KR20070120591A - 도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분 - Google Patents

도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분 Download PDF

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Publication number
KR20070120591A
KR20070120591A KR1020077026042A KR20077026042A KR20070120591A KR 20070120591 A KR20070120591 A KR 20070120591A KR 1020077026042 A KR1020077026042 A KR 1020077026042A KR 20077026042 A KR20077026042 A KR 20077026042A KR 20070120591 A KR20070120591 A KR 20070120591A
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KR
South Korea
Prior art keywords
substrate
article
adhesive
thermosetting adhesive
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020077026042A
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English (en)
Korean (ko)
Inventor
고히찌로 가와떼
앤드류 씨. 로테스
제임스 쥐. 쥬니어 바나
바바라 엘. 비렐
알렉산더 더블유. 바르
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20070120591A publication Critical patent/KR20070120591A/ko
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K3/00—Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof
    • H01K3/32—Auxiliary devices for cleaning, placing, or removing incandescent lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020077026042A 2005-04-11 2006-04-11 도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분 Abandoned KR20070120591A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67014005P 2005-04-11 2005-04-11
US60/670,140 2005-04-11

Publications (1)

Publication Number Publication Date
KR20070120591A true KR20070120591A (ko) 2007-12-24

Family

ID=37087588

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077026042A Abandoned KR20070120591A (ko) 2005-04-11 2006-04-11 도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분

Country Status (6)

Country Link
US (1) US7888604B2 (cg-RX-API-DMAC10.html)
EP (1) EP1875787A2 (cg-RX-API-DMAC10.html)
JP (1) JP2008537338A (cg-RX-API-DMAC10.html)
KR (1) KR20070120591A (cg-RX-API-DMAC10.html)
CN (1) CN101194540B (cg-RX-API-DMAC10.html)
WO (1) WO2006110634A2 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101453328B1 (ko) * 2012-01-02 2014-10-21 박병규 반도체 패키지 및 반도체 패키지 방법
KR20160119566A (ko) * 2015-04-06 2016-10-14 주식회사 아이이에스 전자장치의 제조 방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US20080122119A1 (en) * 2006-08-31 2008-05-29 Avery Dennison Corporation Method and apparatus for creating rfid devices using masking techniques
TWI342063B (en) * 2007-06-08 2011-05-11 Ind Tech Res Inst A bonding structure of flexible films and bonding method therefor
WO2009035958A2 (en) 2007-09-13 2009-03-19 3M Innovative Properties Company Low temperature bonding electronic adhesives
CN101308711B (zh) * 2008-04-29 2010-11-10 深圳典邦科技有限公司 多层结构异方向导电膜及其制备方法
US8675363B2 (en) * 2011-07-26 2014-03-18 Hewlett-Packard Development Company, L.P. Thermal conductors in electronic devices
US10292263B2 (en) * 2013-04-12 2019-05-14 The Board Of Trustees Of The University Of Illinois Biodegradable materials for multilayer transient printed circuit boards
WO2014169170A1 (en) 2013-04-12 2014-10-16 The Board Of Trustees Of The University Of Illinois Inorganic and organic transient electronic devices
US9980394B2 (en) 2013-07-31 2018-05-22 3M Innovative Properties Company Bonding electronic components to patterned nanowire transparent conductors
BR112016010214A2 (pt) 2013-11-06 2017-08-08 3M Innovative Properties Co ?estampas de impressão por microcontato com características funcionais?
US9600106B2 (en) * 2014-12-12 2017-03-21 Innolux Corporation Electronic display module and apparatus using the same
JP5974147B1 (ja) * 2015-07-31 2016-08-23 株式会社フジクラ 配線体アセンブリ、導体層付き構造体、及びタッチセンサ
TWI601229B (zh) 2015-12-25 2017-10-01 韋僑科技股份有限公司 無線射頻識別裝置及其製造方法
US10038264B2 (en) * 2016-11-14 2018-07-31 Microsoft Technology Licensing, Llc Universal coupling for electrically connecting a flexible printed circuit to another flexible printed circuit in multiple different orientations
TWI621993B (zh) 2016-12-19 2018-04-21 韋僑科技股份有限公司 無線射頻識別感測與記錄裝置及其製造方法
CN111867273A (zh) 2019-04-24 2020-10-30 鹏鼎控股(深圳)股份有限公司 电路板连接构造及其制作方法
SE544822C2 (en) * 2021-04-13 2022-12-06 Saab Ab An antenna structure and method for manufacturing the same

