JP4414365B2 - 高速伝送用基板 - Google Patents
高速伝送用基板 Download PDFInfo
- Publication number
- JP4414365B2 JP4414365B2 JP2005118152A JP2005118152A JP4414365B2 JP 4414365 B2 JP4414365 B2 JP 4414365B2 JP 2005118152 A JP2005118152 A JP 2005118152A JP 2005118152 A JP2005118152 A JP 2005118152A JP 4414365 B2 JP4414365 B2 JP 4414365B2
- Authority
- JP
- Japan
- Prior art keywords
- speed transmission
- substrate
- wire
- signal lines
- conductive plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0838—Parallel wires, sandwiched between two insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Conductors (AREA)
- Structure Of Printed Boards (AREA)
Description
11 信号線
11a 芯線
11b 被覆部材
12、13、14、15 基板部材
12a、13a、14a、15a 誘電体基板
12b、13b、14b、15b 導電板
16 ドレイン線
Claims (2)
- (a)誘電体から成る硬質の板材と、
(b)該板材の両面に形成された薄膜状の導電層と、
(c)前記板材内に埋設された電線とを有し、
(d)該電線は、導電体から成る芯線及び該芯線の周囲を覆う絶縁性の被覆部材を備える高速伝送用基板であって、
(e)前記板材内に埋設されたドレイン線を更に有し、該ドレイン線は前記電線の間に配設されていることを特徴とする高速伝送用基板。 - 前記電線は、二本で一組と成るように配設され、同一の組内における電線同士は相互に接触し、隣接する組同士の間に前記ドレイン線が配設される請求項1に記載の高速伝送用基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005118152A JP4414365B2 (ja) | 2005-04-15 | 2005-04-15 | 高速伝送用基板 |
PCT/US2006/014546 WO2006113702A1 (en) | 2005-04-15 | 2006-04-17 | High-speed transmission board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005118152A JP4414365B2 (ja) | 2005-04-15 | 2005-04-15 | 高速伝送用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006302519A JP2006302519A (ja) | 2006-11-02 |
JP4414365B2 true JP4414365B2 (ja) | 2010-02-10 |
Family
ID=36694101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005118152A Expired - Fee Related JP4414365B2 (ja) | 2005-04-15 | 2005-04-15 | 高速伝送用基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4414365B2 (ja) |
WO (1) | WO2006113702A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5535901B2 (ja) * | 2008-04-25 | 2014-07-02 | 沖電線株式会社 | 高速伝送が可能なシールド付きフラットケーブル |
SG176904A1 (en) | 2009-06-19 | 2012-01-30 | 3M Innovative Properties Co | Shielded electrical cable and method of making |
US9685259B2 (en) | 2009-06-19 | 2017-06-20 | 3M Innovative Properties Company | Shielded electrical cable |
CN102870169B (zh) | 2010-08-31 | 2016-02-17 | 3M创新有限公司 | 屏蔽电缆的连接器布置方式 |
CN102884592B (zh) | 2010-08-31 | 2017-12-26 | 3M创新有限公司 | 具有电介质间距的屏蔽电缆 |
EP2685466B1 (en) | 2010-08-31 | 2019-11-20 | 3M Innovative Properties Company | Cable assembly |
CN106098189B (zh) | 2010-08-31 | 2018-04-24 | 3M创新有限公司 | 双轴构型的屏蔽电缆 |
US10147522B2 (en) | 2010-08-31 | 2018-12-04 | 3M Innovative Properties Company | Electrical characteristics of shielded electrical cables |
KR101759764B1 (ko) | 2010-08-31 | 2017-07-19 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 고밀도 차폐 전기 케이블 및 기타 차폐 케이블, 시스템 및 방법 |
CN103119661B (zh) | 2010-09-23 | 2015-08-19 | 3M创新有限公司 | 屏蔽电缆 |
KR102012385B1 (ko) * | 2018-12-13 | 2019-08-20 | 주식회사 토마스 케이블 | 2중 자켓층을 이용한 클램프형 케이블 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5360944A (en) * | 1992-12-08 | 1994-11-01 | Minnesota Mining And Manufacturing Company | High impedance, strippable electrical cable |
US6444902B1 (en) * | 2001-04-10 | 2002-09-03 | Hon Hai Precision Ind. Co., Ltd. | Electrical cable |
-
2005
- 2005-04-15 JP JP2005118152A patent/JP4414365B2/ja not_active Expired - Fee Related
-
2006
- 2006-04-17 WO PCT/US2006/014546 patent/WO2006113702A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2006302519A (ja) | 2006-11-02 |
WO2006113702A1 (en) | 2006-10-26 |
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