JP2009535848A - シールド型可撓性回路及びその製造方法 - Google Patents

シールド型可撓性回路及びその製造方法 Download PDF

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Publication number
JP2009535848A
JP2009535848A JP2009509606A JP2009509606A JP2009535848A JP 2009535848 A JP2009535848 A JP 2009535848A JP 2009509606 A JP2009509606 A JP 2009509606A JP 2009509606 A JP2009509606 A JP 2009509606A JP 2009535848 A JP2009535848 A JP 2009535848A
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Japan
Prior art keywords
conductive
flexible
conductor
support member
conductors
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Pending
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JP2009509606A
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English (en)
Japanese (ja)
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JP2009535848A5 (enExample
Inventor
デイル ウェッセルマン
チャールズ イー． タプスコット
Original Assignee
マルティ−ファインライン エレクトロニクス インコーポレイテッド
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Publication of JP2009535848A publication Critical patent/JP2009535848A/ja
Publication of JP2009535848A5 publication Critical patent/JP2009535848A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2009509606A 2006-05-02 2007-04-26 シールド型可撓性回路及びその製造方法 Pending JP2009535848A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US79671606P 2006-05-02 2006-05-02
US81192706P 2006-06-08 2006-06-08
US11/739,550 US7645941B2 (en) 2006-05-02 2007-04-24 Shielded flexible circuits and methods for manufacturing same
PCT/US2007/010009 WO2007133405A2 (en) 2006-05-02 2007-04-26 Shielded flexible circuits and methods for manufacturing same

Publications (2)

Publication Number Publication Date
JP2009535848A true JP2009535848A (ja) 2009-10-01
JP2009535848A5 JP2009535848A5 (enExample) 2010-05-20

Family

ID=38694381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009509606A Pending JP2009535848A (ja) 2006-05-02 2007-04-26 シールド型可撓性回路及びその製造方法

Country Status (4)

Country Link
US (2) US7645941B2 (enExample)
JP (1) JP2009535848A (enExample)
KR (1) KR20090008405A (enExample)
WO (1) WO2007133405A2 (enExample)

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KR101301105B1 (ko) * 2011-11-02 2013-08-27 포항공과대학교 산학협력단 선박용 전송선로
JP2013187248A (ja) * 2012-03-06 2013-09-19 Nec Computertechno Ltd 誘電体フィルム、プリント基板、および特性インピーダンスの調整方法
JP2021534400A (ja) * 2018-08-16 2021-12-09 マイクロ モーション インコーポレイテッド 電磁干渉耐性電子機器筐体

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KR20100104911A (ko) * 2009-03-19 2010-09-29 삼성전자주식회사 반도체 패키지
TWI387407B (zh) * 2009-06-10 2013-02-21 Htc Corp 軟式印刷電路板其及組成方法
CN101932188B (zh) * 2009-06-18 2013-05-08 宏达国际电子股份有限公司 柔性印刷电路板及其组成方法
US20110024160A1 (en) 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US8127432B2 (en) 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US8362856B2 (en) * 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
US9799426B2 (en) 2012-11-08 2017-10-24 3M Innovative Properties Company Ribbed high density electrical cable
KR101705973B1 (ko) * 2015-04-22 2017-02-13 연세대학교 산학협력단 유전체 전자기파 차폐막
CN106376169A (zh) * 2015-07-24 2017-02-01 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
KR102478673B1 (ko) * 2016-05-24 2022-12-19 엘지디스플레이 주식회사 케이블 및 두루마리형 연성표시장치
JP7390779B2 (ja) * 2017-04-28 2023-12-04 日東電工株式会社 フレキシブル配線回路基板および撮像装置
EP3729916A1 (en) * 2018-03-16 2020-10-28 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
KR102369036B1 (ko) * 2018-07-06 2022-03-02 텐류세이키 가부시키가이샤 전송선로, 전송선로의 제조 방법 및 전송선로의 제조 장치
CN113973420B (zh) * 2020-07-22 2024-05-31 庆鼎精密电子（淮安）有限公司 软硬结合板及软硬结合板的制作方法
WO2023075141A1 (ko) * 2021-10-27 2023-05-04 삼성전자 주식회사 Rf 케이블을 포함하는 전자 장치
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301105B1 (ko) * 2011-11-02 2013-08-27 포항공과대학교 산학협력단 선박용 전송선로
JP2013187248A (ja) * 2012-03-06 2013-09-19 Nec Computertechno Ltd 誘電体フィルム、プリント基板、および特性インピーダンスの調整方法
JP2021534400A (ja) * 2018-08-16 2021-12-09 マイクロ モーション インコーポレイテッド 電磁干渉耐性電子機器筐体
JP7194807B2 (ja) 2018-08-16 2022-12-22 マイクロ モーション インコーポレイテッド 電磁干渉耐性電子機器筐体

Also Published As

Publication number Publication date
WO2007133405A2 (en) 2007-11-22
HK1131718A1 (en) 2010-01-29
US7645941B2 (en) 2010-01-12
US20100071935A1 (en) 2010-03-25
WO2007133405A3 (en) 2008-12-11
KR20090008405A (ko) 2009-01-21
US20080202807A1 (en) 2008-08-28

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