winding is formed on a thin epoxy resin plate 110, which is fixed to the top surface Π2 and the bottom surface 114 of the thick plate by an adhesive 115. The core 90 series is thus accommodated in the circuit by a stacking process. The through-hole system is formed by combining the FLEX 92 layer and the core to form a connection between the top FLEX circuit 116 to the bottom FLEX circuit 117, as shown in Figs. 6 and 7. Conductive ink filling in through holes or standard industrial electroplating processes is the preferred method for making connections for a large number of virtual cores simultaneously. The cross section of this structure is shown in Figures 6 and 7. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -I--I ----- I--I ___ Η " (Please read the precautions on the back before filling this page) Order : Line · 580712 A7 B7 V. Description of the invention () The PCB system as part of the method is shown in Figures 8, 9, and 10. Another method is to embed a large number of ferromagnetic sheets 150 between the top layer 170 and the bottom layer. 172 between PCB circuits. Figure 8 shows an array of holes 154 in a PCB adhesive or prepreg array 156. This polyester film panel 156 is formed to accommodate each core sheet 150. As shown in FIG. 9, after the core pieces 150 are inserted into the hole I54, a PCB of a top section Π0 and a bottom section 172 is superposed on the array B6. The sheets 15 are thus accommodated by a lamination process which sandwiches the core pieces 150 between two epoxy resin sheets. The through hole 190 is formed through the combination of the PCB 192 and the core sheet 150 to form a connection between the top PCB circuit 194 and the bottom PCB circuit 196.通 The through holes 19 filled with conductive ink 198 or standard industrial electroplating processes are advantageous to make connections for a large number of cores at the same time. The cross-section of this structure is similar to the FLEX 117 structure shown in Figures 6 and 7. The main difference is due to the non-flexibility of the PCB material, which does not conform to the individual core pieces 150. Manufacturing without FLEX or PCB Another manufacturing method is shown in Fig. U, where a plurality of cores 210 are held on a carrier 212. Each core 21o is molded with appropriate holes 2 丨 4. Next, the standard industrial conductive ink screening process is used to form a circuit on the top side and the surface of the core 21, and at the same time, it is filled with the iso-hole 2 and the top side and the bottom side. Between the required connections. Novel Application of Ampere's Law (Please read the notes on the back before filling this page)
580712 A7 __El__ 五、發明說明（丨丨） 上述之本發明的實施例(其具有穿過磁性厚板之導電性 的通孔)係以一種極爲新穎的方式而運用安培定律。通孔係 以使得允許一個磁通路徑爲存在介於形成在基板上的二個 繞組間之該種方式而形成。如第3A圖所示，落於內側通 孔68之內的任何圍繞路徑係將包含零値的淨電流，因此該 等路徑係將不具有磁通。包圍該等外側通孔56之任何路徑 係亦將包含零値的淨電流，因爲該等內側通孔68具有對於 其流通於該等外側通孔56的電流之一相等而反向的電流’ 其產生零磁通於包圍該等外側通孔56的區域中。然而，介 於該等內側通孔68與外側通孔56之間的圍繞路徑係歸因 於該等內側通孔68之圍繞者而將爲具有一淨磁通。其爲部 分圍繞內側通孔68或外側通孔56之其他的路徑係將不具 有重大的磁通，因爲磁通係類似於電流而將選擇最短的實 際路徑。因此，此種結構係將表現極爲類似於第2A圖之 環形鐵心，而係顯示爲一虛擬環62。 將係顯明的是，通孔之適當選擇係使得能夠具有多種 不同形狀之虛擬鐵心以及於基板上的鐵心之配置。因此， 諸多獨立的磁路係可構成於相同的基板上。因爲此舉，係 可能構成相較於簡單的電感器與變壓器爲更複雜的電路， 藉著通孔與電路導體之適當置放於第3圖所顯示之鐵磁性 厚板50的頂表面52與底表面54。舉例而言，運用於習用 PCB 與 FLEX(flexible circuit boards，可撓曲電路板)產業所 使用之製程（光-沉積(photo-deposition)、蝕刻（etching)、及 電鍍(plating))，諸如電阻器、電容器、與積體電路之多個 ________14_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝 ^*r*»JI. --線· 580712 A7 __B7__ 五、發明說明（U ) 構件係可置放於相同基板以形成微小型的電路組件。 