KR20080066609A - 복합 전자 부품 - Google Patents
복합 전자 부품 Download PDFInfo
- Publication number
- KR20080066609A KR20080066609A KR1020080003463A KR20080003463A KR20080066609A KR 20080066609 A KR20080066609 A KR 20080066609A KR 1020080003463 A KR1020080003463 A KR 1020080003463A KR 20080003463 A KR20080003463 A KR 20080003463A KR 20080066609 A KR20080066609 A KR 20080066609A
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- KR
- South Korea
- Prior art keywords
- ground electrode
- electrode layer
- hot
- electronic component
- electrode
- Prior art date
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- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 60
- 239000004020 conductor Substances 0.000 description 33
- 239000002346 layers by function Substances 0.000 description 32
- 239000003990 capacitor Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Abstract
Description
전자부품(#1) | 정전 용량(pF) | 전자부품(#2) | 정전 용량(pF) |
CH1 | 22.3 | CH1 | 22.3 |
CH2 | 22.9 | CH2 | 28.2 |
CH3 | 23.2 | CH3 | 27.8 |
CH4 | 22.5 | CH4 | 22.5 |
Claims (5)
- 복합 전자 부품에 있어서,전극층을 포함하는 제 1 적층부, 및상기 제 1 적층부에 겹치고, 그라운드 전극이 형성된 그라운드 전극층과 핫 전극이 형성된 핫 전극층을 적어도 1층씩 포함하는 제 2 적층부를 구비하고,상기 제 2 적층부에서, 상기 제 1 적층부에 가장 가까운 상기 그라운드 전극층과 상기 제 1 적층부의 사이에는 상기 핫 전극층이 개재하고 있고, 또한, 상기 제 1 적층부에 가장 가까운 상기 그라운드 전극층의 상기 그라운드 전극 중, 상기 핫 전극으로부터 상기 제 1 적층부측으로 노출되어 있는 노출 부분의 적어도 일부가, 노출되어 있지 않는 비노출 부분의 폭보다도 좁은 협소부로 되어 있는, 복합 전자 부품.
- 제 1 항에 있어서,상기 제 1 적층부는 인덕터가 형성된 인덕터부인, 복합 전자 부품.
- 제 1 항 또는 제 2 항에 있어서,상기 핫 전극층에는 복수의 상기 핫 전극이 형성되어 있고,상기 그라운드 전극의 상기 협소부는 이웃하는 2 개의 상기 핫 전극의 사이에 형성되어 있는, 복합 전자 부품.
- 제 3 항에 있어서,상기 그라운드 전극은 직선형으로 연장된 형상을 갖고 있고, 상기 그라운드 전극의 양 단부를 연결하는 가상선 상에 상기 협소부가 형성되어 있는, 복합 전자 부품.