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111671A (en) 1978-02-20 1979-09-01 Sharp Kk Connection method between boards
JPS5964685A (ja) * 1982-10-05 1984-04-12 Shin Etsu Polymer Co Ltd 異方導電熱接着性フイルム
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPH0294492A (ja) * 1988-09-30 1990-04-05 Hitachi Ltd 回路基板の接続部構造
JP2680412B2 (ja) 1989-04-27 1997-11-19 住友ベークライト株式会社 異方性導電フィルム
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive
KR930701561A (ko) * 1990-06-08 1993-06-12 게리 엘. 그리스울드 전자 용품용 재처리가능한 접착제
JPH04272607A (ja) 1991-02-26 1992-09-29 Shin Etsu Polymer Co Ltd 潜在性熱硬化型異方導電接着剤
JP3231814B2 (ja) * 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JP2978390B2 (ja) * 1993-12-16 1999-11-15 松下電器産業株式会社 フレキシブルプリント基板と配線基板との接続体の製造方法
US5672400A (en) * 1995-12-21 1997-09-30 Minnesota Mining And Manufacturing Company Electronic assembly with semi-crystalline copolymer adhesive
JPH09139559A (ja) * 1995-11-13 1997-05-27 Minolta Co Ltd 回路基板の接続構造
WO1998003047A1 (fr) * 1996-07-15 1998-01-22 Hitachi Chemical Company, Ltd. Adhesif du type film destine a la connexion d'un circuit et d'une plaquette de circuits
US6034331A (en) * 1996-07-23 2000-03-07 Hitachi Chemical Company, Ltd. Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
KR100568491B1 (ko) * 1997-07-04 2006-04-07 제온 코포레이션 반도체부품 접착제
TW459032B (en) * 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
JP3371894B2 (ja) 1999-09-17 2003-01-27 ソニーケミカル株式会社 接続材料
DE19957789A1 (de) * 1999-12-01 2001-06-21 Leoni Bordnetz Sys Gmbh & Co Kontaktierungssystem für zwei Leiterplatten
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
US6657031B1 (en) * 2000-08-02 2003-12-02 Loctite Corporation Reworkable thermosetting resin compositions
US6703566B1 (en) * 2000-10-25 2004-03-09 Sae Magnetics (H.K.), Ltd. Bonding structure for a hard disk drive suspension using anisotropic conductive film
JP2002146319A (ja) 2000-11-13 2002-05-22 Three M Innovative Properties Co 熱硬化性接着剤及びそれを用いた接着剤フィルム
EP1516031B1 (en) 2002-06-24 2007-08-15 3M Innovative Properties Company Heat curable adhesive composition, article, semiconductor apparatus and method
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
JP4435490B2 (ja) * 2003-02-19 2010-03-17 株式会社東芝 携帯無線通信装置及び接続部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101453328B1 (ko) * 2012-01-02 2014-10-21 박병규 반도체 패키지 및 반도체 패키지 방법
KR20160119566A (ko) * 2015-04-06 2016-10-14 주식회사 아이이에스 전자장치의 제조 방법

Also Published As

Publication number Publication date
WO2006110634A3 (en) 2007-07-12
CN101194540A (zh) 2008-06-04
JP2008537338A (ja) 2008-09-11
WO2006110634A2 (en) 2006-10-19
US20080171182A1 (en) 2008-07-17
US7888604B2 (en) 2011-02-15
EP1875787A2 (en) 2008-01-09
CN101194540B (zh) 2010-06-16

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