可用於諸如爲運用於射頻者(典型範圍爲100 KHz至100 MHz)之高頻電路的電感器與變壓器係可根據前述實施例所 構成。鐵磁性的厚板5〇係有利爲由一薄層的鐵氧體材料所 形成，該鐵氧體材料具有典型的導磁率爲於100至10,000 之範圍以及電阻率爲於1，000 ohm/cm (歐姆/公分）至1〇9 〇hm/cm之範圍。典型的鐵氧體組成物包括氧化鐵（ferric oxide)與亞力可（鋁鎳鈷磁鐵）(alnico)。該等鐵氧體材料具 有一足夠高的電阻率，俾使穿過厚板之電鍍的通孔係彼此 爲絕緣。如此構成之變壓器與電感器係適用於小型化。其 係免除對於複雜的接腳或引線架之需求。因此，其具有直 徑爲〇·〇3英吋的通孔之一長度爲1.5英吋、寬度爲1英 吋、以及厚度爲〇_〇5英吋的厚板係可提供用於二或多個變 壓器之鐵心。鐵磁性的厚板係可爲極小。於頂與底表面之 上的表面墊係形成連接，且係可直接表面安裝至PCB者， 因此降低該裝置之佔有面積(footprint)而讓出較多的空間給 其他構件。所計劃的繞組係爲於二個平行的平面。因此， 一種典型應用之十（1〇)層的平面變壓器裝置之繞組係可降 低整體高度爲五(5)之因數。鐵磁性的厚板係可爲極小，例 如爲0.05英吋，使得本發明之電感器與變壓器係可爲實質 構成於一個極薄的平面而非爲一個三維的E型鐵心結構， 因此以一大的因數而進一步降低整體高度。 息有高棒曲密度與最小渦流的變懕器/電感器之更多的鮫佳 實施例 _____15___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ----I----I----· I I (請先閱讀背面之注意事項再填寫本頁) 訂： :線- 580712 A7 _B7____ 五、發明說明（丨）） 諸如低頻的功率變壓器之許多的電感裝置係要求鐵心 具有相當高的相對導磁率，典型爲於10,000至100,000之 範圍。然而，由該等較佳實施例所訴諸的改良係可應用至 較低或較高的値，例如1，000至1，000,000之一範圍。某些 金屬與金屬合金係提供此等高撓曲密度，其包括:鋼、鐵、 石夕鐵、78高導磁合金（permalloy)、鎳鐵高導磁合金 (mumetal)、淨化（purified)鐵、與超導磁合金 (supennalloy)。雖然此等高撓曲密度係可提供獨特的優點 以構成變壓器與電感器，低電阻率之金屬係允許感應的渦 流爲流通，其妨礙該較高磁通密度之裨益。由流通於一金 t 屬鐵心之磁通所引起的感應渦流300係說明於第13圖。運 用金屬作爲鐵心之現今的變壓器/電感器係通常降低此等渦 流，藉著構成由疊層金屬E型條帶(strip)所作成之環形或E 型鐵心，各個條帶係爲由某些型式的介電接合材料所分 離。整個E型鐵心係含有多個該種條帶，以形成完整的鐵 心。藉由此種結構，渦流係限制於各個條帶之橫截面積。 如下文所述，本發明之一個重大特點係欲進而降低鐵心截 面積。 本發明之一個實施例的製造(其使得能夠運用鐵磁性的 金屬作爲鐵心材料)係說明於第14-18圖，其中一撓曲電路 或印刷電路板290係支撐一組的疊合薄金屬環形環部，其 爲形成於FLEX或PCB且由介電薄板所分離。於該等環形 環部之中心與外側的電鍍通孔係完成繞於鐵心之電氣匝。 如下所述’此實施例係實質使得渦流爲最小化，藉著實質 _____16 _ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -- --------------裳--- (請先閱讀背面之注意事項再填寫本頁) 訂* · --線- 580712 A7 __B7___ 五、發明說明（A) 減小各個疊層鐵心截面的橫截面積。 複數個鐵心疊層係形成’藉著首先疊合鐵磁性金屬之 薄板至一 PCB或FLEX 290且接著蝕刻去除部分之鐵磁性 薄板以形成複數個緊密相隔之窄的連續鐵心段之一圖案。 因此，第14圖顯示具有16個蝕刻鐵心陣列之個別層的 PCB或FLEX 310。將爲理解的是，習知於此技藝中之疊合 與蝕刻製程係通常允許超過個該種陣列之製造，視陣列 與圖案之尺寸而定。有利而言’鐵心陣列315係運用眾所 週知的雙重尺寸製程而作蝕刻，使得相同的陣列係形成於 薄板310之頂部與底部上。 單一個鐵心陣列315之一放大圖係說明於第15圖，其 顯示具有16個同心的鐵磁性導電金屬環320a-320p之一個 陣列，金屬環320a-320p係藉由個別的蝕刻空間或空隙 325a-325o所彼此絕緣。同理，在陣列315之外側的區域 330與在最內環320之內的區域335係磁性材料之空隙。 然而，本發明係不限制於一同心環的陣列，且其對於熟習 此技藝人士將爲明顯的是，其他的鐵心陣列係可構成諸如 爲彼此絕緣之一組之接連漸大的方形或矩形者。 下一個製造步驟係實質爲對齊而堆疊複數個PCB與 FLEX層310以及陣列315。如於第16A圖所示，同心環 之鐵心陣列315-315h係逐一堆疊於彼此之頂部上而且對齊 於各層上的鐵心圖案。結果係製造其具有極小的渦流面積 之複數個高磁通承載金屬鐵心。因此，其運用以蝕刻陣列 315之原始薄板的厚度係可爲極薄，典型爲於〇·〇〇〇5”至 ----------._____π___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------裝--- (請先閱讀背面之注意事項再填寫本頁) 訂· · 線· 580712 A7 - " - B7 五、發明說明（f5 ) 0.010”英吋。該等同心環係可運用習用的PCB或 FLEX(FPC)蝕刻技術而蝕刻爲極窄的寬度，其爲〇 〇〇2，，^ 〇.〇〇3”之_。結果，參賴麵，渦 積係尺寸爲顯著減小。 作爲部分之堆疊過程，一薄層的介電材料34〇係置放 相鄰於各個蝕刻同心環陣列的頂表面。典型而言，一環氧 (epoxy)材料係運用。此介電薄板與其支撐蝕刻的鐵磁2 = 之介電薄板係可爲不同的材料。代表性的材料包括其爲由 杜邦羅傑公司（Dupont and R〇gers Corp·)製造的環氧材料跑 壓克力(丙烯酸)(acrylic)，以供製造PCB板與FLEX。環氧 材料與聚脂膠片(prepreg)(以及具有玻璃之環氧材料)係通常 運用以構成PCB板，而壓克力（丙烯酸)係通常運用以製造 FLEX。於疊合期間，第Μ圖所示之空隙325、空隙mo 與空隙335係塡充以第18A與18B圖所示之介電材料 340 ° 如上所述’本發明之較佳實施例的電氣繞組係有利爲 由導電性的通孔所提供，導電性的通孔係接觸於鐵心結構 之二側上的印刷電路。對於第14-18圖之實施例的繞組之 製造步驟係顯示於第17A、17B、18A、與18B圖。 參考第17A與17B圖，另外的銅層350、355係分別 爲疊合於頂與底表面上，且二個另外的介電層360、365係 分離該等銅表面與蝕刻的金屬表面。 所完成的結構係說明於第18A與18B圖，通孔370係 鑽孔穿過整個疊層陣列。此等通孔係位在鄰近(但是典型爲 ___________18 _ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ϋ n ϋ I ϋ ϋ I ϋ n ϋ ϋ ϋ I ϋ I ·*3^ (請先閱讀背面之注意事項再填寫本頁) 訂： :線· 580712 A7 _B7 ___ 五、發明說明（Μ ) 非接觸)於低電阻率的鐵磁性環，藉以電氣絕緣由電鍍通孔 所設置之繞組諸匝。接著，此等孔370係電鍍以一種導電 材料，其典型爲銅。於通孔內的導電性油墨與導電性塗料 係亦可運用。銅層350、355係接著蝕刻以形成電路圖案， 其電氣接觸該等電鍍的通孔370,以供形成繞於該等同心 環的鐵心陣列315之繞組。 爲了說明之簡化，於第18A與18B圖所示之實施例係 說明針對各個變壓器之一小數目的通孔370a、370b、370c 與370d。對於熟悉此技藝人士係爲顯明的是，第14-18圖 之該等實施例係可具有多個繞組，藉著加上另外的通孔。 若需要時，另外的銅層係可爲堆疊於層350、355之上，以 提供對於另外的通孔之必要連接。 個別的變壓器與電感器裝置係抽取自第18A、18B圖 之疊層的陣列’藉者電路小片(die)”切割或路由(routing) 自該陣列的零件之常用方法。