- 제 4 항에 있어서,상기 그라운드 전극의 상기 협소부의 폭이, 상기 그라운드 전극의 양 단부의 폭 이하인, 복합 전자 부품.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-00004903 | 2007-01-12 | ||
JP2007004903A JP4506759B2 (ja) | 2007-01-12 | 2007-01-12 | 複合電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080066609A true KR20080066609A (ko) | 2008-07-16 |
KR100961405B1 KR100961405B1 (ko) | 2010-06-09 |
Family
ID=39617582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080003463A KR100961405B1 (ko) | 2007-01-12 | 2008-01-11 | 복합 전자 부품 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7529077B2 (ko) |
JP (1) | JP4506759B2 (ko) |
KR (1) | KR100961405B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5600247B2 (ja) * | 2008-06-11 | 2014-10-01 | 株式会社村田製作所 | 積層電子部品およびその製造方法 |
KR101032343B1 (ko) * | 2009-05-12 | 2011-05-09 | 삼화콘덴서공업주식회사 | 고전압 mlcc 및 이를 이용한 dc-링크 커패시터 모듈 |
US10510343B2 (en) * | 2014-06-11 | 2019-12-17 | Ademco Inc. | Speech recognition methods, devices, and systems |
Family Cites Families (23)
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JPH0360148A (ja) * | 1989-07-28 | 1991-03-15 | Murata Mfg Co Ltd | 積層型lcr素子 |
JPH07220906A (ja) | 1994-02-02 | 1995-08-18 | Murata Mfg Co Ltd | 複合機能素子 |
JPH0917643A (ja) * | 1995-06-27 | 1997-01-17 | Murata Mfg Co Ltd | チップ積層セラミックフィルタおよび複合部品 |
JP2991175B2 (ja) * | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
JPH11251152A (ja) * | 1998-03-03 | 1999-09-17 | Matsushita Electric Ind Co Ltd | 複合部品およびその製造方法 |
JPH11317311A (ja) * | 1998-03-03 | 1999-11-16 | Matsushita Electric Ind Co Ltd | 複合部品およびその製造方法 |
JP3489728B2 (ja) * | 1999-10-18 | 2004-01-26 | 株式会社村田製作所 | 積層コンデンサ、配線基板および高周波回路 |
JP2003051729A (ja) * | 2001-08-06 | 2003-02-21 | Tdk Corp | 積層型フィルタアレイ |
TWI270195B (en) | 2003-07-30 | 2007-01-01 | Innochips Technology | Complex laminated chip element |
JP4442154B2 (ja) * | 2003-08-13 | 2010-03-31 | 株式会社村田製作所 | 積層型アレイ部品 |
JP2006013154A (ja) * | 2004-06-25 | 2006-01-12 | Tdk Corp | 積層型電子部品 |
JP2006041820A (ja) * | 2004-07-26 | 2006-02-09 | Tdk Corp | 積層型フィルタアレイ |
JP2006041081A (ja) | 2004-07-26 | 2006-02-09 | Mitsubishi Materials Corp | 複合コモンモードチョークコイル及びその製造方法 |
KR20060031943A (ko) | 2004-10-11 | 2006-04-14 | 삼성전기주식회사 | 바리스터-lc필터 겸용 복합소자 |
JP2006140173A (ja) | 2004-11-10 | 2006-06-01 | Maruwa Co Ltd | 複合電子部品 |
JP2006311506A (ja) * | 2005-03-29 | 2006-11-09 | Kyocera Corp | Lcフィルタおよび多連型lcフィルタ |
JP4246716B2 (ja) | 2005-05-02 | 2009-04-02 | Tdk株式会社 | 積層型フィルタ |
JP4276649B2 (ja) * | 2005-09-27 | 2009-06-10 | Tdk株式会社 | 貫通型積層コンデンサアレイ及び貫通型積層コンデンサアレイの実装構造 |
JP4150394B2 (ja) * | 2005-09-29 | 2008-09-17 | Tdk株式会社 | 積層型フィルタの製造方法 |
JP4238251B2 (ja) | 2006-01-20 | 2009-03-18 | Tdk株式会社 | 積層型フィルタ |
JP2007195060A (ja) | 2006-01-20 | 2007-08-02 | Tdk Corp | 積層型フィルタ |
JP4266380B2 (ja) | 2006-02-21 | 2009-05-20 | Tdk株式会社 | 積層型フィルタ |
JP4415986B2 (ja) * | 2006-12-07 | 2010-02-17 | Tdk株式会社 | 積層型電子部品 |
-
2007
- 2007-01-12 JP JP2007004903A patent/JP4506759B2/ja active Active
- 2007-12-31 US US12/003,725 patent/US7529077B2/en active Active
-
2008
- 2008-01-11 KR KR1020080003463A patent/KR100961405B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP4506759B2 (ja) | 2010-07-21 |
US7529077B2 (en) | 2009-05-05 |
JP2008172096A (ja) | 2008-07-24 |
KR100961405B1 (ko) | 2010-06-09 |
US20080170351A1 (en) | 2008-07-17 |
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