各個該種裝置係可運用作爲 對於第1與13圖所示之傳統的電感裝置之一替代者。此 外，因爲紗刻的盘屬鐵心係§者如第16圖所示之一個陣列的 部分者，其係可互連至其他的構件。 較佳實施使L之優& 一件式(〇收Piece)鐵心： 如第1圖所示，於E型鐵心結構中，一個間隙係形成 於E型鐵心與蓋部之間，其係無法避免。大部分的變壓器 係運用E型鐵心，其需運用例如環氧樹脂與鉗固而將一半 之鐵心接合至另一半者。此等製程係耗時，引入損失，且 — —________19 _ 尺度適用中國國家ί票準（CNS)A4規格（210 X 297公—--- (請先閱讀背面之注意事項再填寫本頁) —裝 訂· · --線- 580712 B7 五、發明說明（（7 ) 歸因於介於E型鐵心與蓋部之間的造成間隙而引起於裝置 之參數的變動。反之，本發明之較佳實施例的鐵心係一種 連續件，因而提供改良的變壓器效率。一件式設計亦免除 於分離處理步驟中之將二個分離件接合在一起的需要。 若一個有意的間隙係期望於第118圖之實施例中以 避免磁飽和，一分離係可蝕刻於第15圖所示之該等同心環 的各者。該等蝕刻間隙環係消除E型鐵心之傳統機械分離 的大變化。 渦流之降低: 以第14-18圖之方式所構成的電感器與變壓器係提供 優越性能而具有較少許多的渦流，藉著分離該等金屬疊層 於二個方向。此舉係造成，因爲所示的較佳實施例具有其 爲較薄於習用疊層鐵心者之一鐵心，憑藉著事實:(a)環320 爲蝕刻自其之該等金屬薄片係可運用PCB或者FLEX製造 材料而爲較薄許多，以及(b)個別的絕緣環320係可作成極 窄。由於渦流係正比於節段橫截面積的平方，較佳實施例 係可相較於製造變壓器或電感器之傳統的方法而大爲降低 渦流。舉例而言，參考於第1圖所示之傳統的E型鐵心， 此鐵心之金屬疊層係無法分離於二個方向，因爲該等條帶 (strip)係將解散或者完全不具有機械整體性。 表面安裝： 根據較佳實施例所形成之繞組係可爲形成至表面安裝 引線，而無需單獨的引線架(lead-frame)結構、複雜的接腳 處理(pinning)、或末端電鍍處理(end plating)。 ----—_ ___20_ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ----I----I------- (請先閱讀背面之注意事項再填寫本頁) 訂： 線· 580712 A7 _ ___B7___ 五、發明說明（U) 互連： 因爲蝕刻的變壓器/電感器係運用其爲用以製造PCB 者或FPC者之相同製程而製造，該等變壓器係可有利爲電 源供應器或電路組件之一個整體部分，因而減小實際尺 寸、減少連接、及通常使得該組件爲更緊密與更小。電路 構件係可直接置放在蝕刻的變壓器之上方或下方，運用變 壓器面積作爲載體以用於電路之平衡，使得整個電路之面 積係將爲如同該變壓器之面積一般小。 磁性穩固（Sound): 根據較佳實施例所構成之鐵心係提供較有效率的磁通 路徑，並且具有相較於傳統變壓器爲少的損失。此等特徵 係極密切類似於一種環形者之設計與作用。該磁通路徑係 相較於其運用諸如E鐵心與PQ鐵心之傳統鐵心者的同等 變壓器爲短。 尺寸： 較佳實施例係可作成較小，因爲其不需要複雜的接腳 或引線架。於該頂與底表面之上的表面墊係形成其本身之 連接，且其可直接爲表面連接至PCB者，因此減小該裝置 之佔有面積而讓出較多的空間給其他構件。繞組係爲於2 平面，因此，一種典型應用之十（1〇)層的平面變壓器裝置 之繞組係可降低整體高度爲五(5)之因數。該種“鐵心”係 於一個平面而非爲一個三維的E形鐵心結構，進而爲以一 個大的因數而降低整體高度。 成本： -----21 __—_ ____ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ___— — — — — — — — —— ___ (請先閱讀背面之注意事項再填寫本頁) · · 線- 580712 A7 __B7 五、發明說明（C ) 較佳實施例係可由撓曲電路所作成’且相較於多層的 平面繞組而言係極爲不昂貴以製造。此外’其係免除對於 引線架、嵌裝(potting)、以及蓋部黏固之需要，因此使得 該裝置爲較易於製造。 熱移除： 根據本發明之較佳實施例所構成之電感器與變壓器的 一個重要特點係在於，其熱產生繞組係非如同傳統變壓器 一般之埋藏於一個組件內或者繞於彼此的頂部上而且非爲 如同平面變壓器一般之堆疊在一起。反之，所電鍍的繞組 係實質爲位於該種變壓器或電感器裝置之頂與底平面上。 此種佈局(layout)係提供優越的散熱，而並無陷入的熱量爲 埋藏於繞組內。該PCB係可有利爲附接至一散熱座，僅係 由典型爲僅僅0.005英吋厚之一薄的防焊膜(solder mask)所 分離，置放一半之繞組以與散熱座爲熱接觸，藉以提供一 優越的表面積對熱量比値。第12圖顯示供優良的熱移除之 大表面積230的一個實例，直接安裝至諸如銅與鋁之一個 散熱板232。 儘管本發明係已參照某些較佳實施例而敘述於本文， 此等實施例係僅藉由舉例而提出，且並非以限制本發明之 範疇。是以，本發明之範疇係應僅爲依據隨附之申請專利 範圍所界定。 22 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --裝580712 A7 __El__ 5. Description of the invention (丨 丨) The above-mentioned embodiment of the present invention (which has a conductive through-hole through a magnetic thick plate) uses Ampere's law in a very novel way. The through-hole is formed in such a way that a magnetic flux path is allowed to exist between two windings formed on the substrate. As shown in Fig. 3A, any surrounding path system that falls within the inner through hole 68 will contain a net current of zero ，, so that these path systems will not have magnetic flux. Any path surrounding the outer through-holes 56 will also contain a zero current, because the inner through-holes 68 have a current that is equal to and reverses one of the currents flowing through the outer through-holes 56. Zero magnetic flux is generated in a region surrounding the outer through holes 56. However, the surrounding path between the inner through-holes 68 and the outer through-holes 56 is due to the surroundings of the inner through-holes 68 and will have a net magnetic flux. The other path system that partially surrounds the inner through-hole 68 or the outer through-hole 56 will not have a significant magnetic flux because the magnetic flux system is similar to a current and the shortest actual path will be selected. Therefore, this structure will behave very similarly to the toroidal core of Fig. 2A, but will be shown as a virtual ring 62. It will be apparent that the proper selection of the through-holes enables a variety of virtual cores of different shapes and the configuration of the cores on the substrate. Therefore, many independent magnetic circuit systems can be formed on the same substrate. Because of this, it is possible to form a more complex circuit than simple inductors and transformers. By properly placing the vias and circuit conductors on the top surface 52 of the ferromagnetic thick plate 50 shown in FIG. 3 and底 表面 54。 The bottom surface 54. For example, processes (photo-deposition, etching, and plating) used in the conventional PCB and flexible circuit boards industries (photo-deposition, etching, and plating), such as resistors Multiple capacitors, capacitors, and integrated circuits ________14_ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) Installation ^ * r * »JI.-Line · 580712 A7 __B7__ 5. Description of the Invention (U) The component system can be placed on the same substrate to form a miniature circuit assembly. Inductors and transformers that can be used in high-frequency circuits such as those used in radio frequencies (typically in the range of 100 KHz to 100 MHz) can be constructed according to the foregoing embodiments. The ferromagnetic thick plate 50 is advantageously formed of a thin layer of ferrite material, which has a typical magnetic permeability in the range of 100 to 10,000 and a resistivity of 1,000 ohm / cm (Ohm / cm) to 109 hm / cm. Typical ferrite compositions include ferric oxide and alnico. These ferrite materials have a sufficiently high resistivity that the plated through-holes through the thick plates are insulated from each other. The transformer and inductor thus constructed are suitable for miniaturization. It eliminates the need for complex pins or lead frames. Therefore, one of the through holes having a diameter of 0.03 inches is 1.5 inches in length, 1 inch in width, and 0_05 inches in thickness. The core of the transformer. The ferromagnetic thick plate system can be extremely small. The surface pads on the top and bottom surfaces form a connection and can be directly surface-mounted to the PCB, thus reducing the footprint of the device and allowing more space for other components. The planned windings are in two parallel planes. Therefore, the winding system of a plane transformer device of ten (10) layers in a typical application can reduce the overall height by a factor of five (5). The ferromagnetic thick plate system can be extremely small, for example, 0.05 inches, so that the inductor and transformer system of the present invention can be substantially formed on a very thin plane instead of a three-dimensional E-shaped core structure, so a large Factor to further reduce the overall height. More good examples of transformers / inductors with high bar curvature density and minimum eddy current _____15___ This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ---- I ---- I ---- · II (Please read the precautions on the back before filling this page) Order:: Wire-580712 A7 _B7____ V. Description of the Invention (丨)) Many inductive devices such as low-frequency power transformers The core is required to have a relatively high relative permeability, typically in the range of 10,000 to 100,000. However, the improvements referred to by these preferred embodiments can be applied to lower or higher levels, such as in the range of 1,000 to 1,000,000. Certain metals and metal alloys provide these high deflection densities, including: steel, iron, Shi Xi iron, 78 high magnetic permeability alloy (permalloy), nickel-iron high magnetic permeability alloy (mumetal), purified (purified) iron , And a superconducting magnetic alloy (supennalloy). Although these high deflection density systems can provide unique advantages for forming transformers and inductors, low resistivity metal systems allow induced eddy currents to flow, which hinders the benefits of this higher magnetic flux density. The induced eddy current 300 caused by a magnetic flux flowing through a metal-t-type iron core is illustrated in FIG. 13. Today's transformer / inductor systems that use metal as the core usually reduce these eddy currents. By forming a ring or E-shaped core made of laminated metal E-strips, each strip is made of certain types Separated by a dielectric bonding material. The entire E-shaped core system contains a plurality of such strips to form a complete core. With this structure, the vortex system is limited to the cross-sectional area of each strip. As described below, a significant feature of the present invention is to further reduce the core cross-sectional area. The fabrication of an embodiment of the invention (which enables the use of ferromagnetic metals as the core material) is illustrated in Figures 14-18, where a flex circuit or printed circuit board 290 supports a set of stacked thin metal rings The ring portion is formed on a FLEX or PCB and is separated by a dielectric sheet. The plated through-holes at the center and outside of these annular rings complete the electrical turns around the core. As described below, 'This embodiment essentially minimizes eddy currents. By virtue of the essence _____16 _ This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)--------- ------ Shang --- (Please read the precautions on the back before filling in this page) Order * · --- Line 580712 A7 __B7___ V. Description of the invention (A) Reduce the cross section of each laminated core section area. A plurality of cores are laminated to form a pattern by first laminating a sheet of ferromagnetic metal to a PCB or FLEX 290 and then etching to remove a portion of the ferromagnetic sheet to form one of a plurality of closely spaced, continuous core segments. Therefore, Figure 14 shows a PCB or FLEX 310 with individual layers of 16 etched core arrays. It will be understood that the stacking and etching processes known in the art generally allow the manufacture of more than one such array, depending on the size of the array and pattern. Advantageously, the 'core array 315' is etched using a well-known dual-size process so that the same array is formed on the top and bottom of the sheet 310. An enlarged view of a single iron core array 315 is illustrated in FIG. 15, which shows an array of 16 concentric ferromagnetic conductive metal rings 320a-320p. The metal rings 320a-320p are formed by individual etching spaces or voids 325a. -325o are insulated from each other. Similarly, the area 330 outside the array 315 and the area 335 inside the innermost ring 320 are gaps of magnetic material. However, the present invention is not limited to the array of concentric rings, and it will be apparent to those skilled in the art that other iron core array systems may form successively larger squares or rectangles such as a group insulated from each other. . The next manufacturing step is to stack a plurality of PCB and FLEX layers 310 and an array 315 substantially in alignment. As shown in FIG. 16A, the core arrays 315-315h of the concentric rings are core patterns stacked on top of each other and aligned on each layer. As a result, a plurality of high-flux-bearing metal cores having extremely small eddy current areas were manufactured. Therefore, the thickness of the original sheet used in the etching array 315 can be extremely thin, which is typically from 0.005 ”to ----------. _____ π ___ This paper size applies Chinese national standards ( CNS) A4 specification (210 X 297 mm) -------------- Packing --- (Please read the precautions on the back before filling this page) Order · · Line · 580712 A7- "-B7 V. Description of Invention (f5) 0.010 "inches. The equivalent core ring system can be etched to a very narrow width by using conventional PCB or FLEX (FPC) etching technology, which is _2002, ^ _. 0.03 ". As a result, the reference surface, vortex The size of the product system is significantly reduced. As part of the stacking process, a thin layer of dielectric material 34 is placed adjacent to the top surface of each etched concentric ring array. Typically, an epoxy material system Application. This dielectric sheet and its supporting ferromagnetic 2 = dielectric sheet system can be different materials. Representative materials include epoxy made by Dupont and Rogers Corp. Materials run acrylic (acrylic) for manufacturing PCB boards and FLEX. Epoxy materials and prepreg (and epoxy materials with glass) are commonly used to form PCB boards, and acrylic Force (acrylic) is usually used to make FLEX. During superposition, the voids 325, mo and 335 shown in Fig. M are filled with the dielectric material 340 shown in Figs. 18A and 18B as described above. 'The electrical winding system of the preferred embodiment of the present invention is advantageously a conductive via Provided, the conductive vias are in contact with the printed circuit on the two sides of the core structure. The manufacturing steps for the windings of the embodiment of Figures 14-18 are shown in Figures 17A, 17B, 18A, and 18B. Refer to Figure 17A and 17B, the other copper layers 350 and 355 are superimposed on the top and bottom surfaces, respectively, and two additional dielectric layers 360 and 365 are used to separate the copper surface from the etched metal surface. The structure is illustrated in Figures 18A and 18B. Through-holes 370 are drilled through the entire stacked array. These through-holes are located adjacent to each other (but typically ___________18 _. This paper size applies to China National Standard (CNS) A4 specifications. (210 X 297 mm) ϋ n ϋ I ϋ ϋ I ϋ n ϋ ϋ ϋ I ϋ I · * 3 ^ (Please read the notes on the back before filling out this page) Order:: line · 580712 A7 _B7 ___ V. DESCRIPTION OF THE INVENTION (M) Non-contact) in a low-resistivity ferromagnetic ring to electrically insulate windings provided by plated through holes. Then, these holes 370 are plated with a conductive material, which is typically copper. Conductive inks and conductive paints in through holes can also be used. Copper layer 3 50 and 355 are then etched to form a circuit pattern, which electrically contacts the plated through-holes 370 for forming windings of the core array 315 wound around the equivalent core ring. For simplicity of illustration, it is shown in Figures 18A and 18B. The illustrated embodiment illustrates a small number of through holes 370a, 370b, 370c, and 370d for each of the transformers. It is obvious to those skilled in the art that the embodiments of Figures 14-18 may have multiple Winding by adding additional through holes. If desired, additional copper layers can be stacked on layers 350, 355 to provide the necessary connections for additional vias. Individual transformer and inductor devices are common methods of cutting or routing parts of the array drawn from the stacked array 'borrow circuit die' of Figures 18A and 18B. Each of these devices can be It is used as an alternative to the traditional inductive device shown in Figures 1 and 13. In addition, because the engraved disk is part of an array as shown in Figure 16, it can be interconnected To other components. The best implementation is to make the L &P; one-piece (0 pick) core: As shown in Figure 1, in the E-type core structure, a gap is formed between the E-type core and the cover. In the meantime, it is unavoidable. Most transformers use E-type iron cores, which require the use of epoxy resin and clamps to join half of the cores to the other half. These processes are time consuming, introduce losses, and— —________ 19 _ The scale is applicable to China National Standard for Tickets (CNS) A4 (210 X 297) — (--Please read the precautions on the back before filling this page) — Binding · ·-Thread- 580712 B7 V. Invention Explanation ((7) is attributed between the E-shaped core and the cover The gap causes changes in the parameters of the device. Conversely, the core of the preferred embodiment of the present invention is a continuous piece, thus providing improved transformer efficiency. The one-piece design also eliminates the need to separate the two in the separation process step. The need to join the pieces together. If a deliberate gap is desired in the embodiment of Fig. 118 to avoid magnetic saturation, a separation system can be etched on each of the equivalent heart rings shown in Fig. 15. Such etchings The gap ring system eliminates the large changes in the traditional mechanical separation of the E-type iron core. Reduction of eddy current: The inductor and transformer system constructed as shown in Figures 14-18 provide superior performance and have many fewer eddy currents. The metal is stacked in two directions. This is caused because the preferred embodiment shown has a core that is thinner than a conventional laminated core, relying on the fact that (a) ring 320 is etched from it These metal foils can be made much thinner using PCB or FLEX manufacturing materials, and (b) the individual insulation ring 320 can be made extremely narrow. Because the eddy current system is proportional to the square of the cross-sectional area of the segment, The preferred embodiment can greatly reduce eddy current compared to the traditional method of manufacturing transformers or inductors. For example, referring to the traditional E-type core shown in Figure 1, the metal stack of this core cannot be separated In both directions, the strips will dissolve or have no mechanical integrity at all. Surface Mount: The winding system formed according to the preferred embodiment can be formed to surface mount leads without the need for separate leads. Lead-frame structure, complex pinning, or end plating. ----—_ ___20_ This paper size applies to China National Standard (CNS) A4 (210 X 297) (Li) ---- I ---- I ------- (Please read the notes on the back before filling this page) Order: Line · 580712 A7 _ ___B7___ V. Description of Invention (U) Interconnection: Because etched transformers / inductors are manufactured using the same process used to make PCBs or FPCs, these transformers can be an integral part of the power supply or circuit assembly, thus reducing the actual size, reducing Connect, and usually make the component Close and smaller. The circuit components can be placed directly above or below the etched transformer, using the transformer area as a carrier for circuit balancing, so that the area of the entire circuit will be as small as the area of the transformer. Sound: The core system constructed according to the preferred embodiment provides a more efficient magnetic flux path and has less losses than conventional transformers. These features are very similar to the design and function of a ring. This magnetic flux path is shorter than that of an equivalent transformer using a conventional core such as an E core and a PQ core. Size: The preferred embodiment can be made smaller because it does not require complicated pins or lead frames. The surface pads on the top and bottom surfaces form their own connections, and they can be directly connected to the PCB surface, thus reducing the footprint of the device and allowing more space for other components. The winding system is in 2 planes. Therefore, a typical application of ten (10) layers of planar transformer device winding system can reduce the overall height by a factor of five (5). This "iron core" is attached to a flat surface instead of a three-dimensional E-shaped core structure, which further reduces the overall height by a large factor. Cost: ----- 21 __—_ ____ This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) ___ — — — — — — — — — ___ (Please read the note on the back first Please fill in this page again for the matters) · · Wire-580712 A7 __B7 V. Description of the Invention (C) The preferred embodiment is made of a flex circuit 'and is extremely inexpensive compared to multilayer planar windings to manufacture. In addition, it eliminates the need for lead frames, potting, and lidding, thereby making the device easier to manufacture. Thermal removal: An important feature of inductors and transformers constructed in accordance with a preferred embodiment of the present invention is that their heat generating windings are not buried in a component or wound on top of each other like traditional transformers and They are not stacked like planar transformers. In contrast, the plated windings are essentially located on the top and bottom planes of such a transformer or inductor device. This layout provides superior heat dissipation, without the heat trapped inside the windings. The PCB can be advantageously attached to a heat sink, separated only by a thin solder mask, which is typically only 0.005 inches thick, with half of the winding placed in thermal contact with the heat sink. Thereby providing a superior surface area to heat ratio. Figure 12 shows an example of a large surface area 230 for excellent heat removal, mounted directly to a heat sink 232 such as copper and aluminum. Although the invention has been described herein with reference to certain preferred embodiments, these embodiments have been presented by way of example only, and are not intended to limit the scope of the invention. Therefore, the scope of the present invention should be defined only based on the scope of the accompanying patent application. 22 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)-